Report Detail

Request for Sample of this report

Machinery & Equipment Global Wafer Thinning Equipment Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

  • RnM4622292
    • |
  • 20 August, 2025
    • |
  • Global
    • |
  • 115 Pages
    • |
  • GIR
    • |
  • Machinery & Equipment

According to our (Global Info Research) latest study, the global Wafer Thinning Equipment market size was valued at US$ 982 million in 2024 and is forecast to a readjusted size of USD 1505 million by 2031 with a CAGR of 6.4% during review period.
Wafer Thinning Equipment is a device used in the semiconductor manufacturing process to process silicon wafers into thinner thicknesses. During the wafer manufacturing process, wafers usually need to be thinned to meet specific requirements and application scenarios. Wafer thinning equipment usually includes mechanical grinding, chemical mechanical polishing (CMP), and laser stripping technologies. These devices can accurately control the thickness of the wafer to meet different chip manufacturing needs, such as improving performance, reducing size, and reducing costs. These devices play a vital role in the semiconductor industry and have a direct impact on the final performance and quality of the chip.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
This report is a detailed and comprehensive analysis for global Wafer Thinning Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Wafer Thinning Equipment market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global Wafer Thinning Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global Wafer Thinning Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global Wafer Thinning Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K US$/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Wafer Thinning Equipment
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Wafer Thinning Equipment market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, WAIDA MFG, Shenzhen Fangda, Hunan Yujing Machine Industrial, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Wafer Thinning Equipment market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Fully Automatic
Semi-automatic
Market segment by Application
200mm Wafer
300mm Wafer
Others
Major players covered
Disco
TOKYO SEIMITSU
G&N
Okamoto Semiconductor Equipment Division
CETC
Koyo Machinery
Revasum
WAIDA MFG
Shenzhen Fangda
Hunan Yujing Machine Industrial
SpeedFam
Hwatsing Technology Co.,Ltd.
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Wafer Thinning Equipment product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Wafer Thinning Equipment, with price, sales quantity, revenue, and global market share of Wafer Thinning Equipment from 2020 to 2025.
Chapter 3, the Wafer Thinning Equipment competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Wafer Thinning Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Wafer Thinning Equipment market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Wafer Thinning Equipment.
Chapter 14 and 15, to describe Wafer Thinning Equipment sales channel, distributors, customers, research findings and conclusion.


1 Market Overview

  • 1.1 Product Overview and Scope
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Market Analysis by Type
    • 1.3.1 Overview: Global Wafer Thinning Equipment Consumption Value by Type: 2020 Versus 2024 Versus 2031
    • 1.3.2 Fully Automatic
    • 1.3.3 Semi-automatic
  • 1.4 Market Analysis by Application
    • 1.4.1 Overview: Global Wafer Thinning Equipment Consumption Value by Application: 2020 Versus 2024 Versus 2031
    • 1.4.2 200mm Wafer
    • 1.4.3 300mm Wafer
    • 1.4.4 Others
  • 1.5 Global Wafer Thinning Equipment Market Size & Forecast
    • 1.5.1 Global Wafer Thinning Equipment Consumption Value (2020 & 2024 & 2031)
    • 1.5.2 Global Wafer Thinning Equipment Sales Quantity (2020-2031)
    • 1.5.3 Global Wafer Thinning Equipment Average Price (2020-2031)

2 Manufacturers Profiles

  • 2.1 Disco
    • 2.1.1 Disco Details
    • 2.1.2 Disco Major Business
    • 2.1.3 Disco Wafer Thinning Equipment Product and Services
    • 2.1.4 Disco Wafer Thinning Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.1.5 Disco Recent Developments/Updates
  • 2.2 TOKYO SEIMITSU
    • 2.2.1 TOKYO SEIMITSU Details
    • 2.2.2 TOKYO SEIMITSU Major Business
    • 2.2.3 TOKYO SEIMITSU Wafer Thinning Equipment Product and Services
    • 2.2.4 TOKYO SEIMITSU Wafer Thinning Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.2.5 TOKYO SEIMITSU Recent Developments/Updates
  • 2.3 G&N
    • 2.3.1 G&N Details
    • 2.3.2 G&N Major Business
    • 2.3.3 G&N Wafer Thinning Equipment Product and Services
    • 2.3.4 G&N Wafer Thinning Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.3.5 G&N Recent Developments/Updates
  • 2.4 Okamoto Semiconductor Equipment Division
    • 2.4.1 Okamoto Semiconductor Equipment Division Details
    • 2.4.2 Okamoto Semiconductor Equipment Division Major Business
    • 2.4.3 Okamoto Semiconductor Equipment Division Wafer Thinning Equipment Product and Services
    • 2.4.4 Okamoto Semiconductor Equipment Division Wafer Thinning Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.4.5 Okamoto Semiconductor Equipment Division Recent Developments/Updates
  • 2.5 CETC
    • 2.5.1 CETC Details
    • 2.5.2 CETC Major Business
    • 2.5.3 CETC Wafer Thinning Equipment Product and Services
    • 2.5.4 CETC Wafer Thinning Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.5.5 CETC Recent Developments/Updates
  • 2.6 Koyo Machinery
    • 2.6.1 Koyo Machinery Details
    • 2.6.2 Koyo Machinery Major Business
    • 2.6.3 Koyo Machinery Wafer Thinning Equipment Product and Services
    • 2.6.4 Koyo Machinery Wafer Thinning Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.6.5 Koyo Machinery Recent Developments/Updates
  • 2.7 Revasum
    • 2.7.1 Revasum Details
    • 2.7.2 Revasum Major Business
    • 2.7.3 Revasum Wafer Thinning Equipment Product and Services
    • 2.7.4 Revasum Wafer Thinning Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.7.5 Revasum Recent Developments/Updates
  • 2.8 WAIDA MFG
    • 2.8.1 WAIDA MFG Details
    • 2.8.2 WAIDA MFG Major Business
    • 2.8.3 WAIDA MFG Wafer Thinning Equipment Product and Services
    • 2.8.4 WAIDA MFG Wafer Thinning Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.8.5 WAIDA MFG Recent Developments/Updates
  • 2.9 Shenzhen Fangda
    • 2.9.1 Shenzhen Fangda Details
    • 2.9.2 Shenzhen Fangda Major Business
    • 2.9.3 Shenzhen Fangda Wafer Thinning Equipment Product and Services
    • 2.9.4 Shenzhen Fangda Wafer Thinning Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.9.5 Shenzhen Fangda Recent Developments/Updates
  • 2.10 Hunan Yujing Machine Industrial
    • 2.10.1 Hunan Yujing Machine Industrial Details
    • 2.10.2 Hunan Yujing Machine Industrial Major Business
    • 2.10.3 Hunan Yujing Machine Industrial Wafer Thinning Equipment Product and Services
    • 2.10.4 Hunan Yujing Machine Industrial Wafer Thinning Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.10.5 Hunan Yujing Machine Industrial Recent Developments/Updates
  • 2.11 SpeedFam
    • 2.11.1 SpeedFam Details
    • 2.11.2 SpeedFam Major Business
    • 2.11.3 SpeedFam Wafer Thinning Equipment Product and Services
    • 2.11.4 SpeedFam Wafer Thinning Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.11.5 SpeedFam Recent Developments/Updates
  • 2.12 Hwatsing Technology Co.,Ltd.
    • 2.12.1 Hwatsing Technology Co.,Ltd. Details
    • 2.12.2 Hwatsing Technology Co.,Ltd. Major Business
    • 2.12.3 Hwatsing Technology Co.,Ltd. Wafer Thinning Equipment Product and Services
    • 2.12.4 Hwatsing Technology Co.,Ltd. Wafer Thinning Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.12.5 Hwatsing Technology Co.,Ltd. Recent Developments/Updates

3 Competitive Environment: Wafer Thinning Equipment by Manufacturer

  • 3.1 Global Wafer Thinning Equipment Sales Quantity by Manufacturer (2020-2025)
  • 3.2 Global Wafer Thinning Equipment Revenue by Manufacturer (2020-2025)
  • 3.3 Global Wafer Thinning Equipment Average Price by Manufacturer (2020-2025)
  • 3.4 Market Share Analysis (2024)
    • 3.4.1 Producer Shipments of Wafer Thinning Equipment by Manufacturer Revenue ($MM) and Market Share (%): 2024
    • 3.4.2 Top 3 Wafer Thinning Equipment Manufacturer Market Share in 2024
    • 3.4.3 Top 6 Wafer Thinning Equipment Manufacturer Market Share in 2024
  • 3.5 Wafer Thinning Equipment Market: Overall Company Footprint Analysis
    • 3.5.1 Wafer Thinning Equipment Market: Region Footprint
    • 3.5.2 Wafer Thinning Equipment Market: Company Product Type Footprint
    • 3.5.3 Wafer Thinning Equipment Market: Company Product Application Footprint
  • 3.6 New Market Entrants and Barriers to Market Entry
  • 3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

  • 4.1 Global Wafer Thinning Equipment Market Size by Region
    • 4.1.1 Global Wafer Thinning Equipment Sales Quantity by Region (2020-2031)
    • 4.1.2 Global Wafer Thinning Equipment Consumption Value by Region (2020-2031)
    • 4.1.3 Global Wafer Thinning Equipment Average Price by Region (2020-2031)
  • 4.2 North America Wafer Thinning Equipment Consumption Value (2020-2031)
  • 4.3 Europe Wafer Thinning Equipment Consumption Value (2020-2031)
  • 4.4 Asia-Pacific Wafer Thinning Equipment Consumption Value (2020-2031)
  • 4.5 South America Wafer Thinning Equipment Consumption Value (2020-2031)
  • 4.6 Middle East & Africa Wafer Thinning Equipment Consumption Value (2020-2031)

5 Market Segment by Type

  • 5.1 Global Wafer Thinning Equipment Sales Quantity by Type (2020-2031)
  • 5.2 Global Wafer Thinning Equipment Consumption Value by Type (2020-2031)
  • 5.3 Global Wafer Thinning Equipment Average Price by Type (2020-2031)

6 Market Segment by Application

  • 6.1 Global Wafer Thinning Equipment Sales Quantity by Application (2020-2031)
  • 6.2 Global Wafer Thinning Equipment Consumption Value by Application (2020-2031)
  • 6.3 Global Wafer Thinning Equipment Average Price by Application (2020-2031)

7 North America

  • 7.1 North America Wafer Thinning Equipment Sales Quantity by Type (2020-2031)
  • 7.2 North America Wafer Thinning Equipment Sales Quantity by Application (2020-2031)
  • 7.3 North America Wafer Thinning Equipment Market Size by Country
    • 7.3.1 North America Wafer Thinning Equipment Sales Quantity by Country (2020-2031)
    • 7.3.2 North America Wafer Thinning Equipment Consumption Value by Country (2020-2031)
    • 7.3.3 United States Market Size and Forecast (2020-2031)
    • 7.3.4 Canada Market Size and Forecast (2020-2031)
    • 7.3.5 Mexico Market Size and Forecast (2020-2031)

8 Europe

  • 8.1 Europe Wafer Thinning Equipment Sales Quantity by Type (2020-2031)
  • 8.2 Europe Wafer Thinning Equipment Sales Quantity by Application (2020-2031)
  • 8.3 Europe Wafer Thinning Equipment Market Size by Country
    • 8.3.1 Europe Wafer Thinning Equipment Sales Quantity by Country (2020-2031)
    • 8.3.2 Europe Wafer Thinning Equipment Consumption Value by Country (2020-2031)
    • 8.3.3 Germany Market Size and Forecast (2020-2031)
    • 8.3.4 France Market Size and Forecast (2020-2031)
    • 8.3.5 United Kingdom Market Size and Forecast (2020-2031)
    • 8.3.6 Russia Market Size and Forecast (2020-2031)
    • 8.3.7 Italy Market Size and Forecast (2020-2031)

9 Asia-Pacific

  • 9.1 Asia-Pacific Wafer Thinning Equipment Sales Quantity by Type (2020-2031)
  • 9.2 Asia-Pacific Wafer Thinning Equipment Sales Quantity by Application (2020-2031)
  • 9.3 Asia-Pacific Wafer Thinning Equipment Market Size by Region
    • 9.3.1 Asia-Pacific Wafer Thinning Equipment Sales Quantity by Region (2020-2031)
    • 9.3.2 Asia-Pacific Wafer Thinning Equipment Consumption Value by Region (2020-2031)
    • 9.3.3 China Market Size and Forecast (2020-2031)
    • 9.3.4 Japan Market Size and Forecast (2020-2031)
    • 9.3.5 South Korea Market Size and Forecast (2020-2031)
    • 9.3.6 India Market Size and Forecast (2020-2031)
    • 9.3.7 Southeast Asia Market Size and Forecast (2020-2031)
    • 9.3.8 Australia Market Size and Forecast (2020-2031)

10 South America

  • 10.1 South America Wafer Thinning Equipment Sales Quantity by Type (2020-2031)
  • 10.2 South America Wafer Thinning Equipment Sales Quantity by Application (2020-2031)
  • 10.3 South America Wafer Thinning Equipment Market Size by Country
    • 10.3.1 South America Wafer Thinning Equipment Sales Quantity by Country (2020-2031)
    • 10.3.2 South America Wafer Thinning Equipment Consumption Value by Country (2020-2031)
    • 10.3.3 Brazil Market Size and Forecast (2020-2031)
    • 10.3.4 Argentina Market Size and Forecast (2020-2031)

11 Middle East & Africa

  • 11.1 Middle East & Africa Wafer Thinning Equipment Sales Quantity by Type (2020-2031)
  • 11.2 Middle East & Africa Wafer Thinning Equipment Sales Quantity by Application (2020-2031)
  • 11.3 Middle East & Africa Wafer Thinning Equipment Market Size by Country
    • 11.3.1 Middle East & Africa Wafer Thinning Equipment Sales Quantity by Country (2020-2031)
    • 11.3.2 Middle East & Africa Wafer Thinning Equipment Consumption Value by Country (2020-2031)
    • 11.3.3 Turkey Market Size and Forecast (2020-2031)
    • 11.3.4 Egypt Market Size and Forecast (2020-2031)
    • 11.3.5 Saudi Arabia Market Size and Forecast (2020-2031)
    • 11.3.6 South Africa Market Size and Forecast (2020-2031)

12 Market Dynamics

  • 12.1 Wafer Thinning Equipment Market Drivers
  • 12.2 Wafer Thinning Equipment Market Restraints
  • 12.3 Wafer Thinning Equipment Trends Analysis
  • 12.4 Porters Five Forces Analysis
    • 12.4.1 Threat of New Entrants
    • 12.4.2 Bargaining Power of Suppliers
    • 12.4.3 Bargaining Power of Buyers
    • 12.4.4 Threat of Substitutes
    • 12.4.5 Competitive Rivalry

13 Raw Material and Industry Chain

  • 13.1 Raw Material of Wafer Thinning Equipment and Key Manufacturers
  • 13.2 Manufacturing Costs Percentage of Wafer Thinning Equipment
  • 13.3 Wafer Thinning Equipment Production Process
  • 13.4 Industry Value Chain Analysis

14 Shipments by Distribution Channel

  • 14.1 Sales Channel
    • 14.1.1 Direct to End-User
    • 14.1.2 Distributors
  • 14.2 Wafer Thinning Equipment Typical Distributors
  • 14.3 Wafer Thinning Equipment Typical Customers

15 Research Findings and Conclusion

    16 Appendix

    • 16.1 Methodology
    • 16.2 Research Process and Data Source

    Summary:
    Get latest Market Research Reports on Wafer Thinning Equipment. Industry analysis & Market Report on Wafer Thinning Equipment is a syndicated market report, published as Global Wafer Thinning Equipment Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031. It is complete Research Study and Industry Analysis of Wafer Thinning Equipment market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.

    Last updated on

    REPORT YOU MIGHT BE INTERESTED

    Purchase this Report

    		$3,480.00
    		$5,220.00
    		$6,960.00
    		2,690.04
    		4,035.06
    		5,380.08
    		3,239.88
    		4,859.82
    		6,479.76
    		531,361.20
    		797,041.80
    		1,062,722.40
    		293,712.00
    		440,568.00
    		587,424.00
    Credit card Logo
    Sample Question Discount Download PDF

    Related Reports

    Reason to Buy

    • Trusted By Leaders

      Top executives from leading companies purchase research reports from us. 

    • Shop With Confidence

      We assist you with all the pre-sales enquiries related to any report so that you can buy with confidence.

    • Customer Centric

      Need assistance related to your research requirements? We are just a phone call or an email away.

    • Personalized Solutions

      Our experienced research specialists are here to help you locate the right reports for your need.

    • Secure Checkout

      Shop without being worried about safety & security of your transactions.
      •

    Request for Sample of this report

    Reports and Markets

    mcafree

    Contact Us

    +1-352-353-0818 (US)

    info@reportsandmarkets.com

    Support

    EMAIL US

    Newsletter

    KEEP UP TO DATE ON ALL THE LATEST REPORTS


    maxmind_logo