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Machinery & Equipment Global Wafer Thinning Equipment Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

  • RnM4622292
    • |
  • 26 September, 2025
    • |
  • Global
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  • 112 Pages
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  • GIR
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  • Machinery & Equipment

According to our (Global Info Research) latest study, the global Wafer Thinning Equipment market size was valued at US$ 1072 million in 2024 and is forecast to a readjusted size of USD 1732 million by 2031 with a CAGR of 6.9% during review period.
Wafer Thinning Equipment is a device used in the semiconductor manufacturing process to process silicon wafers into thinner thicknesses. During the wafer manufacturing process, wafers usually need to be thinned to meet specific requirements and application scenarios. These devices can accurately control the thickness of the wafer to meet different chip manufacturing needs, such as improving performance, reducing size, and reducing costs. These devices play a vital role in the semiconductor industry and have a direct impact on the final performance and quality of the chip.
The Wafer Thinning Equipments market, primarily driven by the increasing demand for precision and efficiency in semiconductor manufacturing, is growing rapidly across the globe. Wafer Thinning Equipments are integral in wafer thinning processes, where the primary applications include the processing of 200mm and 300mm wafers. Among the various types of Wafer Thinning Equipments, the fully automatic Wafer Thinning Equipments dominate the market, they have higher automation levels, allowing for increased efficiency and precision, accounting for approximately 52% of the global market share. The most significant application market is for 300mm wafers, which accounts for 83% of the global demand, primarily driven by the advanced semiconductor manufacturing processes that require thinner wafers with high precision. Geographically, the Asia-Pacific (APAC) region holds the largest consumption share, accounting for about 78% of the global market, driven by the robust semiconductor manufacturing ecosystem in countries like China, Japan, South Korea, and Taiwan.
Manufacturers, like Disco, TOKYO SEIMITSU, Okamoto Semiconductor Equipment Division, CETC, G&N, etc. are well-known for the wonderful performance of their Wafer Thinning Equipment and related services. The top five players account for about 90% of the revenue market in 2024.
Opportunities in the Wafer Thinning Equipment Market:
Several opportunities exist for companies involved in the Wafer Thinning Equipment market:
Expansion of Semiconductor Manufacturing in APAC: The APAC region remains the largest consumer of wafer grinding equipment, and with countries like China, Japan, South Korea, and Taiwan increasing their semiconductor manufacturing capabilities, this trend is expected to continue. The demand for Wafer Thinning Equipments in this region will remain high, offering significant growth opportunities for suppliers.
Advancements in Wafer Grinding Technologies: Technological advancements in wafer grinding equipment, such as the integration of artificial intelligence (AI) for predictive maintenance or process optimization, will create new opportunities in the market. Manufacturers who can innovate to improve the efficiency, accuracy, and cost-effectiveness of Wafer Thinning Equipments will be well-positioned to capture additional market share.
Rise of Emerging Markets: Emerging markets, particularly in regions like Southeast Asia, Latin America, and the Middle East, are seeing increased semiconductor production. As these regions continue to expand their manufacturing capabilities, the demand for wafer thinning equipment will grow. This provides an opportunity for companies to tap into new and developing markets.
Conclusion:
The Wafer Thinning Equipment market is poised for significant growth, driven by advancements in semiconductor manufacturing, the increasing demand for thinner and more precise wafers, and the rise in 300mm wafer processing. Fully automatic Wafer Thinning Equipments, which dominate the market with a 52% share, will continue to lead the market due to their higher efficiency and precision.
The APAC region remains the largest consumer of Wafer Thinning Equipments, accounting for 78% of the global market. However, despite these strong growth drivers, challenges such as high initial investment costs and technological complexity may pose barriers to market entry for smaller players. Manufacturers will need to innovate and focus on automation, precision, and cost-effective solutions to capitalize on the growing demand for wafer thinning equipment.
In conclusion, the Wafer Thinning Equipment market offers abundant opportunities for companies that can provide high-quality, efficient, and cost-effective wafer grinding solutions, particularly those that address the increasing demand for 300mm wafers and advanced semiconductor manufacturing processes.
This report is a detailed and comprehensive analysis for global Wafer Thinning Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Wafer Thinning Equipment market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global Wafer Thinning Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global Wafer Thinning Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global Wafer Thinning Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K US$/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Wafer Thinning Equipment
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Wafer Thinning Equipment market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, WAIDA MFG, Hunan Yujing Machine Industrial, SpeedFam, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Wafer Thinning Equipment market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Fully Automatic
Semi-automatic
Market segment by Application
200mm Wafer
300mm Wafer
Others
Major players covered
Disco
TOKYO SEIMITSU
G&N
Okamoto Semiconductor Equipment Division
CETC
Koyo Machinery
Revasum
WAIDA MFG
Hunan Yujing Machine Industrial
SpeedFam
TSD
Engis Corporation
NTS
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Wafer Thinning Equipment product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Wafer Thinning Equipment, with price, sales quantity, revenue, and global market share of Wafer Thinning Equipment from 2020 to 2025.
Chapter 3, the Wafer Thinning Equipment competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Wafer Thinning Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Wafer Thinning Equipment market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Wafer Thinning Equipment.
Chapter 14 and 15, to describe Wafer Thinning Equipment sales channel, distributors, customers, research findings and conclusion.


1 Market Overview

  • 1.1 Product Overview and Scope
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Market Analysis by Type
    • 1.3.1 Overview: Global Wafer Thinning Equipment Consumption Value by Type: 2020 Versus 2024 Versus 2031
    • 1.3.2 Fully Automatic
    • 1.3.3 Semi-automatic
  • 1.4 Market Analysis by Application
    • 1.4.1 Overview: Global Wafer Thinning Equipment Consumption Value by Application: 2020 Versus 2024 Versus 2031
    • 1.4.2 200mm Wafer
    • 1.4.3 300mm Wafer
    • 1.4.4 Others
  • 1.5 Global Wafer Thinning Equipment Market Size & Forecast
    • 1.5.1 Global Wafer Thinning Equipment Consumption Value (2020 & 2024 & 2031)
    • 1.5.2 Global Wafer Thinning Equipment Sales Quantity (2020-2031)
    • 1.5.3 Global Wafer Thinning Equipment Average Price (2020-2031)

2 Manufacturers Profiles

  • 2.1 Disco
    • 2.1.1 Disco Details
    • 2.1.2 Disco Major Business
    • 2.1.3 Disco Wafer Thinning Equipment Product and Services
    • 2.1.4 Disco Wafer Thinning Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.1.5 Disco Recent Developments/Updates
  • 2.2 TOKYO SEIMITSU
    • 2.2.1 TOKYO SEIMITSU Details
    • 2.2.2 TOKYO SEIMITSU Major Business
    • 2.2.3 TOKYO SEIMITSU Wafer Thinning Equipment Product and Services
    • 2.2.4 TOKYO SEIMITSU Wafer Thinning Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.2.5 TOKYO SEIMITSU Recent Developments/Updates
  • 2.3 G&N
    • 2.3.1 G&N Details
    • 2.3.2 G&N Major Business
    • 2.3.3 G&N Wafer Thinning Equipment Product and Services
    • 2.3.4 G&N Wafer Thinning Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.3.5 G&N Recent Developments/Updates
  • 2.4 Okamoto Semiconductor Equipment Division
    • 2.4.1 Okamoto Semiconductor Equipment Division Details
    • 2.4.2 Okamoto Semiconductor Equipment Division Major Business
    • 2.4.3 Okamoto Semiconductor Equipment Division Wafer Thinning Equipment Product and Services
    • 2.4.4 Okamoto Semiconductor Equipment Division Wafer Thinning Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.4.5 Okamoto Semiconductor Equipment Division Recent Developments/Updates
  • 2.5 CETC
    • 2.5.1 CETC Details
    • 2.5.2 CETC Major Business
    • 2.5.3 CETC Wafer Thinning Equipment Product and Services
    • 2.5.4 CETC Wafer Thinning Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.5.5 CETC Recent Developments/Updates
  • 2.6 Koyo Machinery
    • 2.6.1 Koyo Machinery Details
    • 2.6.2 Koyo Machinery Major Business
    • 2.6.3 Koyo Machinery Wafer Thinning Equipment Product and Services
    • 2.6.4 Koyo Machinery Wafer Thinning Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.6.5 Koyo Machinery Recent Developments/Updates
  • 2.7 Revasum
    • 2.7.1 Revasum Details
    • 2.7.2 Revasum Major Business
    • 2.7.3 Revasum Wafer Thinning Equipment Product and Services
    • 2.7.4 Revasum Wafer Thinning Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.7.5 Revasum Recent Developments/Updates
  • 2.8 WAIDA MFG
    • 2.8.1 WAIDA MFG Details
    • 2.8.2 WAIDA MFG Major Business
    • 2.8.3 WAIDA MFG Wafer Thinning Equipment Product and Services
    • 2.8.4 WAIDA MFG Wafer Thinning Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.8.5 WAIDA MFG Recent Developments/Updates
  • 2.9 Hunan Yujing Machine Industrial
    • 2.9.1 Hunan Yujing Machine Industrial Details
    • 2.9.2 Hunan Yujing Machine Industrial Major Business
    • 2.9.3 Hunan Yujing Machine Industrial Wafer Thinning Equipment Product and Services
    • 2.9.4 Hunan Yujing Machine Industrial Wafer Thinning Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.9.5 Hunan Yujing Machine Industrial Recent Developments/Updates
  • 2.10 SpeedFam
    • 2.10.1 SpeedFam Details
    • 2.10.2 SpeedFam Major Business
    • 2.10.3 SpeedFam Wafer Thinning Equipment Product and Services
    • 2.10.4 SpeedFam Wafer Thinning Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.10.5 SpeedFam Recent Developments/Updates
  • 2.11 TSD
    • 2.11.1 TSD Details
    • 2.11.2 TSD Major Business
    • 2.11.3 TSD Wafer Thinning Equipment Product and Services
    • 2.11.4 TSD Wafer Thinning Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.11.5 TSD Recent Developments/Updates
  • 2.12 Engis Corporation
    • 2.12.1 Engis Corporation Details
    • 2.12.2 Engis Corporation Major Business
    • 2.12.3 Engis Corporation Wafer Thinning Equipment Product and Services
    • 2.12.4 Engis Corporation Wafer Thinning Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.12.5 Engis Corporation Recent Developments/Updates
  • 2.13 NTS
    • 2.13.1 NTS Details
    • 2.13.2 NTS Major Business
    • 2.13.3 NTS Wafer Thinning Equipment Product and Services
    • 2.13.4 NTS Wafer Thinning Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.13.5 NTS Recent Developments/Updates

3 Competitive Environment: Wafer Thinning Equipment by Manufacturer

  • 3.1 Global Wafer Thinning Equipment Sales Quantity by Manufacturer (2020-2025)
  • 3.2 Global Wafer Thinning Equipment Revenue by Manufacturer (2020-2025)
  • 3.3 Global Wafer Thinning Equipment Average Price by Manufacturer (2020-2025)
  • 3.4 Market Share Analysis (2024)
    • 3.4.1 Producer Shipments of Wafer Thinning Equipment by Manufacturer Revenue ($MM) and Market Share (%): 2024
    • 3.4.2 Top 3 Wafer Thinning Equipment Manufacturer Market Share in 2024
    • 3.4.3 Top 6 Wafer Thinning Equipment Manufacturer Market Share in 2024
  • 3.5 Wafer Thinning Equipment Market: Overall Company Footprint Analysis
    • 3.5.1 Wafer Thinning Equipment Market: Region Footprint
    • 3.5.2 Wafer Thinning Equipment Market: Company Product Type Footprint
    • 3.5.3 Wafer Thinning Equipment Market: Company Product Application Footprint
  • 3.6 New Market Entrants and Barriers to Market Entry
  • 3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

  • 4.1 Global Wafer Thinning Equipment Market Size by Region
    • 4.1.1 Global Wafer Thinning Equipment Sales Quantity by Region (2020-2031)
    • 4.1.2 Global Wafer Thinning Equipment Consumption Value by Region (2020-2031)
    • 4.1.3 Global Wafer Thinning Equipment Average Price by Region (2020-2031)
  • 4.2 North America Wafer Thinning Equipment Consumption Value (2020-2031)
  • 4.3 Europe Wafer Thinning Equipment Consumption Value (2020-2031)
  • 4.4 Asia-Pacific Wafer Thinning Equipment Consumption Value (2020-2031)
  • 4.5 South America Wafer Thinning Equipment Consumption Value (2020-2031)
  • 4.6 Middle East & Africa Wafer Thinning Equipment Consumption Value (2020-2031)

5 Market Segment by Type

  • 5.1 Global Wafer Thinning Equipment Sales Quantity by Type (2020-2031)
  • 5.2 Global Wafer Thinning Equipment Consumption Value by Type (2020-2031)
  • 5.3 Global Wafer Thinning Equipment Average Price by Type (2020-2031)

6 Market Segment by Application

  • 6.1 Global Wafer Thinning Equipment Sales Quantity by Application (2020-2031)
  • 6.2 Global Wafer Thinning Equipment Consumption Value by Application (2020-2031)
  • 6.3 Global Wafer Thinning Equipment Average Price by Application (2020-2031)

7 North America

  • 7.1 North America Wafer Thinning Equipment Sales Quantity by Type (2020-2031)
  • 7.2 North America Wafer Thinning Equipment Sales Quantity by Application (2020-2031)
  • 7.3 North America Wafer Thinning Equipment Market Size by Country
    • 7.3.1 North America Wafer Thinning Equipment Sales Quantity by Country (2020-2031)
    • 7.3.2 North America Wafer Thinning Equipment Consumption Value by Country (2020-2031)
    • 7.3.3 United States Market Size and Forecast (2020-2031)
    • 7.3.4 Canada Market Size and Forecast (2020-2031)
    • 7.3.5 Mexico Market Size and Forecast (2020-2031)

8 Europe

  • 8.1 Europe Wafer Thinning Equipment Sales Quantity by Type (2020-2031)
  • 8.2 Europe Wafer Thinning Equipment Sales Quantity by Application (2020-2031)
  • 8.3 Europe Wafer Thinning Equipment Market Size by Country
    • 8.3.1 Europe Wafer Thinning Equipment Sales Quantity by Country (2020-2031)
    • 8.3.2 Europe Wafer Thinning Equipment Consumption Value by Country (2020-2031)
    • 8.3.3 Germany Market Size and Forecast (2020-2031)
    • 8.3.4 France Market Size and Forecast (2020-2031)
    • 8.3.5 United Kingdom Market Size and Forecast (2020-2031)
    • 8.3.6 Russia Market Size and Forecast (2020-2031)
    • 8.3.7 Italy Market Size and Forecast (2020-2031)

9 Asia-Pacific

  • 9.1 Asia-Pacific Wafer Thinning Equipment Sales Quantity by Type (2020-2031)
  • 9.2 Asia-Pacific Wafer Thinning Equipment Sales Quantity by Application (2020-2031)
  • 9.3 Asia-Pacific Wafer Thinning Equipment Market Size by Region
    • 9.3.1 Asia-Pacific Wafer Thinning Equipment Sales Quantity by Region (2020-2031)
    • 9.3.2 Asia-Pacific Wafer Thinning Equipment Consumption Value by Region (2020-2031)
    • 9.3.3 China Market Size and Forecast (2020-2031)
    • 9.3.4 Japan Market Size and Forecast (2020-2031)
    • 9.3.5 South Korea Market Size and Forecast (2020-2031)
    • 9.3.6 India Market Size and Forecast (2020-2031)
    • 9.3.7 Southeast Asia Market Size and Forecast (2020-2031)
    • 9.3.8 Australia Market Size and Forecast (2020-2031)

10 South America

  • 10.1 South America Wafer Thinning Equipment Sales Quantity by Type (2020-2031)
  • 10.2 South America Wafer Thinning Equipment Sales Quantity by Application (2020-2031)
  • 10.3 South America Wafer Thinning Equipment Market Size by Country
    • 10.3.1 South America Wafer Thinning Equipment Sales Quantity by Country (2020-2031)
    • 10.3.2 South America Wafer Thinning Equipment Consumption Value by Country (2020-2031)
    • 10.3.3 Brazil Market Size and Forecast (2020-2031)
    • 10.3.4 Argentina Market Size and Forecast (2020-2031)

11 Middle East & Africa

  • 11.1 Middle East & Africa Wafer Thinning Equipment Sales Quantity by Type (2020-2031)
  • 11.2 Middle East & Africa Wafer Thinning Equipment Sales Quantity by Application (2020-2031)
  • 11.3 Middle East & Africa Wafer Thinning Equipment Market Size by Country
    • 11.3.1 Middle East & Africa Wafer Thinning Equipment Sales Quantity by Country (2020-2031)
    • 11.3.2 Middle East & Africa Wafer Thinning Equipment Consumption Value by Country (2020-2031)
    • 11.3.3 Turkey Market Size and Forecast (2020-2031)
    • 11.3.4 Egypt Market Size and Forecast (2020-2031)
    • 11.3.5 Saudi Arabia Market Size and Forecast (2020-2031)
    • 11.3.6 South Africa Market Size and Forecast (2020-2031)

12 Market Dynamics

  • 12.1 Wafer Thinning Equipment Market Drivers
  • 12.2 Wafer Thinning Equipment Market Restraints
  • 12.3 Wafer Thinning Equipment Trends Analysis
  • 12.4 Porters Five Forces Analysis
    • 12.4.1 Threat of New Entrants
    • 12.4.2 Bargaining Power of Suppliers
    • 12.4.3 Bargaining Power of Buyers
    • 12.4.4 Threat of Substitutes
    • 12.4.5 Competitive Rivalry

13 Raw Material and Industry Chain

  • 13.1 Raw Material of Wafer Thinning Equipment and Key Manufacturers
  • 13.2 Manufacturing Costs Percentage of Wafer Thinning Equipment
  • 13.3 Wafer Thinning Equipment Production Process
  • 13.4 Industry Value Chain Analysis

14 Shipments by Distribution Channel

  • 14.1 Sales Channel
    • 14.1.1 Direct to End-User
    • 14.1.2 Distributors
  • 14.2 Wafer Thinning Equipment Typical Distributors
  • 14.3 Wafer Thinning Equipment Typical Customers

15 Research Findings and Conclusion

    16 Appendix

    • 16.1 Methodology
    • 16.2 Research Process and Data Source

    Summary:
    Get latest Market Research Reports on Wafer Thinning Equipment. Industry analysis & Market Report on Wafer Thinning Equipment is a syndicated market report, published as Global Wafer Thinning Equipment Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031. It is complete Research Study and Industry Analysis of Wafer Thinning Equipment market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.

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