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Machinery & Equipment Global Wafer Grinder (Wafer Thinning Equipment) Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029

  • RnM4529954
    • |
  • 15 October, 2023
    • |
  • Global
    • |
  • 105 Pages
    • |
  • GIR (Global Info Research)
    • |
  • Machinery & Equipment

According to our (Global Info Research) latest study, the global Wafer Grinder (Wafer Thinning Equipment) market size was valued at USD 840.7 million in 2022 and is forecast to a readjusted size of USD 1282.6 million by 2029 with a CAGR of 6.2% during review period.
In the China market, Wafer Thinning Equipment core players include Disco, Tokyo Precision, G&N and others. The top two players in the industry account for about 80% of the market share. The product can be classified into fully automatic ones and semi-automatic ones according to the level of automation. The product is widely used in the production of various sizes of wafer tubes.
The Global Info Research report includes an overview of the development of the Wafer Grinder (Wafer Thinning Equipment) industry chain, the market status of 200mm Wafer (Fully Automatic, Semi-Automatic), 300mm Wafer (Fully Automatic, Semi-Automatic), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Wafer Grinder (Wafer Thinning Equipment).
Regionally, the report analyzes the Wafer Grinder (Wafer Thinning Equipment) markets in key regions. North America and Europe are experiencing steady growth, driven by government initiatives and increasing consumer awareness. Asia-Pacific, particularly China, leads the global Wafer Grinder (Wafer Thinning Equipment) market, with robust domestic demand, supportive policies, and a strong manufacturing base.
Key Features:
The report presents comprehensive understanding of the Wafer Grinder (Wafer Thinning Equipment) market. It provides a holistic view of the industry, as well as detailed insights into individual components and stakeholders. The report analysis market dynamics, trends, challenges, and opportunities within the Wafer Grinder (Wafer Thinning Equipment) industry.
The report involves analyzing the market at a macro level:
Market Sizing and Segmentation: Report collect data on the overall market size, including the sales quantity (Units), revenue generated, and market share of different by Level of Automation (e.g., Fully Automatic, Semi-Automatic).
Industry Analysis: Report analyse the broader industry trends, such as government policies and regulations, technological advancements, consumer preferences, and market dynamics. This analysis helps in understanding the key drivers and challenges influencing the Wafer Grinder (Wafer Thinning Equipment) market.
Regional Analysis: The report involves examining the Wafer Grinder (Wafer Thinning Equipment) market at a regional or national level. Report analyses regional factors such as government incentives, infrastructure development, economic conditions, and consumer behaviour to identify variations and opportunities within different markets.
Market Projections: Report covers the gathered data and analysis to make future projections and forecasts for the Wafer Grinder (Wafer Thinning Equipment) market. This may include estimating market growth rates, predicting market demand, and identifying emerging trends.
The report also involves a more granular approach to Wafer Grinder (Wafer Thinning Equipment):
Company Analysis: Report covers individual Wafer Grinder (Wafer Thinning Equipment) manufacturers, suppliers, and other relevant industry players. This analysis includes studying their financial performance, market positioning, product portfolios, partnerships, and strategies.
Consumer Analysis: Report covers data on consumer behaviour, preferences, and attitudes towards Wafer Grinder (Wafer Thinning Equipment) This may involve surveys, interviews, and analysis of consumer reviews and feedback from different by Application (200mm Wafer, 300mm Wafer).
Technology Analysis: Report covers specific technologies relevant to Wafer Grinder (Wafer Thinning Equipment). It assesses the current state, advancements, and potential future developments in Wafer Grinder (Wafer Thinning Equipment) areas.
Competitive Landscape: By analyzing individual companies, suppliers, and consumers, the report present insights into the competitive landscape of the Wafer Grinder (Wafer Thinning Equipment) market. This analysis helps understand market share, competitive advantages, and potential areas for differentiation among industry players.
Market Validation: The report involves validating findings and projections through primary research, such as surveys, interviews, and focus groups.
Market Segmentation
Wafer Grinder (Wafer Thinning Equipment) market is split by Level of Automation and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Level of Automation, and by Application in terms of volume and value.
Market segment by Level of Automation
Fully Automatic
Semi-Automatic
Market segment by Application
200mm Wafer
300mm Wafer
Others
Major players covered
Disco
TOKYO SEIMITSU
G&N
Okamoto Semiconductor Equipment Division
CETC
Koyo Machinery
Revasum
WAIDA MFG
Shenzhen Fangda
Hunan Yujing Machine Industrial
SpeedFam
Hauhaiqingke
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Wafer Grinder (Wafer Thinning Equipment) product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Wafer Grinder (Wafer Thinning Equipment), with price, sales, revenue and global market share of Wafer Grinder (Wafer Thinning Equipment) from 2018 to 2023.
Chapter 3, the Wafer Grinder (Wafer Thinning Equipment) competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Wafer Grinder (Wafer Thinning Equipment) breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2018 to 2029.
Chapter 5 and 6, to segment the sales by Level of Automation and application, with sales market share and growth rate by level of automation, application, from 2018 to 2029.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2022.and Wafer Grinder (Wafer Thinning Equipment) market forecast, by regions, level of automation and application, with sales and revenue, from 2024 to 2029.
Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Wafer Grinder (Wafer Thinning Equipment).
Chapter 14 and 15, to describe Wafer Grinder (Wafer Thinning Equipment) sales channel, distributors, customers, research findings and conclusion.


1 Market Overview

  • 1.1 Product Overview and Scope of Wafer Grinder (Wafer Thinning Equipment)
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Market Analysis by Level of Automation
    • 1.3.1 Overview: Global Wafer Grinder (Wafer Thinning Equipment) Consumption Value by Level of Automation: 2018 Versus 2022 Versus 2029
    • 1.3.2 Fully Automatic
    • 1.3.3 Semi-Automatic
  • 1.4 Market Analysis by Application
    • 1.4.1 Overview: Global Wafer Grinder (Wafer Thinning Equipment) Consumption Value by Application: 2018 Versus 2022 Versus 2029
    • 1.4.2 200mm Wafer
    • 1.4.3 300mm Wafer
    • 1.4.4 Others
  • 1.5 Global Wafer Grinder (Wafer Thinning Equipment) Market Size & Forecast
    • 1.5.1 Global Wafer Grinder (Wafer Thinning Equipment) Consumption Value (2018 & 2022 & 2029)
    • 1.5.2 Global Wafer Grinder (Wafer Thinning Equipment) Sales Quantity (2018-2029)
    • 1.5.3 Global Wafer Grinder (Wafer Thinning Equipment) Average Price (2018-2029)

2 Manufacturers Profiles

  • 2.1 Disco
    • 2.1.1 Disco Details
    • 2.1.2 Disco Major Business
    • 2.1.3 Disco Wafer Grinder (Wafer Thinning Equipment) Product and Services
    • 2.1.4 Disco Wafer Grinder (Wafer Thinning Equipment) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.1.5 Disco Recent Developments/Updates
  • 2.2 TOKYO SEIMITSU
    • 2.2.1 TOKYO SEIMITSU Details
    • 2.2.2 TOKYO SEIMITSU Major Business
    • 2.2.3 TOKYO SEIMITSU Wafer Grinder (Wafer Thinning Equipment) Product and Services
    • 2.2.4 TOKYO SEIMITSU Wafer Grinder (Wafer Thinning Equipment) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.2.5 TOKYO SEIMITSU Recent Developments/Updates
  • 2.3 G&N
    • 2.3.1 G&N Details
    • 2.3.2 G&N Major Business
    • 2.3.3 G&N Wafer Grinder (Wafer Thinning Equipment) Product and Services
    • 2.3.4 G&N Wafer Grinder (Wafer Thinning Equipment) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.3.5 G&N Recent Developments/Updates
  • 2.4 Okamoto Semiconductor Equipment Division
    • 2.4.1 Okamoto Semiconductor Equipment Division Details
    • 2.4.2 Okamoto Semiconductor Equipment Division Major Business
    • 2.4.3 Okamoto Semiconductor Equipment Division Wafer Grinder (Wafer Thinning Equipment) Product and Services
    • 2.4.4 Okamoto Semiconductor Equipment Division Wafer Grinder (Wafer Thinning Equipment) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.4.5 Okamoto Semiconductor Equipment Division Recent Developments/Updates
  • 2.5 CETC
    • 2.5.1 CETC Details
    • 2.5.2 CETC Major Business
    • 2.5.3 CETC Wafer Grinder (Wafer Thinning Equipment) Product and Services
    • 2.5.4 CETC Wafer Grinder (Wafer Thinning Equipment) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.5.5 CETC Recent Developments/Updates
  • 2.6 Koyo Machinery
    • 2.6.1 Koyo Machinery Details
    • 2.6.2 Koyo Machinery Major Business
    • 2.6.3 Koyo Machinery Wafer Grinder (Wafer Thinning Equipment) Product and Services
    • 2.6.4 Koyo Machinery Wafer Grinder (Wafer Thinning Equipment) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.6.5 Koyo Machinery Recent Developments/Updates
  • 2.7 Revasum
    • 2.7.1 Revasum Details
    • 2.7.2 Revasum Major Business
    • 2.7.3 Revasum Wafer Grinder (Wafer Thinning Equipment) Product and Services
    • 2.7.4 Revasum Wafer Grinder (Wafer Thinning Equipment) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.7.5 Revasum Recent Developments/Updates
  • 2.8 WAIDA MFG
    • 2.8.1 WAIDA MFG Details
    • 2.8.2 WAIDA MFG Major Business
    • 2.8.3 WAIDA MFG Wafer Grinder (Wafer Thinning Equipment) Product and Services
    • 2.8.4 WAIDA MFG Wafer Grinder (Wafer Thinning Equipment) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.8.5 WAIDA MFG Recent Developments/Updates
  • 2.9 Shenzhen Fangda
    • 2.9.1 Shenzhen Fangda Details
    • 2.9.2 Shenzhen Fangda Major Business
    • 2.9.3 Shenzhen Fangda Wafer Grinder (Wafer Thinning Equipment) Product and Services
    • 2.9.4 Shenzhen Fangda Wafer Grinder (Wafer Thinning Equipment) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.9.5 Shenzhen Fangda Recent Developments/Updates
  • 2.10 Hunan Yujing Machine Industrial
    • 2.10.1 Hunan Yujing Machine Industrial Details
    • 2.10.2 Hunan Yujing Machine Industrial Major Business
    • 2.10.3 Hunan Yujing Machine Industrial Wafer Grinder (Wafer Thinning Equipment) Product and Services
    • 2.10.4 Hunan Yujing Machine Industrial Wafer Grinder (Wafer Thinning Equipment) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.10.5 Hunan Yujing Machine Industrial Recent Developments/Updates
  • 2.11 SpeedFam
    • 2.11.1 SpeedFam Details
    • 2.11.2 SpeedFam Major Business
    • 2.11.3 SpeedFam Wafer Grinder (Wafer Thinning Equipment) Product and Services
    • 2.11.4 SpeedFam Wafer Grinder (Wafer Thinning Equipment) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.11.5 SpeedFam Recent Developments/Updates
  • 2.12 Hauhaiqingke
    • 2.12.1 Hauhaiqingke Details
    • 2.12.2 Hauhaiqingke Major Business
    • 2.12.3 Hauhaiqingke Wafer Grinder (Wafer Thinning Equipment) Product and Services
    • 2.12.4 Hauhaiqingke Wafer Grinder (Wafer Thinning Equipment) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.12.5 Hauhaiqingke Recent Developments/Updates

3 Competitive Environment: Wafer Grinder (Wafer Thinning Equipment) by Manufacturer

  • 3.1 Global Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Manufacturer (2018-2023)
  • 3.2 Global Wafer Grinder (Wafer Thinning Equipment) Revenue by Manufacturer (2018-2023)
  • 3.3 Global Wafer Grinder (Wafer Thinning Equipment) Average Price by Manufacturer (2018-2023)
  • 3.4 Market Share Analysis (2022)
    • 3.4.1 Producer Shipments of Wafer Grinder (Wafer Thinning Equipment) by Manufacturer Revenue ($MM) and Market Share (%): 2022
    • 3.4.2 Top 3 Wafer Grinder (Wafer Thinning Equipment) Manufacturer Market Share in 2022
    • 3.4.2 Top 6 Wafer Grinder (Wafer Thinning Equipment) Manufacturer Market Share in 2022
  • 3.5 Wafer Grinder (Wafer Thinning Equipment) Market: Overall Company Footprint Analysis
    • 3.5.1 Wafer Grinder (Wafer Thinning Equipment) Market: Region Footprint
    • 3.5.2 Wafer Grinder (Wafer Thinning Equipment) Market: Company Product Type Footprint
    • 3.5.3 Wafer Grinder (Wafer Thinning Equipment) Market: Company Product Application Footprint
  • 3.6 New Market Entrants and Barriers to Market Entry
  • 3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

  • 4.1 Global Wafer Grinder (Wafer Thinning Equipment) Market Size by Region
    • 4.1.1 Global Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Region (2018-2029)
    • 4.1.2 Global Wafer Grinder (Wafer Thinning Equipment) Consumption Value by Region (2018-2029)
    • 4.1.3 Global Wafer Grinder (Wafer Thinning Equipment) Average Price by Region (2018-2029)
  • 4.2 North America Wafer Grinder (Wafer Thinning Equipment) Consumption Value (2018-2029)
  • 4.3 Europe Wafer Grinder (Wafer Thinning Equipment) Consumption Value (2018-2029)
  • 4.4 Asia-Pacific Wafer Grinder (Wafer Thinning Equipment) Consumption Value (2018-2029)
  • 4.5 South America Wafer Grinder (Wafer Thinning Equipment) Consumption Value (2018-2029)
  • 4.6 Middle East and Africa Wafer Grinder (Wafer Thinning Equipment) Consumption Value (2018-2029)

5 Market Segment by Level of Automation

  • 5.1 Global Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Level of Automation (2018-2029)
  • 5.2 Global Wafer Grinder (Wafer Thinning Equipment) Consumption Value by Level of Automation (2018-2029)
  • 5.3 Global Wafer Grinder (Wafer Thinning Equipment) Average Price by Level of Automation (2018-2029)

6 Market Segment by Application

  • 6.1 Global Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Application (2018-2029)
  • 6.2 Global Wafer Grinder (Wafer Thinning Equipment) Consumption Value by Application (2018-2029)
  • 6.3 Global Wafer Grinder (Wafer Thinning Equipment) Average Price by Application (2018-2029)

7 North America

  • 7.1 North America Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Level of Automation (2018-2029)
  • 7.2 North America Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Application (2018-2029)
  • 7.3 North America Wafer Grinder (Wafer Thinning Equipment) Market Size by Country
    • 7.3.1 North America Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Country (2018-2029)
    • 7.3.2 North America Wafer Grinder (Wafer Thinning Equipment) Consumption Value by Country (2018-2029)
    • 7.3.3 United States Market Size and Forecast (2018-2029)
    • 7.3.4 Canada Market Size and Forecast (2018-2029)
    • 7.3.5 Mexico Market Size and Forecast (2018-2029)

8 Europe

  • 8.1 Europe Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Level of Automation (2018-2029)
  • 8.2 Europe Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Application (2018-2029)
  • 8.3 Europe Wafer Grinder (Wafer Thinning Equipment) Market Size by Country
    • 8.3.1 Europe Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Country (2018-2029)
    • 8.3.2 Europe Wafer Grinder (Wafer Thinning Equipment) Consumption Value by Country (2018-2029)
    • 8.3.3 Germany Market Size and Forecast (2018-2029)
    • 8.3.4 France Market Size and Forecast (2018-2029)
    • 8.3.5 United Kingdom Market Size and Forecast (2018-2029)
    • 8.3.6 Russia Market Size and Forecast (2018-2029)
    • 8.3.7 Italy Market Size and Forecast (2018-2029)

9 Asia-Pacific

  • 9.1 Asia-Pacific Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Level of Automation (2018-2029)
  • 9.2 Asia-Pacific Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Application (2018-2029)
  • 9.3 Asia-Pacific Wafer Grinder (Wafer Thinning Equipment) Market Size by Region
    • 9.3.1 Asia-Pacific Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Region (2018-2029)
    • 9.3.2 Asia-Pacific Wafer Grinder (Wafer Thinning Equipment) Consumption Value by Region (2018-2029)
    • 9.3.3 China Market Size and Forecast (2018-2029)
    • 9.3.4 Japan Market Size and Forecast (2018-2029)
    • 9.3.5 Korea Market Size and Forecast (2018-2029)
    • 9.3.6 India Market Size and Forecast (2018-2029)
    • 9.3.7 Southeast Asia Market Size and Forecast (2018-2029)
    • 9.3.8 Australia Market Size and Forecast (2018-2029)

10 South America

  • 10.1 South America Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Level of Automation (2018-2029)
  • 10.2 South America Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Application (2018-2029)
  • 10.3 South America Wafer Grinder (Wafer Thinning Equipment) Market Size by Country
    • 10.3.1 South America Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Country (2018-2029)
    • 10.3.2 South America Wafer Grinder (Wafer Thinning Equipment) Consumption Value by Country (2018-2029)
    • 10.3.3 Brazil Market Size and Forecast (2018-2029)
    • 10.3.4 Argentina Market Size and Forecast (2018-2029)

11 Middle East & Africa

  • 11.1 Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Level of Automation (2018-2029)
  • 11.2 Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Application (2018-2029)
  • 11.3 Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Market Size by Country
    • 11.3.1 Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Sales Quantity by Country (2018-2029)
    • 11.3.2 Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Consumption Value by Country (2018-2029)
    • 11.3.3 Turkey Market Size and Forecast (2018-2029)
    • 11.3.4 Egypt Market Size and Forecast (2018-2029)
    • 11.3.5 Saudi Arabia Market Size and Forecast (2018-2029)
    • 11.3.6 South Africa Market Size and Forecast (2018-2029)

12 Market Dynamics

  • 12.1 Wafer Grinder (Wafer Thinning Equipment) Market Drivers
  • 12.2 Wafer Grinder (Wafer Thinning Equipment) Market Restraints
  • 12.3 Wafer Grinder (Wafer Thinning Equipment) Trends Analysis
  • 12.4 Porters Five Forces Analysis
    • 12.4.1 Threat of New Entrants
    • 12.4.2 Bargaining Power of Suppliers
    • 12.4.3 Bargaining Power of Buyers
    • 12.4.4 Threat of Substitutes
    • 12.4.5 Competitive Rivalry

13 Raw Material and Industry Chain

  • 13.1 Raw Material of Wafer Grinder (Wafer Thinning Equipment) and Key Manufacturers
  • 13.2 Manufacturing Costs Percentage of Wafer Grinder (Wafer Thinning Equipment)
  • 13.3 Wafer Grinder (Wafer Thinning Equipment) Production Process
  • 13.4 Wafer Grinder (Wafer Thinning Equipment) Industrial Chain

14 Shipments by Distribution Channel

  • 14.1 Sales Channel
    • 14.1.1 Direct to End-User
    • 14.1.2 Distributors
  • 14.2 Wafer Grinder (Wafer Thinning Equipment) Typical Distributors
  • 14.3 Wafer Grinder (Wafer Thinning Equipment) Typical Customers

15 Research Findings and Conclusion

    16 Appendix

    • 16.1 Methodology
    • 16.2 Research Process and Data Source

    Summary:
    Get latest Market Research Reports on Wafer Grinder (Wafer Thinning Equipment). Industry analysis & Market Report on Wafer Grinder (Wafer Thinning Equipment) is a syndicated market report, published as Global Wafer Grinder (Wafer Thinning Equipment) Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029. It is complete Research Study and Industry Analysis of Wafer Grinder (Wafer Thinning Equipment) market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.

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