Report Detail
Global (United States, European Union and China) Semiconductor Assembly & Packaging Equipment Market Research Report 2019-2025
- RnM3640928 |
- 02 August, 2019 |
- Global |
- 113 Pages |
- QYResearch |
- Electronics & Semiconductor
Semiconductor packaging and assembly equipment is used for an integrated chip to function, it needs to be connected to the package or directly to the printed circuit. This involves wire bonding, die-bonding, and dicing. Also, it is a back end process of chip formation. Semiconductor chip assembly is also a key component of the semiconductor supply chain.
The increase in application of semiconductor ICs across many segments has increased the demand for semiconductor packaging and assembly equipment. The growth in complexity of semiconductor IC designs majorly drives the market. Recently, it has been observed that there is an increase in the need for semiconductor ICs that can perform multiple functions. Consequently, vendors have developed semiconductor ICs with complex architecture to address the rise in need for multi-functional ICs. The development of complex semiconductor ICs is a critical factor that impels the market growth during the forecast period.
In 2019, the market size of Semiconductor Assembly & Packaging Equipment is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Semiconductor Assembly & Packaging Equipment.
This report studies the global market size of Semiconductor Assembly & Packaging Equipment, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
This study presents the Semiconductor Assembly & Packaging Equipment production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.
For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.
In global market, the following companies are covered:
ASM Pacific Technology
Kulicke & Soffa Industries
Besi
Accrutech
Shinkawa
Palomar Technologies
Hesse Mechatronics
Toray Engineering
West Bond
HYBOND
DIAS Automation
Market Segment by Product Type
Die Bonders
Wire Bonders
Packaging Equipment
Others
Market Segment by Application
IDMs
OSAT
Key Regions split in this report: breakdown data for each region.
United States
China
European Union
Rest of World (Japan, Korea, India and Southeast Asia)
The study objectives are:
To analyze and research the Semiconductor Assembly & Packaging Equipment status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
To present the key Semiconductor Assembly & Packaging Equipment manufacturers, presenting the sales, revenue, market share, and recent development for key players.
To split the breakdown data by regions, type, companies and applications
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market
In this study, the years considered to estimate the market size of Semiconductor Assembly & Packaging Equipment are as follows:
History Year: 2014-2018
Base Year: 2018
Estimated Year: 2019
Forecast Year 2019 to 2025
Table of Contents
1 Report Overview
- 1.1 Research Scope
- 1.2 Major Manufacturers Covered in This Report
- 1.3 Market Segment by Type
- 1.3.1 Global Semiconductor Assembly & Packaging Equipment Market Size Growth Rate by Type (2019-2025)
- 1.3.2 Die Bonders
- 1.3.3 Wire Bonders
- 1.3.4 Packaging Equipment
- 1.3.5 Others
- 1.4 Market Segment by Application
- 1.4.1 Global Semiconductor Assembly & Packaging Equipment Market Share by Application (2019-2025)
- 1.4.2 IDMs
- 1.4.3 OSAT
- 1.5 Study Objectives
- 1.6 Years Considered
2 Global Growth Trends
- 2.1 Production and Capacity Analysis
- 2.1.1 Global Semiconductor Assembly & Packaging Equipment Production Value 2014-2025
- 2.1.2 Global Semiconductor Assembly & Packaging Equipment Production 2014-2025
- 2.1.3 Global Semiconductor Assembly & Packaging Equipment Capacity 2014-2025
- 2.1.4 Global Semiconductor Assembly & Packaging Equipment Marketing Pricing and Trends
- 2.2 Key Producers Growth Rate (CAGR) 2019-2025
- 2.2.1 Global Semiconductor Assembly & Packaging Equipment Market Size CAGR of Key Regions
- 2.2.2 Global Semiconductor Assembly & Packaging Equipment Market Share of Key Regions
- 2.3 Industry Trends
- 2.3.1 Market Top Trends
- 2.3.2 Market Drivers
3 Market Share by Manufacturers
- 3.1 Capacity and Production by Manufacturers
- 3.1.1 Global Semiconductor Assembly & Packaging Equipment Capacity by Manufacturers
- 3.1.2 Global Semiconductor Assembly & Packaging Equipment Production by Manufacturers
- 3.2 Revenue by Manufacturers
- 3.2.1 Semiconductor Assembly & Packaging Equipment Revenue by Manufacturers (2014-2019)
- 3.2.2 Semiconductor Assembly & Packaging Equipment Revenue Share by Manufacturers (2014-2019)
- 3.2.3 Global Semiconductor Assembly & Packaging Equipment Market Concentration Ratio (CR5 and HHI)
- 3.3 Semiconductor Assembly & Packaging Equipment Price by Manufacturers
- 3.4 Key Manufacturers Semiconductor Assembly & Packaging Equipment Plants/Factories Distribution and Area Served
- 3.5 Date of Key Manufacturers Enter into Semiconductor Assembly & Packaging Equipment Market
- 3.6 Key Manufacturers Semiconductor Assembly & Packaging Equipment Product Offered
- 3.7 Mergers & Acquisitions, Expansion Plans
4 Market Size by Type
- 4.1 Production and Production Value for Each Type
- 4.1.1 Die Bonders Production and Production Value (2014-2019)
- 4.1.2 Wire Bonders Production and Production Value (2014-2019)
- 4.1.3 Packaging Equipment Production and Production Value (2014-2019)
- 4.1.4 Others Production and Production Value (2014-2019)
- 4.2 Global Semiconductor Assembly & Packaging Equipment Production Market Share by Type
- 4.3 Global Semiconductor Assembly & Packaging Equipment Production Value Market Share by Type
- 4.4 Semiconductor Assembly & Packaging Equipment Ex-factory Price by Type
5 Market Size by Application
- 5.1 Overview
- 5.2 Global Semiconductor Assembly & Packaging Equipment Consumption by Application
6 Production by Regions
- 6.1 Global Semiconductor Assembly & Packaging Equipment Production (History Data) by Regions 2014-2019
- 6.2 Global Semiconductor Assembly & Packaging Equipment Production Value (History Data) by Regions
- 6.3 United States
- 6.3.1 United States Semiconductor Assembly & Packaging Equipment Production Growth Rate 2014-2019
- 6.3.2 United States Semiconductor Assembly & Packaging Equipment Production Value Growth Rate 2014-2019
- 6.3.3 Key Players in United States
- 6.3.4 United States Semiconductor Assembly & Packaging Equipment Import & Export
- 6.4 European Union
- 6.4.1 European Union Semiconductor Assembly & Packaging Equipment Production Growth Rate 2014-2019
- 6.4.2 European Union Semiconductor Assembly & Packaging Equipment Production Value Growth Rate 2014-2019
- 6.4.3 Key Players in European Union
- 6.4.4 European Union Semiconductor Assembly & Packaging Equipment Import & Export
- 6.5 China
- 6.5.1 China Semiconductor Assembly & Packaging Equipment Production Growth Rate 2014-2019
- 6.5.2 China Semiconductor Assembly & Packaging Equipment Production Value Growth Rate 2014-2019
- 6.5.3 Key Players in China
- 6.5.4 China Semiconductor Assembly & Packaging Equipment Import & Export
- 6.6 Rest of World
- 6.6.1 Japan
- 6.6.2 Korea
- 6.6.3 India
- 6.6.4 Southeast Asia
7 Semiconductor Assembly & Packaging Equipment Consumption by Regions
- 7.1 Global Semiconductor Assembly & Packaging Equipment Consumption (History Data) by Regions
- 7.2 United States
- 7.2.1 United States Semiconductor Assembly & Packaging Equipment Consumption by Type
- 7.2.2 United States Semiconductor Assembly & Packaging Equipment Consumption by Application
- 7.3 European Union
- 7.3.1 European Union Semiconductor Assembly & Packaging Equipment Consumption by Type
- 7.3.2 European Union Semiconductor Assembly & Packaging Equipment Consumption by Application
- 7.4 China
- 7.4.1 China Semiconductor Assembly & Packaging Equipment Consumption by Type
- 7.4.2 China Semiconductor Assembly & Packaging Equipment Consumption by Application
- 7.5 Rest of World
- 7.5.1 Rest of World Semiconductor Assembly & Packaging Equipment Consumption by Type
- 7.5.2 Rest of World Semiconductor Assembly & Packaging Equipment Consumption by Application
- 7.5.1 Japan
- 7.5.2 Korea
- 7.5.3 India
- 7.5.4 Southeast Asia
8 Company Profiles
- 8.1 ASM Pacific Technology
- 8.1.1 ASM Pacific Technology Company Details
- 8.1.2 Company Description and Business Overview
- 8.1.3 Production and Revenue of Semiconductor Assembly & Packaging Equipment
- 8.1.4 Semiconductor Assembly & Packaging Equipment Product Introduction
- 8.1.5 ASM Pacific Technology Recent Development
- 8.2 Kulicke & Soffa Industries
- 8.2.1 Kulicke & Soffa Industries Company Details
- 8.2.2 Company Description and Business Overview
- 8.2.3 Production and Revenue of Semiconductor Assembly & Packaging Equipment
- 8.2.4 Semiconductor Assembly & Packaging Equipment Product Introduction
- 8.2.5 Kulicke & Soffa Industries Recent Development
- 8.3 Besi
- 8.3.1 Besi Company Details
- 8.3.2 Company Description and Business Overview
- 8.3.3 Production and Revenue of Semiconductor Assembly & Packaging Equipment
- 8.3.4 Semiconductor Assembly & Packaging Equipment Product Introduction
- 8.3.5 Besi Recent Development
- 8.4 Accrutech
- 8.4.1 Accrutech Company Details
- 8.4.2 Company Description and Business Overview
- 8.4.3 Production and Revenue of Semiconductor Assembly & Packaging Equipment
- 8.4.4 Semiconductor Assembly & Packaging Equipment Product Introduction
- 8.4.5 Accrutech Recent Development
- 8.5 Shinkawa
- 8.5.1 Shinkawa Company Details
- 8.5.2 Company Description and Business Overview
- 8.5.3 Production and Revenue of Semiconductor Assembly & Packaging Equipment
- 8.5.4 Semiconductor Assembly & Packaging Equipment Product Introduction
- 8.5.5 Shinkawa Recent Development
- 8.6 Palomar Technologies
- 8.6.1 Palomar Technologies Company Details
- 8.6.2 Company Description and Business Overview
- 8.6.3 Production and Revenue of Semiconductor Assembly & Packaging Equipment
- 8.6.4 Semiconductor Assembly & Packaging Equipment Product Introduction
- 8.6.5 Palomar Technologies Recent Development
- 8.7 Hesse Mechatronics
- 8.7.1 Hesse Mechatronics Company Details
- 8.7.2 Company Description and Business Overview
- 8.7.3 Production and Revenue of Semiconductor Assembly & Packaging Equipment
- 8.7.4 Semiconductor Assembly & Packaging Equipment Product Introduction
- 8.7.5 Hesse Mechatronics Recent Development
- 8.8 Toray Engineering
- 8.8.1 Toray Engineering Company Details
- 8.8.2 Company Description and Business Overview
- 8.8.3 Production and Revenue of Semiconductor Assembly & Packaging Equipment
- 8.8.4 Semiconductor Assembly & Packaging Equipment Product Introduction
- 8.8.5 Toray Engineering Recent Development
- 8.9 West Bond
- 8.9.1 West Bond Company Details
- 8.9.2 Company Description and Business Overview
- 8.9.3 Production and Revenue of Semiconductor Assembly & Packaging Equipment
- 8.9.4 Semiconductor Assembly & Packaging Equipment Product Introduction
- 8.9.5 West Bond Recent Development
- 8.10 HYBOND
- 8.10.1 HYBOND Company Details
- 8.10.2 Company Description and Business Overview
- 8.10.3 Production and Revenue of Semiconductor Assembly & Packaging Equipment
- 8.10.4 Semiconductor Assembly & Packaging Equipment Product Introduction
- 8.10.5 HYBOND Recent Development
- 8.11 DIAS Automation
9 Market Forecast
- 9.1 Global Market Size Forecast
- 9.1.1 Global Semiconductor Assembly & Packaging Equipment Capacity, Production Forecast 2019-2025
- 9.1.2 Global Semiconductor Assembly & Packaging Equipment Production Value Forecast 2019-2025
- 9.2 Market Forecast by Regions
- 9.2.1 Global Semiconductor Assembly & Packaging Equipment Production and Value Forecast by Regions 2019-2025
- 9.2.2 Global Semiconductor Assembly & Packaging Equipment Consumption Forecast by Regions 2019-2025
- 9.3 United States
- 9.3.1 Production and Value Forecast in United States
- 9.3.2 Consumption Forecast in United States
- 9.4 European Union
- 9.4.1 Production and Value Forecast in European Union
- 9.4.2 Consumption Forecast in European Union
- 9.5 China
- 9.5.1 Production and Value Forecast in China
- 9.5.2 Consumption Forecast in China
- 9.6 Rest of World
- 9.6.1 Japan
- 9.6.2 Korea
- 9.6.3 India
- 9.6.4 Southeast Asia
- 9.7 Forecast by Type
- 9.7.1 Global Semiconductor Assembly & Packaging Equipment Production Forecast by Type
- 9.7.2 Global Semiconductor Assembly & Packaging Equipment Production Value Forecast by Type
- 9.8 Consumption Forecast by Application
10 Value Chain and Sales Channels Analysis
- 10.1 Value Chain Analysis
- 10.2 Sales Channels Analysis
- 10.2.1 Semiconductor Assembly & Packaging Equipment Sales Channels
- 10.2.2 Semiconductor Assembly & Packaging Equipment Distributors
- 10.3 Semiconductor Assembly & Packaging Equipment Customers
11 Opportunities & Challenges, Threat and Affecting Factors
- 11.1 Market Opportunities
- 11.2 Market Challenges
- 11.3 Porter's Five Forces Analysis
12 Key Findings
13 Appendix
- 13.1 Research Methodology
- 13.1.1 Methodology/Research Approach
- 13.1.1.1 Research Programs/Design
- 13.1.1.2 Market Size Estimation
- 13.1.1.3 Market Breakdown and Data Triangulation
- 13.1.2 Data Source
- 13.1.2.1 Secondary Sources
- 13.1.2.2 Primary Sources
- 13.1.1 Methodology/Research Approach
- 13.2 Author Details
Summary:
Get latest Market Research Reports on Semiconductor Assembly & Packaging Equipment. Industry analysis & Market Report on Semiconductor Assembly & Packaging Equipment is a syndicated market report, published as Global (United States, European Union and China) Semiconductor Assembly & Packaging Equipment Market Research Report 2019-2025. It is complete Research Study and Industry Analysis of Semiconductor Assembly & Packaging Equipment market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.
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