Report Detail
Global (United States, European Union and China) Semiconductor Wafer Grinding Equipment Market Research Report 2019-2025
- RnM3640626 |
- 02 August, 2019 |
- Global |
- 113 Pages |
- QYResearch |
- Machinery & Equipment
Foundries are the primary end-user of the semiconductor fabrication market due to the steady adoption of fabless business model. The market will witness increasing demand for devices such as memory, logic, discrete, analog, sensor, and opto devices. Subsequently, the vendors must ensure and enhance their equipment quality to cater to the growing demand.
APAC will be the major revenue contributor to the semiconductor fabrication market owing to the large number of semiconductor foundries located in China, Taiwan, South Korea, and Japan. The construction of fabs and steady adoption of fabless business model will further supplement the growth of the semiconductor wafer grinding equipment market in APAC.
In 2019, the market size of Semiconductor Wafer Grinding Equipments is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Semiconductor Wafer Grinding Equipments.
This report studies the global market size of Semiconductor Wafer Grinding Equipments, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
This study presents the Semiconductor Wafer Grinding Equipments production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.
For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.
In global market, the following companies are covered:
Applied Materials
Ebara Corporation
Lapmaster
Logitech
Entrepix
Revasum
Tokyo Seimitsu
Logomatic
Market Segment by Product Type
Cylindrical Grinding
Surface Grinding
Other
Market Segment by Application
Foundries
Memory Manufacturers
IDMs
Key Regions split in this report: breakdown data for each region.
United States
China
European Union
Rest of World (Japan, Korea, India and Southeast Asia)
The study objectives are:
To analyze and research the Semiconductor Wafer Grinding Equipments status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
To present the key Semiconductor Wafer Grinding Equipments manufacturers, presenting the sales, revenue, market share, and recent development for key players.
To split the breakdown data by regions, type, companies and applications
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market
In this study, the years considered to estimate the market size of Semiconductor Wafer Grinding Equipments are as follows:
History Year: 2014-2018
Base Year: 2018
Estimated Year: 2019
Forecast Year 2019 to 2025
Table of Contents
1 Report Overview
- 1.1 Research Scope
- 1.2 Major Manufacturers Covered in This Report
- 1.3 Market Segment by Type
- 1.3.1 Global Semiconductor Wafer Grinding Equipments Market Size Growth Rate by Type (2019-2025)
- 1.3.2 Cylindrical Grinding
- 1.3.3 Surface Grinding
- 1.3.4 Other
- 1.4 Market Segment by Application
- 1.4.1 Global Semiconductor Wafer Grinding Equipments Market Share by Application (2019-2025)
- 1.4.2 Foundries
- 1.4.3 Memory Manufacturers
- 1.4.4 IDMs
- 1.5 Study Objectives
- 1.6 Years Considered
2 Global Growth Trends
- 2.1 Production and Capacity Analysis
- 2.1.1 Global Semiconductor Wafer Grinding Equipments Production Value 2014-2025
- 2.1.2 Global Semiconductor Wafer Grinding Equipments Production 2014-2025
- 2.1.3 Global Semiconductor Wafer Grinding Equipments Capacity 2014-2025
- 2.1.4 Global Semiconductor Wafer Grinding Equipments Marketing Pricing and Trends
- 2.2 Key Producers Growth Rate (CAGR) 2019-2025
- 2.2.1 Global Semiconductor Wafer Grinding Equipments Market Size CAGR of Key Regions
- 2.2.2 Global Semiconductor Wafer Grinding Equipments Market Share of Key Regions
- 2.3 Industry Trends
- 2.3.1 Market Top Trends
- 2.3.2 Market Drivers
3 Market Share by Manufacturers
- 3.1 Capacity and Production by Manufacturers
- 3.1.1 Global Semiconductor Wafer Grinding Equipments Capacity by Manufacturers
- 3.1.2 Global Semiconductor Wafer Grinding Equipments Production by Manufacturers
- 3.2 Revenue by Manufacturers
- 3.2.1 Semiconductor Wafer Grinding Equipments Revenue by Manufacturers (2014-2019)
- 3.2.2 Semiconductor Wafer Grinding Equipments Revenue Share by Manufacturers (2014-2019)
- 3.2.3 Global Semiconductor Wafer Grinding Equipments Market Concentration Ratio (CR5 and HHI)
- 3.3 Semiconductor Wafer Grinding Equipments Price by Manufacturers
- 3.4 Key Manufacturers Semiconductor Wafer Grinding Equipments Plants/Factories Distribution and Area Served
- 3.5 Date of Key Manufacturers Enter into Semiconductor Wafer Grinding Equipments Market
- 3.6 Key Manufacturers Semiconductor Wafer Grinding Equipments Product Offered
- 3.7 Mergers & Acquisitions, Expansion Plans
4 Market Size by Type
- 4.1 Production and Production Value for Each Type
- 4.1.1 Cylindrical Grinding Production and Production Value (2014-2019)
- 4.1.2 Surface Grinding Production and Production Value (2014-2019)
- 4.1.3 Other Production and Production Value (2014-2019)
- 4.2 Global Semiconductor Wafer Grinding Equipments Production Market Share by Type
- 4.3 Global Semiconductor Wafer Grinding Equipments Production Value Market Share by Type
- 4.4 Semiconductor Wafer Grinding Equipments Ex-factory Price by Type
5 Market Size by Application
- 5.1 Overview
- 5.2 Global Semiconductor Wafer Grinding Equipments Consumption by Application
6 Production by Regions
- 6.1 Global Semiconductor Wafer Grinding Equipments Production (History Data) by Regions 2014-2019
- 6.2 Global Semiconductor Wafer Grinding Equipments Production Value (History Data) by Regions
- 6.3 United States
- 6.3.1 United States Semiconductor Wafer Grinding Equipments Production Growth Rate 2014-2019
- 6.3.2 United States Semiconductor Wafer Grinding Equipments Production Value Growth Rate 2014-2019
- 6.3.3 Key Players in United States
- 6.3.4 United States Semiconductor Wafer Grinding Equipments Import & Export
- 6.4 European Union
- 6.4.1 European Union Semiconductor Wafer Grinding Equipments Production Growth Rate 2014-2019
- 6.4.2 European Union Semiconductor Wafer Grinding Equipments Production Value Growth Rate 2014-2019
- 6.4.3 Key Players in European Union
- 6.4.4 European Union Semiconductor Wafer Grinding Equipments Import & Export
- 6.5 China
- 6.5.1 China Semiconductor Wafer Grinding Equipments Production Growth Rate 2014-2019
- 6.5.2 China Semiconductor Wafer Grinding Equipments Production Value Growth Rate 2014-2019
- 6.5.3 Key Players in China
- 6.5.4 China Semiconductor Wafer Grinding Equipments Import & Export
- 6.6 Rest of World
- 6.6.1 Japan
- 6.6.2 Korea
- 6.6.3 India
- 6.6.4 Southeast Asia
7 Semiconductor Wafer Grinding Equipments Consumption by Regions
- 7.1 Global Semiconductor Wafer Grinding Equipments Consumption (History Data) by Regions
- 7.2 United States
- 7.2.1 United States Semiconductor Wafer Grinding Equipments Consumption by Type
- 7.2.2 United States Semiconductor Wafer Grinding Equipments Consumption by Application
- 7.3 European Union
- 7.3.1 European Union Semiconductor Wafer Grinding Equipments Consumption by Type
- 7.3.2 European Union Semiconductor Wafer Grinding Equipments Consumption by Application
- 7.4 China
- 7.4.1 China Semiconductor Wafer Grinding Equipments Consumption by Type
- 7.4.2 China Semiconductor Wafer Grinding Equipments Consumption by Application
- 7.5 Rest of World
- 7.5.1 Rest of World Semiconductor Wafer Grinding Equipments Consumption by Type
- 7.5.2 Rest of World Semiconductor Wafer Grinding Equipments Consumption by Application
- 7.5.1 Japan
- 7.5.2 Korea
- 7.5.3 India
- 7.5.4 Southeast Asia
8 Company Profiles
- 8.1 Applied Materials
- 8.1.1 Applied Materials Company Details
- 8.1.2 Company Description and Business Overview
- 8.1.3 Production and Revenue of Semiconductor Wafer Grinding Equipments
- 8.1.4 Semiconductor Wafer Grinding Equipments Product Introduction
- 8.1.5 Applied Materials Recent Development
- 8.2 Ebara Corporation
- 8.2.1 Ebara Corporation Company Details
- 8.2.2 Company Description and Business Overview
- 8.2.3 Production and Revenue of Semiconductor Wafer Grinding Equipments
- 8.2.4 Semiconductor Wafer Grinding Equipments Product Introduction
- 8.2.5 Ebara Corporation Recent Development
- 8.3 Lapmaster
- 8.3.1 Lapmaster Company Details
- 8.3.2 Company Description and Business Overview
- 8.3.3 Production and Revenue of Semiconductor Wafer Grinding Equipments
- 8.3.4 Semiconductor Wafer Grinding Equipments Product Introduction
- 8.3.5 Lapmaster Recent Development
- 8.4 Logitech
- 8.4.1 Logitech Company Details
- 8.4.2 Company Description and Business Overview
- 8.4.3 Production and Revenue of Semiconductor Wafer Grinding Equipments
- 8.4.4 Semiconductor Wafer Grinding Equipments Product Introduction
- 8.4.5 Logitech Recent Development
- 8.5 Entrepix
- 8.5.1 Entrepix Company Details
- 8.5.2 Company Description and Business Overview
- 8.5.3 Production and Revenue of Semiconductor Wafer Grinding Equipments
- 8.5.4 Semiconductor Wafer Grinding Equipments Product Introduction
- 8.5.5 Entrepix Recent Development
- 8.6 Revasum
- 8.6.1 Revasum Company Details
- 8.6.2 Company Description and Business Overview
- 8.6.3 Production and Revenue of Semiconductor Wafer Grinding Equipments
- 8.6.4 Semiconductor Wafer Grinding Equipments Product Introduction
- 8.6.5 Revasum Recent Development
- 8.7 Tokyo Seimitsu
- 8.7.1 Tokyo Seimitsu Company Details
- 8.7.2 Company Description and Business Overview
- 8.7.3 Production and Revenue of Semiconductor Wafer Grinding Equipments
- 8.7.4 Semiconductor Wafer Grinding Equipments Product Introduction
- 8.7.5 Tokyo Seimitsu Recent Development
- 8.8 Logomatic
- 8.8.1 Logomatic Company Details
- 8.8.2 Company Description and Business Overview
- 8.8.3 Production and Revenue of Semiconductor Wafer Grinding Equipments
- 8.8.4 Semiconductor Wafer Grinding Equipments Product Introduction
- 8.8.5 Logomatic Recent Development
9 Market Forecast
- 9.1 Global Market Size Forecast
- 9.1.1 Global Semiconductor Wafer Grinding Equipments Capacity, Production Forecast 2019-2025
- 9.1.2 Global Semiconductor Wafer Grinding Equipments Production Value Forecast 2019-2025
- 9.2 Market Forecast by Regions
- 9.2.1 Global Semiconductor Wafer Grinding Equipments Production and Value Forecast by Regions 2019-2025
- 9.2.2 Global Semiconductor Wafer Grinding Equipments Consumption Forecast by Regions 2019-2025
- 9.3 United States
- 9.3.1 Production and Value Forecast in United States
- 9.3.2 Consumption Forecast in United States
- 9.4 European Union
- 9.4.1 Production and Value Forecast in European Union
- 9.4.2 Consumption Forecast in European Union
- 9.5 China
- 9.5.1 Production and Value Forecast in China
- 9.5.2 Consumption Forecast in China
- 9.6 Rest of World
- 9.6.1 Japan
- 9.6.2 Korea
- 9.6.3 India
- 9.6.4 Southeast Asia
- 9.7 Forecast by Type
- 9.7.1 Global Semiconductor Wafer Grinding Equipments Production Forecast by Type
- 9.7.2 Global Semiconductor Wafer Grinding Equipments Production Value Forecast by Type
- 9.8 Consumption Forecast by Application
10 Value Chain and Sales Channels Analysis
- 10.1 Value Chain Analysis
- 10.2 Sales Channels Analysis
- 10.2.1 Semiconductor Wafer Grinding Equipments Sales Channels
- 10.2.2 Semiconductor Wafer Grinding Equipments Distributors
- 10.3 Semiconductor Wafer Grinding Equipments Customers
11 Opportunities & Challenges, Threat and Affecting Factors
- 11.1 Market Opportunities
- 11.2 Market Challenges
- 11.3 Porter's Five Forces Analysis
12 Key Findings
13 Appendix
- 13.1 Research Methodology
- 13.1.1 Methodology/Research Approach
- 13.1.1.1 Research Programs/Design
- 13.1.1.2 Market Size Estimation
- 13.1.1.3 Market Breakdown and Data Triangulation
- 13.1.2 Data Source
- 13.1.2.1 Secondary Sources
- 13.1.2.2 Primary Sources
- 13.1.1 Methodology/Research Approach
- 13.2 Author Details
Summary:
Get latest Market Research Reports on Semiconductor Wafer Grinding Equipment. Industry analysis & Market Report on Semiconductor Wafer Grinding Equipment is a syndicated market report, published as Global (United States, European Union and China) Semiconductor Wafer Grinding Equipment Market Research Report 2019-2025. It is complete Research Study and Industry Analysis of Semiconductor Wafer Grinding Equipment market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.
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