According to our (Global Info Research) latest study, the global Semiconductor Assembly Materials market size was valued at US$ million in 2024 and is forecast to a readjusted size of USD million by 2031 with a CAGR of %during review period.
Semiconductor Assembly Materials used in the assembly of semiconductor products including die attach adhesives, die encapsulants, lid seal adhesives, permanent bonding dielectrics and thermal interface materials.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report is a detailed and comprehensive analysis for global Semiconductor Assembly Materials market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Semiconductor Assembly Materials market size and forecasts, in consumption value ($ Million), sales quantity (Kg), and average selling prices (US$/Kg), 2020-2031
Global Semiconductor Assembly Materials market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Kg), and average selling prices (US$/Kg), 2020-2031
Global Semiconductor Assembly Materials market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Kg), and average selling prices (US$/Kg), 2020-2031
Global Semiconductor Assembly Materials market shares of main players, shipments in revenue ($ Million), sales quantity (Kg), and ASP (US$/Kg), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Semiconductor Assembly Materials
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Semiconductor Assembly Materials market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Dupont, Permabond, Henkel Adhesive Technologies, NAMICS Corporation, Master Bond, Dow Corning Corp, Epak Electronics, Laird Performance Materials, Boyd Corporation, SEMIKRON, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Semiconductor Assembly Materials market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Die Attach Adhesives
Die Encapsulants
Lid Seal Adhesives
Permanent Bonding Dielectrics
Thermal Interface Materials
Market segment by Application
Automation
Electrically Insulating
Servers and Computers
Major players covered
Dupont
Permabond
Henkel Adhesive Technologies
NAMICS Corporation
Master Bond
Dow Corning Corp
Epak Electronics
Laird Performance Materials
Boyd Corporation
SEMIKRON
Linseis
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Semiconductor Assembly Materials product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Semiconductor Assembly Materials, with price, sales quantity, revenue, and global market share of Semiconductor Assembly Materials from 2020 to 2025.
Chapter 3, the Semiconductor Assembly Materials competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Semiconductor Assembly Materials breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Semiconductor Assembly Materials market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Semiconductor Assembly Materials.
Chapter 14 and 15, to describe Semiconductor Assembly Materials sales channel, distributors, customers, research findings and conclusion.
Summary:
Get latest Market Research Reports on Semiconductor Assembly Materials. Industry analysis & Market Report on Semiconductor Assembly Materials is a syndicated market report, published as Global Semiconductor Assembly Materials Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031. It is complete Research Study and Industry Analysis of Semiconductor Assembly Materials market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.