According to our (Global Info Research) latest study, the global Electronic Assembly Adhesives market size was valued at US$ 8527 million in 2024 and is forecast to a readjusted size of USD 14090 million by 2031 with a CAGR of 7.5% during review period.
Electronic assembly adhesives are used to bond electronic components together. They are typically made of a thermosetting resin that cures when exposed to heat or moisture.
In recent years, electronic assemblies have become increasingly reliant upon advanced adhesives capable of meeting specific performance criteria to ensure reliable device operation and longevity within unforgiving environments. These adhesives must offer precise bond strengths able to resist thermal expansion mismatches between dissimilar materials subjected to wide temperature fluctuations encountered throughout their useful lifespans. Moreover, electronic devices commonly require customized adhesives tailored for precise applications within harsh environments such as high humidity levels or aggressively corrosive atmospheres found across industrial settings like oil rigs or coastal areas where salt spray damage can occur quickly.
This report is a detailed and comprehensive analysis for global Electronic Assembly Adhesives market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Electronic Assembly Adhesives market size and forecasts, in consumption value ($ Million), sales quantity (Kilton), and average selling prices (US$/Ton), 2020-2031
Global Electronic Assembly Adhesives market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Kilton), and average selling prices (US$/Ton), 2020-2031
Global Electronic Assembly Adhesives market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Kilton), and average selling prices (US$/Ton), 2020-2031
Global Electronic Assembly Adhesives market shares of main players, shipments in revenue ($ Million), sales quantity (Kilton), and ASP (US$/Ton), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Electronic Assembly Adhesives
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Electronic Assembly Adhesives market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include DOW, H.B. Fuller, Henkel, DuPont, 3M, Sekisui Chemical, Alpha, Permabond, Evonik, Masterbond, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Electronic Assembly Adhesives market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Electrically Conductive Adhesives
Non-Electrically Conductive Adhesives
Market segment by Application
Consumer Electronics Products
Industrial Electronics
Automotive
Military and Serospace
Others
Major players covered
DOW
H.B. Fuller
Henkel
DuPont
3M
Sekisui Chemical
Alpha
Permabond
Evonik
Masterbond
Bostik
Hexion
ITW Performance Polymers
Jowat
LORD Corp
DELO Industrial Adhesives
Huntsman
Hexion
Mitsubishi Chemical
Shinetsu
Lintec Corporation
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Electronic Assembly Adhesives product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Electronic Assembly Adhesives, with price, sales quantity, revenue, and global market share of Electronic Assembly Adhesives from 2020 to 2025.
Chapter 3, the Electronic Assembly Adhesives competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Electronic Assembly Adhesives breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Electronic Assembly Adhesives market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Electronic Assembly Adhesives.
Chapter 14 and 15, to describe Electronic Assembly Adhesives sales channel, distributors, customers, research findings and conclusion.
Summary:
Get latest Market Research Reports on Electronic Assembly Adhesives. Industry analysis & Market Report on Electronic Assembly Adhesives is a syndicated market report, published as Global Electronic Assembly Adhesives Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031. It is complete Research Study and Industry Analysis of Electronic Assembly Adhesives market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.