Report Detail
Global Molded Interconnect Substrate Technology Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
- RnM4627858 |
- 26 September, 2025 |
- Global |
- 80 Pages |
- GIR |
- Electronics & Semiconductor
According to our (Global Info Research) latest study, the global Molded Interconnect Substrate Technology market size was valued at US$ 100 million in 2024 and is forecast to a readjusted size of USD 231 million by 2031 with a CAGR of 11.9% during review period.
Molded Interconnect Substrate Technology (MIS) is a novel substrate solution that is ideal for mobile industry. It encompasses a wide range of solutions for the complex needs of IC package for mobile applications. With its embedded copper trace technology, it enable a finer line and space that is needed for high I/O count with smaller form factor. It also provides a robust Flip Chip assembly process. Another important feature of MIS substrate is copper filled-via and filled-pad technologies, which is significantly important for high frequency requirements, and improve thermal dissipation.
Currently, there are currently only three companies in the world that manufacture MIS substrates, China Taiwanese PPt, Chineses MiSpak Technology and Malaysian QDOS.
PPt now can supply 1 layer, 2 layer, 3 layer, 4 layer and 6 layer MIS substrates. MiSpak Technology supplies 1 layer and 2 layer MIS substrates. QDOS supplies 1 layer, 2 layer and 3 layer MIS substrates
The growth potential of MIS products in the substrate application market will come from network communication products such as servers and data centers, automotive electronic control equipment driven by electric vehicles and automotive intelligence, as well as 5G, AIoT and other applications. With the launch of these related products, the requirements for substrates used in semiconductor packaging will also increase significantly, requiring a high degree of design flexibility, improved performance and high reliability.
In terms of advanced lead frame products, MIS manufacturers (PPt, MiSpak and QDOS) mainly supply products that are not limited to single-layer boards. PPt can also provide multi-layer board windable lead frame products for multi-chip packaging, which are products that are difficult for traditional lead frame suppliers to provide.
Currently the MIS substrates are mainly used in power/PMIC/analog, automotive electronics, RF/5G, Optical Image Stabilization (OIS), fingerprint recognition, third generation semiconductor, and LED, etc. Most of MIS substrates are used in power segment. For third generation semiconductor, MIS substrates are mainly used in GaN devices.
This report is a detailed and comprehensive analysis for global Molded Interconnect Substrate Technology market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Molded Interconnect Substrate Technology market size and forecasts, in consumption value ($ Million), sales quantity (Million Units), and average selling prices (US$/Unit), 2020-2031
Global Molded Interconnect Substrate Technology market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Million Units), and average selling prices (US$/Unit), 2020-2031
Global Molded Interconnect Substrate Technology market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Million Units), and average selling prices (US$/Unit), 2020-2031
Global Molded Interconnect Substrate Technology market shares of main players, shipments in revenue ($ Million), sales quantity (Million Units), and ASP (US$/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Molded Interconnect Substrate Technology
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Molded Interconnect Substrate Technology market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include PPt, MiSpak Technology, QDOS, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Molded Interconnect Substrate Technology market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
多层MIS基板
单层MIS基板
Market segment by Application
Power IC
RF/5G
Fingerprint Sensor
OIS (Optical Image Stablization)
Others
Major players covered
PPt
MiSpak Technology
QDOS
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Molded Interconnect Substrate Technology product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Molded Interconnect Substrate Technology, with price, sales quantity, revenue, and global market share of Molded Interconnect Substrate Technology from 2020 to 2025.
Chapter 3, the Molded Interconnect Substrate Technology competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Molded Interconnect Substrate Technology breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Molded Interconnect Substrate Technology market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Molded Interconnect Substrate Technology.
Chapter 14 and 15, to describe Molded Interconnect Substrate Technology sales channel, distributors, customers, research findings and conclusion.
1 Market Overview
- 1.1 Product Overview and Scope
- 1.2 Market Estimation Caveats and Base Year
- 1.3 Market Analysis by Type
- 1.3.1 Overview: Global Molded Interconnect Substrate Technology Consumption Value by Type: 2020 Versus 2024 Versus 2031
- 1.3.2 多层MIS基板
- 1.3.3 单层MIS基板
- 1.4 Market Analysis by Application
- 1.4.1 Overview: Global Molded Interconnect Substrate Technology Consumption Value by Application: 2020 Versus 2024 Versus 2031
- 1.4.2 Power IC
- 1.4.3 RF/5G
- 1.4.4 Fingerprint Sensor
- 1.4.5 OIS (Optical Image Stablization)
- 1.4.6 Others
- 1.5 Global Molded Interconnect Substrate Technology Market Size & Forecast
- 1.5.1 Global Molded Interconnect Substrate Technology Consumption Value (2020 & 2024 & 2031)
- 1.5.2 Global Molded Interconnect Substrate Technology Sales Quantity (2020-2031)
- 1.5.3 Global Molded Interconnect Substrate Technology Average Price (2020-2031)
2 Manufacturers Profiles
- 2.1 PPt
- 2.1.1 PPt Details
- 2.1.2 PPt Major Business
- 2.1.3 PPt Molded Interconnect Substrate Technology Product and Services
- 2.1.4 PPt Molded Interconnect Substrate Technology Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
- 2.1.5 PPt Recent Developments/Updates
- 2.2 MiSpak Technology
- 2.2.1 MiSpak Technology Details
- 2.2.2 MiSpak Technology Major Business
- 2.2.3 MiSpak Technology Molded Interconnect Substrate Technology Product and Services
- 2.2.4 MiSpak Technology Molded Interconnect Substrate Technology Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
- 2.2.5 MiSpak Technology Recent Developments/Updates
- 2.3 QDOS
- 2.3.1 QDOS Details
- 2.3.2 QDOS Major Business
- 2.3.3 QDOS Molded Interconnect Substrate Technology Product and Services
- 2.3.4 QDOS Molded Interconnect Substrate Technology Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
- 2.3.5 QDOS Recent Developments/Updates
3 Competitive Environment: Molded Interconnect Substrate Technology by Manufacturer
- 3.1 Global Molded Interconnect Substrate Technology Sales Quantity by Manufacturer (2020-2025)
- 3.2 Global Molded Interconnect Substrate Technology Revenue by Manufacturer (2020-2025)
- 3.3 Global Molded Interconnect Substrate Technology Average Price by Manufacturer (2020-2025)
- 3.4 Market Share Analysis (2024)
- 3.4.1 Producer Shipments of Molded Interconnect Substrate Technology by Manufacturer Revenue ($MM) and Market Share (%): 2024
- 3.4.2 Top 3 Molded Interconnect Substrate Technology Manufacturer Market Share in 2024
- 3.4.3 Top 6 Molded Interconnect Substrate Technology Manufacturer Market Share in 2024
- 3.5 Molded Interconnect Substrate Technology Market: Overall Company Footprint Analysis
- 3.5.1 Molded Interconnect Substrate Technology Market: Region Footprint
- 3.5.2 Molded Interconnect Substrate Technology Market: Company Product Type Footprint
- 3.5.3 Molded Interconnect Substrate Technology Market: Company Product Application Footprint
- 3.6 New Market Entrants and Barriers to Market Entry
- 3.7 Mergers, Acquisition, Agreements, and Collaborations
4 Consumption Analysis by Region
- 4.1 Global Molded Interconnect Substrate Technology Market Size by Region
- 4.1.1 Global Molded Interconnect Substrate Technology Sales Quantity by Region (2020-2031)
- 4.1.2 Global Molded Interconnect Substrate Technology Consumption Value by Region (2020-2031)
- 4.1.3 Global Molded Interconnect Substrate Technology Average Price by Region (2020-2031)
- 4.2 North America Molded Interconnect Substrate Technology Consumption Value (2020-2031)
- 4.3 Europe Molded Interconnect Substrate Technology Consumption Value (2020-2031)
- 4.4 Asia-Pacific Molded Interconnect Substrate Technology Consumption Value (2020-2031)
- 4.5 South America Molded Interconnect Substrate Technology Consumption Value (2020-2031)
- 4.6 Middle East & Africa Molded Interconnect Substrate Technology Consumption Value (2020-2031)
5 Market Segment by Type
- 5.1 Global Molded Interconnect Substrate Technology Sales Quantity by Type (2020-2031)
- 5.2 Global Molded Interconnect Substrate Technology Consumption Value by Type (2020-2031)
- 5.3 Global Molded Interconnect Substrate Technology Average Price by Type (2020-2031)
6 Market Segment by Application
- 6.1 Global Molded Interconnect Substrate Technology Sales Quantity by Application (2020-2031)
- 6.2 Global Molded Interconnect Substrate Technology Consumption Value by Application (2020-2031)
- 6.3 Global Molded Interconnect Substrate Technology Average Price by Application (2020-2031)
7 North America
- 7.1 North America Molded Interconnect Substrate Technology Sales Quantity by Type (2020-2031)
- 7.2 North America Molded Interconnect Substrate Technology Sales Quantity by Application (2020-2031)
- 7.3 North America Molded Interconnect Substrate Technology Market Size by Country
- 7.3.1 North America Molded Interconnect Substrate Technology Sales Quantity by Country (2020-2031)
- 7.3.2 North America Molded Interconnect Substrate Technology Consumption Value by Country (2020-2031)
- 7.3.3 United States Market Size and Forecast (2020-2031)
- 7.3.4 Canada Market Size and Forecast (2020-2031)
- 7.3.5 Mexico Market Size and Forecast (2020-2031)
8 Europe
- 8.1 Europe Molded Interconnect Substrate Technology Sales Quantity by Type (2020-2031)
- 8.2 Europe Molded Interconnect Substrate Technology Sales Quantity by Application (2020-2031)
- 8.3 Europe Molded Interconnect Substrate Technology Market Size by Country
- 8.3.1 Europe Molded Interconnect Substrate Technology Sales Quantity by Country (2020-2031)
- 8.3.2 Europe Molded Interconnect Substrate Technology Consumption Value by Country (2020-2031)
- 8.3.3 Germany Market Size and Forecast (2020-2031)
- 8.3.4 France Market Size and Forecast (2020-2031)
- 8.3.5 United Kingdom Market Size and Forecast (2020-2031)
- 8.3.6 Russia Market Size and Forecast (2020-2031)
- 8.3.7 Italy Market Size and Forecast (2020-2031)
9 Asia-Pacific
- 9.1 Asia-Pacific Molded Interconnect Substrate Technology Sales Quantity by Type (2020-2031)
- 9.2 Asia-Pacific Molded Interconnect Substrate Technology Sales Quantity by Application (2020-2031)
- 9.3 Asia-Pacific Molded Interconnect Substrate Technology Market Size by Region
- 9.3.1 Asia-Pacific Molded Interconnect Substrate Technology Sales Quantity by Region (2020-2031)
- 9.3.2 Asia-Pacific Molded Interconnect Substrate Technology Consumption Value by Region (2020-2031)
- 9.3.3 China Market Size and Forecast (2020-2031)
- 9.3.4 Japan Market Size and Forecast (2020-2031)
- 9.3.5 South Korea Market Size and Forecast (2020-2031)
- 9.3.6 India Market Size and Forecast (2020-2031)
- 9.3.7 Southeast Asia Market Size and Forecast (2020-2031)
- 9.3.8 Australia Market Size and Forecast (2020-2031)
10 South America
- 10.1 South America Molded Interconnect Substrate Technology Sales Quantity by Type (2020-2031)
- 10.2 South America Molded Interconnect Substrate Technology Sales Quantity by Application (2020-2031)
- 10.3 South America Molded Interconnect Substrate Technology Market Size by Country
- 10.3.1 South America Molded Interconnect Substrate Technology Sales Quantity by Country (2020-2031)
- 10.3.2 South America Molded Interconnect Substrate Technology Consumption Value by Country (2020-2031)
- 10.3.3 Brazil Market Size and Forecast (2020-2031)
- 10.3.4 Argentina Market Size and Forecast (2020-2031)
11 Middle East & Africa
- 11.1 Middle East & Africa Molded Interconnect Substrate Technology Sales Quantity by Type (2020-2031)
- 11.2 Middle East & Africa Molded Interconnect Substrate Technology Sales Quantity by Application (2020-2031)
- 11.3 Middle East & Africa Molded Interconnect Substrate Technology Market Size by Country
- 11.3.1 Middle East & Africa Molded Interconnect Substrate Technology Sales Quantity by Country (2020-2031)
- 11.3.2 Middle East & Africa Molded Interconnect Substrate Technology Consumption Value by Country (2020-2031)
- 11.3.3 Turkey Market Size and Forecast (2020-2031)
- 11.3.4 Egypt Market Size and Forecast (2020-2031)
- 11.3.5 Saudi Arabia Market Size and Forecast (2020-2031)
- 11.3.6 South Africa Market Size and Forecast (2020-2031)
12 Market Dynamics
- 12.1 Molded Interconnect Substrate Technology Market Drivers
- 12.2 Molded Interconnect Substrate Technology Market Restraints
- 12.3 Molded Interconnect Substrate Technology Trends Analysis
- 12.4 Porters Five Forces Analysis
- 12.4.1 Threat of New Entrants
- 12.4.2 Bargaining Power of Suppliers
- 12.4.3 Bargaining Power of Buyers
- 12.4.4 Threat of Substitutes
- 12.4.5 Competitive Rivalry
13 Raw Material and Industry Chain
- 13.1 Raw Material of Molded Interconnect Substrate Technology and Key Manufacturers
- 13.2 Manufacturing Costs Percentage of Molded Interconnect Substrate Technology
- 13.3 Molded Interconnect Substrate Technology Production Process
- 13.4 Industry Value Chain Analysis
14 Shipments by Distribution Channel
- 14.1 Sales Channel
- 14.1.1 Direct to End-User
- 14.1.2 Distributors
- 14.2 Molded Interconnect Substrate Technology Typical Distributors
- 14.3 Molded Interconnect Substrate Technology Typical Customers
15 Research Findings and Conclusion
16 Appendix
- 16.1 Methodology
- 16.2 Research Process and Data Source
Summary:
Get latest Market Research Reports on Molded Interconnect Substrate Technology. Industry analysis & Market Report on Molded Interconnect Substrate Technology is a syndicated market report, published as Global Molded Interconnect Substrate Technology Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031. It is complete Research Study and Industry Analysis of Molded Interconnect Substrate Technology market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.
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