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Machinery & Equipment Global Molded Interconnect Device (MID) Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029

  • RnM4531043
    • |
  • 16 May, 2023
    • |
  • Global
    • |
  • 114 Pages
    • |
  • GIR (Global Info Research)
    • |
  • Machinery & Equipment

According to our (Global Info Research) latest study, the global Molded Interconnect Device (MID) market size was valued at USD 34570 million in 2022 and is forecast to a readjusted size of USD 40800 million by 2029 with a CAGR of 2.4% during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Molded interconnect device refers to three-dimensional electromechanical components that combine the finest of mechanical and electrical engineering. These are used to describe the method of producing selectively plated plastic pieces.
This report is a detailed and comprehensive analysis for global Molded Interconnect Device (MID) market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2023, are provided.
Key Features:
Global Molded Interconnect Device (MID) market size and forecasts, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2018-2029
Global Molded Interconnect Device (MID) market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2018-2029
Global Molded Interconnect Device (MID) market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2018-2029
Global Molded Interconnect Device (MID) market shares of main players, shipments in revenue ($ Million), sales quantity (K Units), and ASP (US$/Unit), 2018-2023
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Molded Interconnect Device (MID)
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Molded Interconnect Device (MID) market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Molex LLC, TE Connectivity, Amphenol Corporation, LPKF Laser & Electronics AG and 2E mechatronic GmbH & Co. KG, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.
Market Segmentation
Molded Interconnect Device (MID) market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Antenna and Connectivity Modules
Connectors and Switches
Sensors
Lighting
Market segment by Application
Automotive
Healthcare
Industrial
Military
Aerospace
Major players covered
Molex LLC
TE Connectivity
Amphenol Corporation
LPKF Laser & Electronics AG
2E mechatronic GmbH & Co. KG
Harting Technologiegruppe
Arlington Plating Company
MID Solutions
MacDermid Inc.
JOHNAN Corporation
TactoTek Oy
Axon' Cable S.A.S
S2P Solutions
Suzhou Cicor Technology Co. Ltd.
Chogori Technology
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Molded Interconnect Device (MID) product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Molded Interconnect Device (MID), with price, sales, revenue and global market share of Molded Interconnect Device (MID) from 2018 to 2023.
Chapter 3, the Molded Interconnect Device (MID) competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Molded Interconnect Device (MID) breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2018 to 2029.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2018 to 2029.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2022.and Molded Interconnect Device (MID) market forecast, by regions, type and application, with sales and revenue, from 2024 to 2029.
Chapter 12, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War.
Chapter 13, the key raw materials and key suppliers, and industry chain of Molded Interconnect Device (MID).
Chapter 14 and 15, to describe Molded Interconnect Device (MID) sales channel, distributors, customers, research findings and conclusion.


1 Market Overview

  • 1.1 Product Overview and Scope of Molded Interconnect Device (MID)
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Market Analysis by Type
    • 1.3.1 Overview: Global Molded Interconnect Device (MID) Consumption Value by Type: 2018 Versus 2022 Versus 2029
    • 1.3.2 Antenna and Connectivity Modules
    • 1.3.3 Connectors and Switches
    • 1.3.4 Sensors
    • 1.3.5 Lighting
  • 1.4 Market Analysis by Application
    • 1.4.1 Overview: Global Molded Interconnect Device (MID) Consumption Value by Application: 2018 Versus 2022 Versus 2029
    • 1.4.2 Automotive
    • 1.4.3 Healthcare
    • 1.4.4 Industrial
    • 1.4.5 Military
    • 1.4.6 Aerospace
  • 1.5 Global Molded Interconnect Device (MID) Market Size & Forecast
    • 1.5.1 Global Molded Interconnect Device (MID) Consumption Value (2018 & 2022 & 2029)
    • 1.5.2 Global Molded Interconnect Device (MID) Sales Quantity (2018-2029)
    • 1.5.3 Global Molded Interconnect Device (MID) Average Price (2018-2029)

2 Manufacturers Profiles

  • 2.1 Molex LLC
    • 2.1.1 Molex LLC Details
    • 2.1.2 Molex LLC Major Business
    • 2.1.3 Molex LLC Molded Interconnect Device (MID) Product and Services
    • 2.1.4 Molex LLC Molded Interconnect Device (MID) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.1.5 Molex LLC Recent Developments/Updates
  • 2.2 TE Connectivity
    • 2.2.1 TE Connectivity Details
    • 2.2.2 TE Connectivity Major Business
    • 2.2.3 TE Connectivity Molded Interconnect Device (MID) Product and Services
    • 2.2.4 TE Connectivity Molded Interconnect Device (MID) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.2.5 TE Connectivity Recent Developments/Updates
  • 2.3 Amphenol Corporation
    • 2.3.1 Amphenol Corporation Details
    • 2.3.2 Amphenol Corporation Major Business
    • 2.3.3 Amphenol Corporation Molded Interconnect Device (MID) Product and Services
    • 2.3.4 Amphenol Corporation Molded Interconnect Device (MID) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.3.5 Amphenol Corporation Recent Developments/Updates
  • 2.4 LPKF Laser & Electronics AG
    • 2.4.1 LPKF Laser & Electronics AG Details
    • 2.4.2 LPKF Laser & Electronics AG Major Business
    • 2.4.3 LPKF Laser & Electronics AG Molded Interconnect Device (MID) Product and Services
    • 2.4.4 LPKF Laser & Electronics AG Molded Interconnect Device (MID) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.4.5 LPKF Laser & Electronics AG Recent Developments/Updates
  • 2.5 2E mechatronic GmbH & Co. KG
    • 2.5.1 2E mechatronic GmbH & Co. KG Details
    • 2.5.2 2E mechatronic GmbH & Co. KG Major Business
    • 2.5.3 2E mechatronic GmbH & Co. KG Molded Interconnect Device (MID) Product and Services
    • 2.5.4 2E mechatronic GmbH & Co. KG Molded Interconnect Device (MID) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.5.5 2E mechatronic GmbH & Co. KG Recent Developments/Updates
  • 2.6 Harting Technologiegruppe
    • 2.6.1 Harting Technologiegruppe Details
    • 2.6.2 Harting Technologiegruppe Major Business
    • 2.6.3 Harting Technologiegruppe Molded Interconnect Device (MID) Product and Services
    • 2.6.4 Harting Technologiegruppe Molded Interconnect Device (MID) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.6.5 Harting Technologiegruppe Recent Developments/Updates
  • 2.7 Arlington Plating Company
    • 2.7.1 Arlington Plating Company Details
    • 2.7.2 Arlington Plating Company Major Business
    • 2.7.3 Arlington Plating Company Molded Interconnect Device (MID) Product and Services
    • 2.7.4 Arlington Plating Company Molded Interconnect Device (MID) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.7.5 Arlington Plating Company Recent Developments/Updates
  • 2.8 MID Solutions
    • 2.8.1 MID Solutions Details
    • 2.8.2 MID Solutions Major Business
    • 2.8.3 MID Solutions Molded Interconnect Device (MID) Product and Services
    • 2.8.4 MID Solutions Molded Interconnect Device (MID) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.8.5 MID Solutions Recent Developments/Updates
  • 2.9 MacDermid Inc.
    • 2.9.1 MacDermid Inc. Details
    • 2.9.2 MacDermid Inc. Major Business
    • 2.9.3 MacDermid Inc. Molded Interconnect Device (MID) Product and Services
    • 2.9.4 MacDermid Inc. Molded Interconnect Device (MID) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.9.5 MacDermid Inc. Recent Developments/Updates
  • 2.10 JOHNAN Corporation
    • 2.10.1 JOHNAN Corporation Details
    • 2.10.2 JOHNAN Corporation Major Business
    • 2.10.3 JOHNAN Corporation Molded Interconnect Device (MID) Product and Services
    • 2.10.4 JOHNAN Corporation Molded Interconnect Device (MID) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.10.5 JOHNAN Corporation Recent Developments/Updates
  • 2.11 TactoTek Oy
    • 2.11.1 TactoTek Oy Details
    • 2.11.2 TactoTek Oy Major Business
    • 2.11.3 TactoTek Oy Molded Interconnect Device (MID) Product and Services
    • 2.11.4 TactoTek Oy Molded Interconnect Device (MID) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.11.5 TactoTek Oy Recent Developments/Updates
  • 2.12 Axon' Cable S.A.S
    • 2.12.1 Axon' Cable S.A.S Details
    • 2.12.2 Axon' Cable S.A.S Major Business
    • 2.12.3 Axon' Cable S.A.S Molded Interconnect Device (MID) Product and Services
    • 2.12.4 Axon' Cable S.A.S Molded Interconnect Device (MID) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.12.5 Axon' Cable S.A.S Recent Developments/Updates
  • 2.13 S2P Solutions
    • 2.13.1 S2P Solutions Details
    • 2.13.2 S2P Solutions Major Business
    • 2.13.3 S2P Solutions Molded Interconnect Device (MID) Product and Services
    • 2.13.4 S2P Solutions Molded Interconnect Device (MID) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.13.5 S2P Solutions Recent Developments/Updates
  • 2.14 Suzhou Cicor Technology Co. Ltd.
    • 2.14.1 Suzhou Cicor Technology Co. Ltd. Details
    • 2.14.2 Suzhou Cicor Technology Co. Ltd. Major Business
    • 2.14.3 Suzhou Cicor Technology Co. Ltd. Molded Interconnect Device (MID) Product and Services
    • 2.14.4 Suzhou Cicor Technology Co. Ltd. Molded Interconnect Device (MID) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.14.5 Suzhou Cicor Technology Co. Ltd. Recent Developments/Updates
  • 2.15 Chogori Technology
    • 2.15.1 Chogori Technology Details
    • 2.15.2 Chogori Technology Major Business
    • 2.15.3 Chogori Technology Molded Interconnect Device (MID) Product and Services
    • 2.15.4 Chogori Technology Molded Interconnect Device (MID) Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.15.5 Chogori Technology Recent Developments/Updates

3 Competitive Environment: Molded Interconnect Device (MID) by Manufacturer

  • 3.1 Global Molded Interconnect Device (MID) Sales Quantity by Manufacturer (2018-2023)
  • 3.2 Global Molded Interconnect Device (MID) Revenue by Manufacturer (2018-2023)
  • 3.3 Global Molded Interconnect Device (MID) Average Price by Manufacturer (2018-2023)
  • 3.4 Market Share Analysis (2022)
    • 3.4.1 Producer Shipments of Molded Interconnect Device (MID) by Manufacturer Revenue ($MM) and Market Share (%): 2022
    • 3.4.2 Top 3 Molded Interconnect Device (MID) Manufacturer Market Share in 2022
    • 3.4.2 Top 6 Molded Interconnect Device (MID) Manufacturer Market Share in 2022
  • 3.5 Molded Interconnect Device (MID) Market: Overall Company Footprint Analysis
    • 3.5.1 Molded Interconnect Device (MID) Market: Region Footprint
    • 3.5.2 Molded Interconnect Device (MID) Market: Company Product Type Footprint
    • 3.5.3 Molded Interconnect Device (MID) Market: Company Product Application Footprint
  • 3.6 New Market Entrants and Barriers to Market Entry
  • 3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

  • 4.1 Global Molded Interconnect Device (MID) Market Size by Region
    • 4.1.1 Global Molded Interconnect Device (MID) Sales Quantity by Region (2018-2029)
    • 4.1.2 Global Molded Interconnect Device (MID) Consumption Value by Region (2018-2029)
    • 4.1.3 Global Molded Interconnect Device (MID) Average Price by Region (2018-2029)
  • 4.2 North America Molded Interconnect Device (MID) Consumption Value (2018-2029)
  • 4.3 Europe Molded Interconnect Device (MID) Consumption Value (2018-2029)
  • 4.4 Asia-Pacific Molded Interconnect Device (MID) Consumption Value (2018-2029)
  • 4.5 South America Molded Interconnect Device (MID) Consumption Value (2018-2029)
  • 4.6 Middle East and Africa Molded Interconnect Device (MID) Consumption Value (2018-2029)

5 Market Segment by Type

  • 5.1 Global Molded Interconnect Device (MID) Sales Quantity by Type (2018-2029)
  • 5.2 Global Molded Interconnect Device (MID) Consumption Value by Type (2018-2029)
  • 5.3 Global Molded Interconnect Device (MID) Average Price by Type (2018-2029)

6 Market Segment by Application

  • 6.1 Global Molded Interconnect Device (MID) Sales Quantity by Application (2018-2029)
  • 6.2 Global Molded Interconnect Device (MID) Consumption Value by Application (2018-2029)
  • 6.3 Global Molded Interconnect Device (MID) Average Price by Application (2018-2029)

7 North America

  • 7.1 North America Molded Interconnect Device (MID) Sales Quantity by Type (2018-2029)
  • 7.2 North America Molded Interconnect Device (MID) Sales Quantity by Application (2018-2029)
  • 7.3 North America Molded Interconnect Device (MID) Market Size by Country
    • 7.3.1 North America Molded Interconnect Device (MID) Sales Quantity by Country (2018-2029)
    • 7.3.2 North America Molded Interconnect Device (MID) Consumption Value by Country (2018-2029)
    • 7.3.3 United States Market Size and Forecast (2018-2029)
    • 7.3.4 Canada Market Size and Forecast (2018-2029)
    • 7.3.5 Mexico Market Size and Forecast (2018-2029)

8 Europe

  • 8.1 Europe Molded Interconnect Device (MID) Sales Quantity by Type (2018-2029)
  • 8.2 Europe Molded Interconnect Device (MID) Sales Quantity by Application (2018-2029)
  • 8.3 Europe Molded Interconnect Device (MID) Market Size by Country
    • 8.3.1 Europe Molded Interconnect Device (MID) Sales Quantity by Country (2018-2029)
    • 8.3.2 Europe Molded Interconnect Device (MID) Consumption Value by Country (2018-2029)
    • 8.3.3 Germany Market Size and Forecast (2018-2029)
    • 8.3.4 France Market Size and Forecast (2018-2029)
    • 8.3.5 United Kingdom Market Size and Forecast (2018-2029)
    • 8.3.6 Russia Market Size and Forecast (2018-2029)
    • 8.3.7 Italy Market Size and Forecast (2018-2029)

9 Asia-Pacific

  • 9.1 Asia-Pacific Molded Interconnect Device (MID) Sales Quantity by Type (2018-2029)
  • 9.2 Asia-Pacific Molded Interconnect Device (MID) Sales Quantity by Application (2018-2029)
  • 9.3 Asia-Pacific Molded Interconnect Device (MID) Market Size by Region
    • 9.3.1 Asia-Pacific Molded Interconnect Device (MID) Sales Quantity by Region (2018-2029)
    • 9.3.2 Asia-Pacific Molded Interconnect Device (MID) Consumption Value by Region (2018-2029)
    • 9.3.3 China Market Size and Forecast (2018-2029)
    • 9.3.4 Japan Market Size and Forecast (2018-2029)
    • 9.3.5 Korea Market Size and Forecast (2018-2029)
    • 9.3.6 India Market Size and Forecast (2018-2029)
    • 9.3.7 Southeast Asia Market Size and Forecast (2018-2029)
    • 9.3.8 Australia Market Size and Forecast (2018-2029)

10 South America

  • 10.1 South America Molded Interconnect Device (MID) Sales Quantity by Type (2018-2029)
  • 10.2 South America Molded Interconnect Device (MID) Sales Quantity by Application (2018-2029)
  • 10.3 South America Molded Interconnect Device (MID) Market Size by Country
    • 10.3.1 South America Molded Interconnect Device (MID) Sales Quantity by Country (2018-2029)
    • 10.3.2 South America Molded Interconnect Device (MID) Consumption Value by Country (2018-2029)
    • 10.3.3 Brazil Market Size and Forecast (2018-2029)
    • 10.3.4 Argentina Market Size and Forecast (2018-2029)

11 Middle East & Africa

  • 11.1 Middle East & Africa Molded Interconnect Device (MID) Sales Quantity by Type (2018-2029)
  • 11.2 Middle East & Africa Molded Interconnect Device (MID) Sales Quantity by Application (2018-2029)
  • 11.3 Middle East & Africa Molded Interconnect Device (MID) Market Size by Country
    • 11.3.1 Middle East & Africa Molded Interconnect Device (MID) Sales Quantity by Country (2018-2029)
    • 11.3.2 Middle East & Africa Molded Interconnect Device (MID) Consumption Value by Country (2018-2029)
    • 11.3.3 Turkey Market Size and Forecast (2018-2029)
    • 11.3.4 Egypt Market Size and Forecast (2018-2029)
    • 11.3.5 Saudi Arabia Market Size and Forecast (2018-2029)
    • 11.3.6 South Africa Market Size and Forecast (2018-2029)

12 Market Dynamics

  • 12.1 Molded Interconnect Device (MID) Market Drivers
  • 12.2 Molded Interconnect Device (MID) Market Restraints
  • 12.3 Molded Interconnect Device (MID) Trends Analysis
  • 12.4 Porters Five Forces Analysis
    • 12.4.1 Threat of New Entrants
    • 12.4.2 Bargaining Power of Suppliers
    • 12.4.3 Bargaining Power of Buyers
    • 12.4.4 Threat of Substitutes
    • 12.4.5 Competitive Rivalry
  • 12.5 Influence of COVID-19 and Russia-Ukraine War
    • 12.5.1 Influence of COVID-19
    • 12.5.2 Influence of Russia-Ukraine War

13 Raw Material and Industry Chain

  • 13.1 Raw Material of Molded Interconnect Device (MID) and Key Manufacturers
  • 13.2 Manufacturing Costs Percentage of Molded Interconnect Device (MID)
  • 13.3 Molded Interconnect Device (MID) Production Process
  • 13.4 Molded Interconnect Device (MID) Industrial Chain

14 Shipments by Distribution Channel

  • 14.1 Sales Channel
    • 14.1.1 Direct to End-User
    • 14.1.2 Distributors
  • 14.2 Molded Interconnect Device (MID) Typical Distributors
  • 14.3 Molded Interconnect Device (MID) Typical Customers

15 Research Findings and Conclusion

    16 Appendix

    • 16.1 Methodology
    • 16.2 Research Process and Data Source

    Summary:
    Get latest Market Research Reports on Molded Interconnect Device (MID). Industry analysis & Market Report on Molded Interconnect Device (MID) is a syndicated market report, published as Global Molded Interconnect Device (MID) Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029. It is complete Research Study and Industry Analysis of Molded Interconnect Device (MID) market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.

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