According to our (Global Info Research) latest study, the global Electron Beam Metrology & Inspection Equipment for Advanced Packaging market size was valued at US$ 880 million in 2025 and is forecast to a readjusted size of US$ 1347 million by 2032 with a CAGR of 6.3% during review period.
Electron Beam Metrology & Inspection Equipment primarily includes EBI, Defect Re-inspection DR-SEM, and CD-SEM.
In advanced packaging fields (such as 2.5D/3D packaging, Chiplet, etc.), the requirements for wafer defect detection and metrology are far higher than in traditional packaging: wafers before packaging must undergo sophisticated processes such as RDL (Redistribution Layer), TSV (Through Silicon Via), and micro-bumps, reducing defect sizes to sub-micron levels (some <50nm), and these defects directly affect chip stacking and electrical connection reliability. Among these, EBI (Electron Beam Metrology & Inspection) plays a core role in actively and comprehensively scanning the wafer, using high sensitivity to detect minute defects unique to advanced packaging (such as RDL line notches and TSV via wall cracks). CD-SEM (Critical Dimension Scanning Electron Microscope), as a core device for dimensional accuracy control, can perform sub-nanometer measurements on critical structures such as RDL linewidth, TSV via diameter, and microbump height, verifying whether process dimensions meet design specifications and avoiding interconnect failures caused by dimensional deviations. DR-SEM (Electron Beam Defect Re-inspection) focuses on suspicious defects marked by EBI/optical inspection, using ultra-high resolution imaging to determine defect authenticity, morphological analysis, and compositional traceability, providing precise data support for process optimization.
This article primarily summarizes the Electron Beam Metrology & Inspection Equipment used in advanced packaging processes.
This report is a detailed and comprehensive analysis for global Electron Beam Metrology & Inspection Equipment for Advanced Packaging market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Electron Beam Metrology & Inspection Equipment for Advanced Packaging market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2021-2032
Global Electron Beam Metrology & Inspection Equipment for Advanced Packaging market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2021-2032
Global Electron Beam Metrology & Inspection Equipment for Advanced Packaging market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2021-2032
Global Electron Beam Metrology & Inspection Equipment for Advanced Packaging market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K US$/Unit), 2021-2026
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Electron Beam Metrology & Inspection Equipment for Advanced Packaging
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Electron Beam Metrology & Inspection Equipment for Advanced Packaging market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Applied Materials, Hitachi High-Tech, ASML, KLA, Wuhan Jingce Electronic Group, DJEL, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Electron Beam Metrology & Inspection Equipment for Advanced Packaging market is split by Type and by Application. For the period 2021-2032, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
EBI
DR-SEM
CD-SEM
Market segment by Application
200mm Process
300mm Process
Others
Major players covered
Applied Materials
Hitachi High-Tech
ASML
KLA
Wuhan Jingce Electronic Group
DJEL
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Electron Beam Metrology & Inspection Equipment for Advanced Packaging product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Electron Beam Metrology & Inspection Equipment for Advanced Packaging, with price, sales quantity, revenue, and global market share of Electron Beam Metrology & Inspection Equipment for Advanced Packaging from 2021 to 2026.
Chapter 3, the Electron Beam Metrology & Inspection Equipment for Advanced Packaging competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Electron Beam Metrology & Inspection Equipment for Advanced Packaging breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2021 to 2032.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2021 to 2032.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2021 to 2026.and Electron Beam Metrology & Inspection Equipment for Advanced Packaging market forecast, by regions, by Type, and by Application, with sales and revenue, from 2027 to 2032.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Electron Beam Metrology & Inspection Equipment for Advanced Packaging.
Chapter 14 and 15, to describe Electron Beam Metrology & Inspection Equipment for Advanced Packaging sales channel, distributors, customers, research findings and conclusion.
Summary:
Get latest Market Research Reports on Electron Beam Metrology & Inspection Equipment for Advanced Packaging. Industry analysis & Market Report on Electron Beam Metrology & Inspection Equipment for Advanced Packaging is a syndicated market report, published as Global Electron Beam Metrology & Inspection Equipment for Advanced Packaging Market 2026 by Manufacturers, Regions, Type and Application, Forecast to 2032. It is complete Research Study and Industry Analysis of Electron Beam Metrology & Inspection Equipment for Advanced Packaging market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.