Report Detail

Chemical & Material Global Chip Encapsulation Material Market Growth (Status and Outlook) 2022-2028

  • RnM4453959
  • |
  • 15 June, 2022
  • |
  • Global
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  • 100 Pages
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  • LPI(LP Information)
  • |
  • Chemical & Material

As the global economy mends, the 2021 growth of Chip Encapsulation Material will have significant change from previous year. According to our (LP Information) latest study, the global Chip Encapsulation Material market size is USD million in 2022 from USD 23260 million in 2021, with a change of % between 2021 and 2022. The global Chip Encapsulation Material market size will reach USD 33000 million in 2028, growing at a CAGR of 5.1% over the analysis period 2022-2028.

The United States Chip Encapsulation Material market is expected at value of US$ million in 2021 and grow at approximately % CAGR during forecast period 2022-2028. China constitutes a % market for the global Chip Encapsulation Material market, reaching US$ million by the year 2028. As for the Europe Chip Encapsulation Material landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period 2022-2028. In APAC, the growth rates of other notable markets (Japan and South Korea) are projected to be at % and % respectively for the next 6-year period.

Global main Chip Encapsulation Material players cover Shennan Circuit Company Limited, Xingsen Technology, Kangqiang Electronics, and Kyocera, etc. In terms of revenue, the global largest two companies occupy a share nearly % in 2021.

This report presents a comprehensive overview, market shares, and growth opportunities of Chip Encapsulation Material market by product type, application, key players and key regions and countries.

Segmentation by type: breakdown data from 2017 to 2022 in Section 2.3; and forecast to 2028 in section 10.7.
Substrates
Lead Frame
Bonding Wires
Encapsulating Resin
Others

Segmentation by application: breakdown data from 2017 to 2022, in Section 2.4; and forecast to 2028 in section 10.8.
Consumer Electronics
Automotive Electronics
IT and Communication Industry
Others

This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The report also presents the market competition landscape and a corresponding detailed analysis of the major players in the market. The key players covered in this report: Breakdown data in in Chapter 3.
Shennan Circuit Company Limited
Xingsen Technology
Kangqiang Electronics
Kyocera
Mitsui High-tec, Inc.
Chang Wah Technology
Panasonic
Henkel
Sumitomo Bakelite
Heraeus
Tanaka


1 Scope of the Report

  • 1.1 Market Introduction
  • 1.2 Years Considered
  • 1.3 Research Objectives
  • 1.4 Market Research Methodology
  • 1.5 Research Process and Data Source
  • 1.6 Economic Indicators
  • 1.7 Currency Considered

2 Executive Summary

  • 2.1 World Market Overview
    • 2.1.1 Global Chip Encapsulation Material Market Size 2017-2028
    • 2.1.2 Chip Encapsulation Material Market Size CAGR by Region 2017 VS 2022 VS 2028
  • 2.2 Chip Encapsulation Material Segment by Type
    • 2.2.1 Substrates
    • 2.2.2 Lead Frame
    • 2.2.3 Bonding Wires
    • 2.2.4 Encapsulating Resin
    • 2.2.5 Others
  • 2.3 Chip Encapsulation Material Market Size by Type
    • 2.3.1 Chip Encapsulation Material Market Size CAGR by Type (2017 VS 2022 VS 2028)
    • 2.3.2 Global Chip Encapsulation Material Market Size Market Share by Type (2017-2022)
  • 2.4 Chip Encapsulation Material Segment by Application
    • 2.4.1 Consumer Electronics
    • 2.4.2 Automotive Electronics
    • 2.4.3 IT and Communication Industry
    • 2.4.4 Others
  • 2.5 Chip Encapsulation Material Market Size by Application
    • 2.5.1 Chip Encapsulation Material Market Size CAGR by Application (2017 VS 2022 VS 2028)
    • 2.5.2 Global Chip Encapsulation Material Market Size Market Share by Application (2017-2022)

3 Chip Encapsulation Material Market Size by Player

  • 3.1 Chip Encapsulation Material Market Size Market Share by Players
    • 3.1.1 Global Chip Encapsulation Material Revenue by Players (2020-2022)
    • 3.1.2 Global Chip Encapsulation Material Revenue Market Share by Players (2020-2022)
  • 3.2 Global Chip Encapsulation Material Key Players Head office and Products Offered
  • 3.3 Market Concentration Rate Analysis
    • 3.3.1 Competition Landscape Analysis
    • 3.3.2 Concentration Ratio (CR3, CR5 and CR10) & (2020-2022)
  • 3.4 New Products and Potential Entrants
  • 3.5 Mergers & Acquisitions, Expansion

4 Chip Encapsulation Material by Regions

  • 4.1 Chip Encapsulation Material Market Size by Regions (2017-2022)
  • 4.2 Americas Chip Encapsulation Material Market Size Growth (2017-2022)
  • 4.3 APAC Chip Encapsulation Material Market Size Growth (2017-2022)
  • 4.4 Europe Chip Encapsulation Material Market Size Growth (2017-2022)
  • 4.5 Middle East & Africa Chip Encapsulation Material Market Size Growth (2017-2022)

5 Americas

  • 5.1 Americas Chip Encapsulation Material Market Size by Country (2017-2022)
  • 5.2 Americas Chip Encapsulation Material Market Size by Type (2017-2022)
  • 5.3 Americas Chip Encapsulation Material Market Size by Application (2017-2022)
  • 5.4 United States
  • 5.5 Canada
  • 5.6 Mexico
  • 5.7 Brazil

6 APAC

  • 6.1 APAC Chip Encapsulation Material Market Size by Region (2017-2022)
  • 6.2 APAC Chip Encapsulation Material Market Size by Type (2017-2022)
  • 6.3 APAC Chip Encapsulation Material Market Size by Application (2017-2022)
  • 6.4 China
  • 6.5 Japan
  • 6.6 Korea
  • 6.7 Southeast Asia
  • 6.8 India
  • 6.9 Australia

7 Europe

  • 7.1 Europe Chip Encapsulation Material by Country (2017-2022)
  • 7.2 Europe Chip Encapsulation Material Market Size by Type (2017-2022)
  • 7.3 Europe Chip Encapsulation Material Market Size by Application (2017-2022)
  • 7.4 Germany
  • 7.5 France
  • 7.6 UK
  • 7.7 Italy
  • 7.8 Russia

8 Middle East & Africa

  • 8.1 Middle East & Africa Chip Encapsulation Material by Region (2017-2022)
  • 8.2 Middle East & Africa Chip Encapsulation Material Market Size by Type (2017-2022)
  • 8.3 Middle East & Africa Chip Encapsulation Material Market Size by Application (2017-2022)
  • 8.4 Egypt
  • 8.5 South Africa
  • 8.6 Israel
  • 8.7 Turkey
  • 8.8 GCC Countries

9 Market Drivers, Challenges and Trends

  • 9.1 Market Drivers & Growth Opportunities
  • 9.2 Market Challenges & Risks
  • 9.3 Industry Trends

10 Global Chip Encapsulation Material Market Forecast

  • 10.1 Global Chip Encapsulation Material Forecast by Regions (2023-2028)
    • 10.1.1 Global Chip Encapsulation Material Forecast by Regions (2023-2028)
    • 10.1.2 Americas Chip Encapsulation Material Forecast
    • 10.1.3 APAC Chip Encapsulation Material Forecast
    • 10.1.4 Europe Chip Encapsulation Material Forecast
    • 10.1.5 Middle East & Africa Chip Encapsulation Material Forecast
  • 10.2 Americas Chip Encapsulation Material Forecast by Country (2023-2028)
    • 10.2.1 United States Chip Encapsulation Material Market Forecast
    • 10.2.2 Canada Chip Encapsulation Material Market Forecast
    • 10.2.3 Mexico Chip Encapsulation Material Market Forecast
    • 10.2.4 Brazil Chip Encapsulation Material Market Forecast
  • 10.3 APAC Chip Encapsulation Material Forecast by Region (2023-2028)
    • 10.3.1 China Chip Encapsulation Material Market Forecast
    • 10.3.2 Japan Chip Encapsulation Material Market Forecast
    • 10.3.3 Korea Chip Encapsulation Material Market Forecast
    • 10.3.4 Southeast Asia Chip Encapsulation Material Market Forecast
    • 10.3.5 India Chip Encapsulation Material Market Forecast
    • 10.3.6 Australia Chip Encapsulation Material Market Forecast
  • 10.4 Europe Chip Encapsulation Material Forecast by Country (2023-2028)
    • 10.4.1 Germany Chip Encapsulation Material Market Forecast
    • 10.4.2 France Chip Encapsulation Material Market Forecast
    • 10.4.3 UK Chip Encapsulation Material Market Forecast
    • 10.4.4 Italy Chip Encapsulation Material Market Forecast
    • 10.4.5 Russia Chip Encapsulation Material Market Forecast
  • 10.5 Middle East & Africa Chip Encapsulation Material Forecast by Region (2023-2028)
    • 10.5.1 Egypt Chip Encapsulation Material Market Forecast
    • 10.5.2 South Africa Chip Encapsulation Material Market Forecast
    • 10.5.3 Israel Chip Encapsulation Material Market Forecast
    • 10.5.4 Turkey Chip Encapsulation Material Market Forecast
    • 10.5.5 GCC Countries Chip Encapsulation Material Market Forecast
  • 10.6 Global Chip Encapsulation Material Forecast by Type (2023-2028)
  • 10.7 Global Chip Encapsulation Material Forecast by Application (2023-2028)

11 Key Players Analysis

  • 11.1 Shennan Circuit Company Limited
    • 11.1.1 Shennan Circuit Company Limited Company Information
    • 11.1.2 Shennan Circuit Company Limited Chip Encapsulation Material Product Offered
    • 11.1.3 Shennan Circuit Company Limited Chip Encapsulation Material Revenue, Gross Margin and Market Share (2020-2022)
    • 11.1.4 Shennan Circuit Company Limited Main Business Overview
    • 11.1.5 Shennan Circuit Company Limited Latest Developments
  • 11.2 Xingsen Technology
    • 11.2.1 Xingsen Technology Company Information
    • 11.2.2 Xingsen Technology Chip Encapsulation Material Product Offered
    • 11.2.3 Xingsen Technology Chip Encapsulation Material Revenue, Gross Margin and Market Share (2020-2022)
    • 11.2.4 Xingsen Technology Main Business Overview
    • 11.2.5 Xingsen Technology Latest Developments
  • 11.3 Kangqiang Electronics
    • 11.3.1 Kangqiang Electronics Company Information
    • 11.3.2 Kangqiang Electronics Chip Encapsulation Material Product Offered
    • 11.3.3 Kangqiang Electronics Chip Encapsulation Material Revenue, Gross Margin and Market Share (2020-2022)
    • 11.3.4 Kangqiang Electronics Main Business Overview
    • 11.3.5 Kangqiang Electronics Latest Developments
  • 11.4 Kyocera
    • 11.4.1 Kyocera Company Information
    • 11.4.2 Kyocera Chip Encapsulation Material Product Offered
    • 11.4.3 Kyocera Chip Encapsulation Material Revenue, Gross Margin and Market Share (2020-2022)
    • 11.4.4 Kyocera Main Business Overview
    • 11.4.5 Kyocera Latest Developments
  • 11.5 Mitsui High-tec, Inc.
    • 11.5.1 Mitsui High-tec, Inc. Company Information
    • 11.5.2 Mitsui High-tec, Inc. Chip Encapsulation Material Product Offered
    • 11.5.3 Mitsui High-tec, Inc. Chip Encapsulation Material Revenue, Gross Margin and Market Share (2020-2022)
    • 11.5.4 Mitsui High-tec, Inc. Main Business Overview
    • 11.5.5 Mitsui High-tec, Inc. Latest Developments
  • 11.6 Chang Wah Technology
    • 11.6.1 Chang Wah Technology Company Information
    • 11.6.2 Chang Wah Technology Chip Encapsulation Material Product Offered
    • 11.6.3 Chang Wah Technology Chip Encapsulation Material Revenue, Gross Margin and Market Share (2020-2022)
    • 11.6.4 Chang Wah Technology Main Business Overview
    • 11.6.5 Chang Wah Technology Latest Developments
  • 11.7 Panasonic
    • 11.7.1 Panasonic Company Information
    • 11.7.2 Panasonic Chip Encapsulation Material Product Offered
    • 11.7.3 Panasonic Chip Encapsulation Material Revenue, Gross Margin and Market Share (2020-2022)
    • 11.7.4 Panasonic Main Business Overview
    • 11.7.5 Panasonic Latest Developments
  • 11.8 Henkel
    • 11.8.1 Henkel Company Information
    • 11.8.2 Henkel Chip Encapsulation Material Product Offered
    • 11.8.3 Henkel Chip Encapsulation Material Revenue, Gross Margin and Market Share (2020-2022)
    • 11.8.4 Henkel Main Business Overview
    • 11.8.5 Henkel Latest Developments
  • 11.9 Sumitomo Bakelite
    • 11.9.1 Sumitomo Bakelite Company Information
    • 11.9.2 Sumitomo Bakelite Chip Encapsulation Material Product Offered
    • 11.9.3 Sumitomo Bakelite Chip Encapsulation Material Revenue, Gross Margin and Market Share (2020-2022)
    • 11.9.4 Sumitomo Bakelite Main Business Overview
    • 11.9.5 Sumitomo Bakelite Latest Developments
  • 11.10 Heraeus
    • 11.10.1 Heraeus Company Information
    • 11.10.2 Heraeus Chip Encapsulation Material Product Offered
    • 11.10.3 Heraeus Chip Encapsulation Material Revenue, Gross Margin and Market Share (2020-2022)
    • 11.10.4 Heraeus Main Business Overview
    • 11.10.5 Heraeus Latest Developments
  • 11.11 Tanaka
    • 11.11.1 Tanaka Company Information
    • 11.11.2 Tanaka Chip Encapsulation Material Product Offered
    • 11.11.3 Tanaka Chip Encapsulation Material Revenue, Gross Margin and Market Share (2020-2022)
    • 11.11.4 Tanaka Main Business Overview
    • 11.11.5 Tanaka Latest Developments

12 Research Findings and Conclusion

Summary:
Get latest Market Research Reports on Chip Encapsulation Material. Industry analysis & Market Report on Chip Encapsulation Material is a syndicated market report, published as Global Chip Encapsulation Material Market Growth (Status and Outlook) 2022-2028. It is complete Research Study and Industry Analysis of Chip Encapsulation Material market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.

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