Report Detail
Global Chip Encapsulation Material Market 2023 by Company, Regions, Type and Application, Forecast to 2029
- RnM4529915 |
- 20 April, 2023 |
- Global |
- 100 Pages |
- GIR (Global Info Research) |
- Chemical & Material
According to our (Global Info Research) latest study, the global Chip Encapsulation Material market size was valued at USD 24470 million in 2022 and is forecast to a readjusted size of USD 33810 million by 2029 with a CAGR of 4.7% during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Global key players of chip encapsulation material include Shennan Circuit Company Limited, Xingsen Technology, Kangqiang Electronics, Kyocera, etc. Global top five manufacturers hold a share over 19%. In terms of product, substrate is the largest segment, with a share over 32%. And in terms of application, the largest application is consumer electronics, with a share over 35%.
This report is a detailed and comprehensive analysis for global Chip Encapsulation Material market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2023, are provided.
Key Features:
Global Chip Encapsulation Material market size and forecasts, in consumption value ($ Million), 2018-2029
Global Chip Encapsulation Material market size and forecasts by region and country, in consumption value ($ Million), 2018-2029
Global Chip Encapsulation Material market size and forecasts, by Type and by Application, in consumption value ($ Million), 2018-2029
Global Chip Encapsulation Material market shares of main players, in revenue ($ Million), 2018-2023
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Chip Encapsulation Material
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Chip Encapsulation Material market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Shennan Circuit Company Limited, Xingsen Technology, Kangqiang Electronics, Kyocera and Mitsui High-tec, Inc., etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.
Market segmentation
Chip Encapsulation Material market is split by Type and by Application. For the period 2018-2029, the growth among segments provide accurate calculations and forecasts for consumption value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Substrates
Lead Frame
Bonding Wires
Encapsulating Resin
Others
Market segment by Application
Consumer Electronics
Automotive Electronics
IT and Communication Industry
Others
Market segment by players, this report covers
Shennan Circuit Company Limited
Xingsen Technology
Kangqiang Electronics
Kyocera
Mitsui High-tec, Inc.
Chang Wah Technology
Panasonic
Henkel
Sumitomo Bakelite
Heraeus
Tanaka
Market segment by regions, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, UK, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Australia and Rest of Asia-Pacific)
South America (Brazil, Argentina and Rest of South America)
Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)
The content of the study subjects, includes a total of 13 chapters:
Chapter 1, to describe Chip Encapsulation Material product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top players of Chip Encapsulation Material, with revenue, gross margin and global market share of Chip Encapsulation Material from 2018 to 2023.
Chapter 3, the Chip Encapsulation Material competitive situation, revenue and global market share of top players are analyzed emphatically by landscape contrast.
Chapter 4 and 5, to segment the market size by Type and application, with consumption value and growth rate by Type, application, from 2018 to 2029.
Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2018 to 2023.and Chip Encapsulation Material market forecast, by regions, type and application, with consumption value, from 2024 to 2029.
Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War
Chapter 12, the key raw materials and key suppliers, and industry chain of Chip Encapsulation Material.
Chapter 13, to describe Chip Encapsulation Material research findings and conclusion.
1 Market Overview
- 1.1 Product Overview and Scope of Chip Encapsulation Material
- 1.2 Market Estimation Caveats and Base Year
- 1.3 Classification of Chip Encapsulation Material by Type
- 1.3.1 Overview: Global Chip Encapsulation Material Market Size by Type: 2018 Versus 2022 Versus 2029
- 1.3.2 Global Chip Encapsulation Material Consumption Value Market Share by Type in 2022
- 1.3.3 Substrates
- 1.3.4 Lead Frame
- 1.3.5 Bonding Wires
- 1.3.6 Encapsulating Resin
- 1.3.7 Others
- 1.4 Global Chip Encapsulation Material Market by Application
- 1.4.1 Overview: Global Chip Encapsulation Material Market Size by Application: 2018 Versus 2022 Versus 2029
- 1.4.2 Consumer Electronics
- 1.4.3 Automotive Electronics
- 1.4.4 IT and Communication Industry
- 1.4.5 Others
- 1.5 Global Chip Encapsulation Material Market Size & Forecast
- 1.6 Global Chip Encapsulation Material Market Size and Forecast by Region
- 1.6.1 Global Chip Encapsulation Material Market Size by Region: 2018 VS 2022 VS 2029
- 1.6.2 Global Chip Encapsulation Material Market Size by Region, (2018-2029)
- 1.6.3 North America Chip Encapsulation Material Market Size and Prospect (2018-2029)
- 1.6.4 Europe Chip Encapsulation Material Market Size and Prospect (2018-2029)
- 1.6.5 Asia-Pacific Chip Encapsulation Material Market Size and Prospect (2018-2029)
- 1.6.6 South America Chip Encapsulation Material Market Size and Prospect (2018-2029)
- 1.6.7 Middle East and Africa Chip Encapsulation Material Market Size and Prospect (2018-2029)
2 Company Profiles
- 2.1 Shennan Circuit Company Limited
- 2.1.1 Shennan Circuit Company Limited Details
- 2.1.2 Shennan Circuit Company Limited Major Business
- 2.1.3 Shennan Circuit Company Limited Chip Encapsulation Material Product and Solutions
- 2.1.4 Shennan Circuit Company Limited Chip Encapsulation Material Revenue, Gross Margin and Market Share (2018-2023)
- 2.1.5 Shennan Circuit Company Limited Recent Developments and Future Plans
- 2.2 Xingsen Technology
- 2.2.1 Xingsen Technology Details
- 2.2.2 Xingsen Technology Major Business
- 2.2.3 Xingsen Technology Chip Encapsulation Material Product and Solutions
- 2.2.4 Xingsen Technology Chip Encapsulation Material Revenue, Gross Margin and Market Share (2018-2023)
- 2.2.5 Xingsen Technology Recent Developments and Future Plans
- 2.3 Kangqiang Electronics
- 2.3.1 Kangqiang Electronics Details
- 2.3.2 Kangqiang Electronics Major Business
- 2.3.3 Kangqiang Electronics Chip Encapsulation Material Product and Solutions
- 2.3.4 Kangqiang Electronics Chip Encapsulation Material Revenue, Gross Margin and Market Share (2018-2023)
- 2.3.5 Kangqiang Electronics Recent Developments and Future Plans
- 2.4 Kyocera
- 2.4.1 Kyocera Details
- 2.4.2 Kyocera Major Business
- 2.4.3 Kyocera Chip Encapsulation Material Product and Solutions
- 2.4.4 Kyocera Chip Encapsulation Material Revenue, Gross Margin and Market Share (2018-2023)
- 2.4.5 Kyocera Recent Developments and Future Plans
- 2.5 Mitsui High-tec, Inc.
- 2.5.1 Mitsui High-tec, Inc. Details
- 2.5.2 Mitsui High-tec, Inc. Major Business
- 2.5.3 Mitsui High-tec, Inc. Chip Encapsulation Material Product and Solutions
- 2.5.4 Mitsui High-tec, Inc. Chip Encapsulation Material Revenue, Gross Margin and Market Share (2018-2023)
- 2.5.5 Mitsui High-tec, Inc. Recent Developments and Future Plans
- 2.6 Chang Wah Technology
- 2.6.1 Chang Wah Technology Details
- 2.6.2 Chang Wah Technology Major Business
- 2.6.3 Chang Wah Technology Chip Encapsulation Material Product and Solutions
- 2.6.4 Chang Wah Technology Chip Encapsulation Material Revenue, Gross Margin and Market Share (2018-2023)
- 2.6.5 Chang Wah Technology Recent Developments and Future Plans
- 2.7 Panasonic
- 2.7.1 Panasonic Details
- 2.7.2 Panasonic Major Business
- 2.7.3 Panasonic Chip Encapsulation Material Product and Solutions
- 2.7.4 Panasonic Chip Encapsulation Material Revenue, Gross Margin and Market Share (2018-2023)
- 2.7.5 Panasonic Recent Developments and Future Plans
- 2.8 Henkel
- 2.8.1 Henkel Details
- 2.8.2 Henkel Major Business
- 2.8.3 Henkel Chip Encapsulation Material Product and Solutions
- 2.8.4 Henkel Chip Encapsulation Material Revenue, Gross Margin and Market Share (2018-2023)
- 2.8.5 Henkel Recent Developments and Future Plans
- 2.9 Sumitomo Bakelite
- 2.9.1 Sumitomo Bakelite Details
- 2.9.2 Sumitomo Bakelite Major Business
- 2.9.3 Sumitomo Bakelite Chip Encapsulation Material Product and Solutions
- 2.9.4 Sumitomo Bakelite Chip Encapsulation Material Revenue, Gross Margin and Market Share (2018-2023)
- 2.9.5 Sumitomo Bakelite Recent Developments and Future Plans
- 2.10 Heraeus
- 2.10.1 Heraeus Details
- 2.10.2 Heraeus Major Business
- 2.10.3 Heraeus Chip Encapsulation Material Product and Solutions
- 2.10.4 Heraeus Chip Encapsulation Material Revenue, Gross Margin and Market Share (2018-2023)
- 2.10.5 Heraeus Recent Developments and Future Plans
- 2.11 Tanaka
- 2.11.1 Tanaka Details
- 2.11.2 Tanaka Major Business
- 2.11.3 Tanaka Chip Encapsulation Material Product and Solutions
- 2.11.4 Tanaka Chip Encapsulation Material Revenue, Gross Margin and Market Share (2018-2023)
- 2.11.5 Tanaka Recent Developments and Future Plans
3 Market Competition, by Players
- 3.1 Global Chip Encapsulation Material Revenue and Share by Players (2018-2023)
- 3.2 Market Share Analysis (2022)
- 3.2.1 Market Share of Chip Encapsulation Material by Company Revenue
- 3.2.2 Top 3 Chip Encapsulation Material Players Market Share in 2022
- 3.2.3 Top 6 Chip Encapsulation Material Players Market Share in 2022
- 3.3 Chip Encapsulation Material Market: Overall Company Footprint Analysis
- 3.3.1 Chip Encapsulation Material Market: Region Footprint
- 3.3.2 Chip Encapsulation Material Market: Company Product Type Footprint
- 3.3.3 Chip Encapsulation Material Market: Company Product Application Footprint
- 3.4 New Market Entrants and Barriers to Market Entry
- 3.5 Mergers, Acquisition, Agreements, and Collaborations
4 Market Size Segment by Type
- 4.1 Global Chip Encapsulation Material Consumption Value and Market Share by Type (2018-2023)
- 4.2 Global Chip Encapsulation Material Market Forecast by Type (2024-2029)
5 Market Size Segment by Application
- 5.1 Global Chip Encapsulation Material Consumption Value Market Share by Application (2018-2023)
- 5.2 Global Chip Encapsulation Material Market Forecast by Application (2024-2029)
6 North America
- 6.1 North America Chip Encapsulation Material Consumption Value by Type (2018-2029)
- 6.2 North America Chip Encapsulation Material Consumption Value by Application (2018-2029)
- 6.3 North America Chip Encapsulation Material Market Size by Country
- 6.3.1 North America Chip Encapsulation Material Consumption Value by Country (2018-2029)
- 6.3.2 United States Chip Encapsulation Material Market Size and Forecast (2018-2029)
- 6.3.3 Canada Chip Encapsulation Material Market Size and Forecast (2018-2029)
- 6.3.4 Mexico Chip Encapsulation Material Market Size and Forecast (2018-2029)
7 Europe
- 7.1 Europe Chip Encapsulation Material Consumption Value by Type (2018-2029)
- 7.2 Europe Chip Encapsulation Material Consumption Value by Application (2018-2029)
- 7.3 Europe Chip Encapsulation Material Market Size by Country
- 7.3.1 Europe Chip Encapsulation Material Consumption Value by Country (2018-2029)
- 7.3.2 Germany Chip Encapsulation Material Market Size and Forecast (2018-2029)
- 7.3.3 France Chip Encapsulation Material Market Size and Forecast (2018-2029)
- 7.3.4 United Kingdom Chip Encapsulation Material Market Size and Forecast (2018-2029)
- 7.3.5 Russia Chip Encapsulation Material Market Size and Forecast (2018-2029)
- 7.3.6 Italy Chip Encapsulation Material Market Size and Forecast (2018-2029)
8 Asia-Pacific
- 8.1 Asia-Pacific Chip Encapsulation Material Consumption Value by Type (2018-2029)
- 8.2 Asia-Pacific Chip Encapsulation Material Consumption Value by Application (2018-2029)
- 8.3 Asia-Pacific Chip Encapsulation Material Market Size by Region
- 8.3.1 Asia-Pacific Chip Encapsulation Material Consumption Value by Region (2018-2029)
- 8.3.2 China Chip Encapsulation Material Market Size and Forecast (2018-2029)
- 8.3.3 Japan Chip Encapsulation Material Market Size and Forecast (2018-2029)
- 8.3.4 South Korea Chip Encapsulation Material Market Size and Forecast (2018-2029)
- 8.3.5 India Chip Encapsulation Material Market Size and Forecast (2018-2029)
- 8.3.6 Southeast Asia Chip Encapsulation Material Market Size and Forecast (2018-2029)
- 8.3.7 Australia Chip Encapsulation Material Market Size and Forecast (2018-2029)
9 South America
- 9.1 South America Chip Encapsulation Material Consumption Value by Type (2018-2029)
- 9.2 South America Chip Encapsulation Material Consumption Value by Application (2018-2029)
- 9.3 South America Chip Encapsulation Material Market Size by Country
- 9.3.1 South America Chip Encapsulation Material Consumption Value by Country (2018-2029)
- 9.3.2 Brazil Chip Encapsulation Material Market Size and Forecast (2018-2029)
- 9.3.3 Argentina Chip Encapsulation Material Market Size and Forecast (2018-2029)
10 Middle East & Africa
- 10.1 Middle East & Africa Chip Encapsulation Material Consumption Value by Type (2018-2029)
- 10.2 Middle East & Africa Chip Encapsulation Material Consumption Value by Application (2018-2029)
- 10.3 Middle East & Africa Chip Encapsulation Material Market Size by Country
- 10.3.1 Middle East & Africa Chip Encapsulation Material Consumption Value by Country (2018-2029)
- 10.3.2 Turkey Chip Encapsulation Material Market Size and Forecast (2018-2029)
- 10.3.3 Saudi Arabia Chip Encapsulation Material Market Size and Forecast (2018-2029)
- 10.3.4 UAE Chip Encapsulation Material Market Size and Forecast (2018-2029)
11 Market Dynamics
- 11.1 Chip Encapsulation Material Market Drivers
- 11.2 Chip Encapsulation Material Market Restraints
- 11.3 Chip Encapsulation Material Trends Analysis
- 11.4 Porters Five Forces Analysis
- 11.4.1 Threat of New Entrants
- 11.4.2 Bargaining Power of Suppliers
- 11.4.3 Bargaining Power of Buyers
- 11.4.4 Threat of Substitutes
- 11.4.5 Competitive Rivalry
- 11.5 Influence of COVID-19 and Russia-Ukraine War
- 11.5.1 Influence of COVID-19
- 11.5.2 Influence of Russia-Ukraine War
12 Industry Chain Analysis
- 12.1 Chip Encapsulation Material Industry Chain
- 12.2 Chip Encapsulation Material Upstream Analysis
- 12.3 Chip Encapsulation Material Midstream Analysis
- 12.4 Chip Encapsulation Material Downstream Analysis
13 Research Findings and Conclusion
14 Appendix
- 14.1 Methodology
- 14.2 Research Process and Data Source
Summary:
Get latest Market Research Reports on Chip Encapsulation Material. Industry analysis & Market Report on Chip Encapsulation Material is a syndicated market report, published as Global Chip Encapsulation Material Market 2023 by Company, Regions, Type and Application, Forecast to 2029. It is complete Research Study and Industry Analysis of Chip Encapsulation Material market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.
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