According to our (Global Info Research) latest study, the global Automotive SiC MOSFET Module Baseplate market size was valued at US$ 85.88 million in 2025 and is forecast to a readjusted size of US$ 280 million by 2032 with a CAGR of 18.1% during review period.
An automotive SiC MOSFET module baseplate is the structural heat-spreading foundation at the bottom of an automotive-qualified SiC power module (e.g., traction-inverter phase-leg/six-pack). It spreads heat from the DBC/AMB stack to the cooling interface and provides mechanical mounting/warpage control for reliability. It ranges from flat baseplates used with TIM to advanced single-side direct cooling pin-fin baseplates for higher power density and lower thermal resistance.
Upstream covers metals/MMCs, plating chemicals (e.g., Ni/NiP), and joining/interface consumables; midstream includes forming + precision machining, pin-fin/direct-cooling feature fabrication, plating/corrosion protection, and automotive qualification (thermal/power cycling). Downstream integrates into SiC module packaging and system cooling (direct-cooled baseplates fundamentally change the thermal interface).
In 2025, global automotive SiC MOSFET module baseplate production reached approximately 7.5 million units, with an average global market price is $11 per unit.
This report is a detailed and comprehensive analysis for global Automotive SiC MOSFET Module Baseplate market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Automotive SiC MOSFET Module Baseplate market size and forecasts, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2021-2032
Global Automotive SiC MOSFET Module Baseplate market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2021-2032
Global Automotive SiC MOSFET Module Baseplate market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2021-2032
Global Automotive SiC MOSFET Module Baseplate market shares of main players, shipments in revenue ($ Million), sales quantity (K Units), and ASP (US$/Unit), 2021-2026
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Automotive SiC MOSFET Module Baseplate
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Automotive SiC MOSFET Module Baseplate market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Huangshan Googe, Heatsink Advanced Materials, Kunshan Gootage Thermal Technology, Dana Incorporated, Jentech Precision Industrial, Amulaire Thermal Technology, TAIWA CO., Ltd., Wieland Microcool, Jiangyin Saiying Electron, Suzhou Haoli Electronic Technology, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Automotive SiC MOSFET Module Baseplate market is split by Type and by Application. For the period 2021-2032, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Pin-fin Baseplate
Flat Baseplate
Market segment by Material
Cu Baseplate
AlSIC Baseplate
Other
Market segment by Application
BEV
PHEV
Major players covered
Huangshan Googe
Heatsink Advanced Materials
Kunshan Gootage Thermal Technology
Dana Incorporated
Jentech Precision Industrial
Amulaire Thermal Technology
TAIWA CO., Ltd.
Wieland Microcool
Jiangyin Saiying Electron
Suzhou Haoli Electronic Technology
Sitritec Thermal Control Materials
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Automotive SiC MOSFET Module Baseplate product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Automotive SiC MOSFET Module Baseplate, with price, sales quantity, revenue, and global market share of Automotive SiC MOSFET Module Baseplate from 2021 to 2026.
Chapter 3, the Automotive SiC MOSFET Module Baseplate competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Automotive SiC MOSFET Module Baseplate breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2021 to 2032.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2021 to 2032.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2021 to 2026.and Automotive SiC MOSFET Module Baseplate market forecast, by regions, by Type, and by Application, with sales and revenue, from 2027 to 2032.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Automotive SiC MOSFET Module Baseplate.
Chapter 14 and 15, to describe Automotive SiC MOSFET Module Baseplate sales channel, distributors, customers, research findings and conclusion.
Summary:
Get latest Market Research Reports on Automotive SiC MOSFET Module Baseplate. Industry analysis & Market Report on Automotive SiC MOSFET Module Baseplate is a syndicated market report, published as Global Automotive SiC MOSFET Module Baseplate Market 2026 by Manufacturers, Regions, Type and Application, Forecast to 2032. It is complete Research Study and Industry Analysis of Automotive SiC MOSFET Module Baseplate market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.