According to our (Global Info Research) latest study, the global Vapor Phase Soldering Machine market size was valued at US$ 185 million in 2025 and is forecast to a readjusted size of US$ 317 million by 2032 with a CAGR of 8.0% during review period.
Vapor Phase Soldering Machine, also known as condensation soldering equipment, is a specialized reflow soldering system used in electronics assembly. It heats an inert heat-transfer medium to generate saturated vapor, and the vapor condenses on PCB assemblies to transfer heat uniformly for solder reflow. The process provides oxygen-free soldering, precise peak temperature limitation, strong heat-transfer efficiency, and good suitability for high-mass boards, complex assemblies, power electronics, automotive electronics, aerospace electronics, and high-reliability small-to-medium batch production. Main product types include batch vapor phase soldering machines, inline vapor phase soldering systems, vacuum vapor phase soldering machines, laboratory vapor phase ovens, and automated condensation soldering systems. This category excludes hot-air convection reflow ovens, wave soldering machines, selective soldering systems, SMT placement machines, complete SMT lines, soldering materials, and third-party EMS soldering services. Vapor phase soldering is described by equipment makers as a condensation soldering process using hot vapor rather than hot air, and vacuum variants are used to reduce solder-joint voids. The industrial chain of Vapor Phase Soldering Machine includes upstream suppliers of stainless-steel process chambers, vacuum pumps, heating modules, cooling systems, vapor-phase heat-transfer fluids, conveyor modules, PLC control systems, sensors, oxygen monitoring systems, condensers, seals, filters, and safety components. Midstream manufacturers integrate process chambers, vapor generation systems, vacuum modules, condensation control, profiling software, transport systems, cooling recovery modules, and safety enclosures into complete soldering equipment. Downstream applications include EMS providers, automotive electronics manufacturers, aerospace electronics producers, power electronics companies, industrial control manufacturers, medical electronics companies, and R&D laboratories. Supporting services include process profiling, fluid management, equipment calibration, maintenance, spare parts supply, operator training, and SMT line integration.In 2025, global Vapor Phase Soldering Machine production reached approximately 818 units, with an average global market price of around US$220,000 per system. The gross profit margin of major companies in the industry is between 25%–42%. In 2025, the global production capacity of vapor phase soldering machines was approximately 1,169 units.
The Vapor Phase Soldering Machine market is driven by demand for high-reliability electronics assembly in automotive electronics, aerospace electronics, power modules, industrial control systems, medical electronics, and R&D production. Compared with conventional hot-air reflow soldering, vapor phase soldering provides more uniform heat transfer, oxygen-free processing, and precise peak temperature limitation, making it suitable for complex PCBs, high-mass assemblies, and components sensitive to overheating. Vacuum vapor phase soldering also helps reduce voids in solder joints, which is important for power electronics and high-reliability applications. However, the market remains a specialized niche within SMT soldering equipment rather than a mainstream reflow oven market. Growth is limited by higher equipment cost, process fluid management, lower throughput in some batch systems, and competition from advanced convection reflow ovens. Overall, demand is expected to grow steadily, supported by electrification, power electronics, miniaturized assemblies, and stricter reliability requirements.
This report is a detailed and comprehensive analysis for global Vapor Phase Soldering Machine market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Vapor Phase Soldering Machine market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2021-2032
Global Vapor Phase Soldering Machine market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2021-2032
Global Vapor Phase Soldering Machine market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2021-2032
Global Vapor Phase Soldering Machine market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K US$/Unit), 2021-2026
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Vapor Phase Soldering Machine
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Vapor Phase Soldering Machine market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include ASSCON Systemtechnik-Elektronik GmbH, IBL-Löttechnik GmbH, Rehm Thermal Systems GmbH, BSC Solder Systems OHG, PCB Arts GmbH, CIF - Circuit Imprimé Français, Orion Industry, R&D VaporTech LLC, Ningbo CECJC Technology Co., Ltd., Guangdong Huaxin Semiconductor Technology Co., Ltd., etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Vapor Phase Soldering Machine market is split by Type and by Application. For the period 2021-2032, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Atmospheric Vapor Phase Soldering Machine
Vacuum Vapor Phase Soldering Machine
Non-vacuum Vapor Phase Soldering Machine
Market segment by Soldering Chamber Structure
Single-chamber Vapor Phase Soldering Machine
Dual-chamber Vapor Phase Soldering Machine
Multi-chamber Vapor Phase Soldering Machine
Market segment by Production Capacity
Low-capacity Vapor Phase Soldering Machine: Throughput ≤20 boards/hour
Medium-capacity Vapor Phase Soldering Machine: Throughput >20 boards/hour and ≤80 boards/hour
High-capacity Vapor Phase Soldering Machine: Throughput >80 boards/hour and ≤200 boards/hour
Ultra-high-capacity Vapor Phase Soldering Machine: Throughput >200 boards/hour
Market segment by Application
Power Electronics Manufacturing
Automotive Electronics Manufacturing
Aerospace Electronics Manufacturing
Medical Electronics Manufacturing
Others
Major players covered
ASSCON Systemtechnik-Elektronik GmbH
IBL-Löttechnik GmbH
Rehm Thermal Systems GmbH
BSC Solder Systems OHG
PCB Arts GmbH
CIF - Circuit Imprimé Français
Orion Industry
R&D VaporTech LLC
Ningbo CECJC Technology Co., Ltd.
Guangdong Huaxin Semiconductor Technology Co., Ltd.
Shenzhen Haobao Technology Co., Ltd.
Shanghai Tongerr Intelligent Technology Co., Ltd.
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Vapor Phase Soldering Machine product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Vapor Phase Soldering Machine, with price, sales quantity, revenue, and global market share of Vapor Phase Soldering Machine from 2021 to 2026.
Chapter 3, the Vapor Phase Soldering Machine competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Vapor Phase Soldering Machine breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2021 to 2032.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2021 to 2032.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2021 to 2026.and Vapor Phase Soldering Machine market forecast, by regions, by Type, and by Application, with sales and revenue, from 2027 to 2032.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Vapor Phase Soldering Machine.
Chapter 14 and 15, to describe Vapor Phase Soldering Machine sales channel, distributors, customers, research findings and conclusion.
Summary:
Get latest Market Research Reports on Vapor Phase Soldering Machine. Industry analysis & Market Report on Vapor Phase Soldering Machine is a syndicated market report, published as Global Vapor Phase Soldering Machine Market 2026 by Manufacturers, Regions, Type and Application, Forecast to 2032. It is complete Research Study and Industry Analysis of Vapor Phase Soldering Machine market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.