According to our (Global Info Research) latest study, the global UV and Non-UV Tape for Semiconductor market size was valued at US$ 705 million in 2024 and is forecast to a readjusted size of USD 972 million by 2031 with a CAGR of 5.2% during review period.
In the semiconductor manufacturing process, the non-UV tape used for wafers is usually called blue film. UV and non-UV tapes are mainly used in semiconductor grinding, cutting processes and packaging. Whether it is grinding tape or cutting tape, it includes non-UV tape (Non-UV Tape) and UV tape (UV Tape). Non-UV type is a general traditional pressure-sensitive tape. Considering the easy peeling, its adhesion is generally lower than that of UV type (before UV exposure), about 100~400 gf/25mm; UV tape is a pressure-sensitive tape with high adhesion strength before exposure. After exposure to UV light, its peeling force will be greatly reduced. It not only has strong fixation to the adherend, but also has the advantage of easy peeling after the process purpose is achieved. Wafer back grinding tape (BG Tape) is mainly used for the protection and fixation of the front circuit of the wafer during the back grinding and thinning after the wafer is completed, and to prevent damage to the front circuit of the wafer during the back grinding of the wafer. Dicing tape is mainly used for fixing, cutting, expanding, UV debonding, and separation in semiconductor wafer and packaging processes. DAF film is used to bond chips and substrates during semiconductor packaging.
Functional film materials can be divided into "product component film" and "product process realization film" according to their applications. UV and non-UV tapes for semiconductors are one of the product process realization films. With the continuous development of the semiconductor industry and the iterative update of technology, a large number of new high-performance functional film materials have been generated, which has put forward higher requirements for manufacturers in many aspects such as polymer material structure design and formula design. The expansion of the semiconductor industry has driven the strong growth of demand for semiconductor tapes.
UV and non-UV tapes for semiconductors are mainly monopolized by well-known foreign companies such as Lintec, Nitto Denko, Furukawa Electric, Mitsui Chemicals, Resonac, and Sumitomo. These companies entered the industry early, accumulated rich industry experience, and mastered the core technology of UV and non-UV film material product research and development and production. At the same time, relying on a complete product system and a global sales network, they have established a good brand image in the industry and occupied a large market share. In contrast, my country started late in the UV and non-UV film industry, and its technical strength is relatively weak. There is a certain gap between China and the leading level abroad. In addition, there are a large number of small and medium-sized enterprises in the industry, and the business scale is generally small, which is significantly different from the technical strength of foreign companies.
From the perspective of global competition, the global semiconductor UV and non-UV tapes are still dominated by Japan, the United States, South Korea and other countries. Although the sales scale of China's semiconductor materials continues to increase, in terms of overall technical level and scale, there is still a large gap between Chinese semiconductor material companies and global industry leaders.
This report is a detailed and comprehensive analysis for global UV and Non-UV Tape for Semiconductor market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global UV and Non-UV Tape for Semiconductor market size and forecasts, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sq m), 2020-2031
Global UV and Non-UV Tape for Semiconductor market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sq m), 2020-2031
Global UV and Non-UV Tape for Semiconductor market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sq m), 2020-2031
Global UV and Non-UV Tape for Semiconductor market shares of main players, shipments in revenue ($ Million), sales quantity (K Sqm), and ASP (US$/Sq m), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for UV and Non-UV Tape for Semiconductor
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global UV and Non-UV Tape for Semiconductor market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Mitsui Chemicals Tohcello, Nitto Denko, LINTEC Corporation, Furukawa Electric, Denka, Sumitomo Bakelite, D&X, AI Technology, ULTRON SYSTEM, Maxell Holdings, Ltd, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
UV and Non-UV Tape for Semiconductor market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
UV Type
Non-UV Type
Market segment by Application
Wafer Backing Grinding
Wafer Dicing
Semiconductor Packaging (DAF)
Major players covered
Mitsui Chemicals Tohcello
Nitto Denko
LINTEC Corporation
Furukawa Electric
Denka
Sumitomo Bakelite
D&X
AI Technology
ULTRON SYSTEM
Maxell Holdings, Ltd
Resonac
Henkel Adhesives
LG Chem
Taicang Zhanxin Adhesive Material
Taizhou Wisifilm
Suzhou Boyanuvtape
Zhangjiagang Vistaic
NPMT(NDS)
KGK Chemical Corporation
Nexteck
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe UV and Non-UV Tape for Semiconductor product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of UV and Non-UV Tape for Semiconductor, with price, sales quantity, revenue, and global market share of UV and Non-UV Tape for Semiconductor from 2020 to 2025.
Chapter 3, the UV and Non-UV Tape for Semiconductor competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the UV and Non-UV Tape for Semiconductor breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and UV and Non-UV Tape for Semiconductor market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of UV and Non-UV Tape for Semiconductor.
Chapter 14 and 15, to describe UV and Non-UV Tape for Semiconductor sales channel, distributors, customers, research findings and conclusion.
Summary:
Get latest Market Research Reports on UV and Non-UV Tape for Semiconductor. Industry analysis & Market Report on UV and Non-UV Tape for Semiconductor is a syndicated market report, published as Global UV and Non-UV Tape for Semiconductor Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031. It is complete Research Study and Industry Analysis of UV and Non-UV Tape for Semiconductor market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.