Global Underfills for CSP and BGA Market Report, History and Forecast 2017-2028, Breakdown Data by Manufacturers, Key Regions, Types and Application

CSP/BGA Board Level Underfill is used for filling and sealing spaces by capillary action when doing secondary mounting of Packaged Chips to a Motherboard. CSP/BGA Board Level Underfill material improves thermal cycle performance and enhances impact resistance (drop-test qualification).
Market Insights

Due to the COVID-19 pandemic, the global Underfills for CSP and BGA market size is estimated to be worth US$ million in 2021 and is forecast to a readjusted size of US$ million by 2028 with a CAGR of % during the forecast period 2022-2028.

The global main manufacturers of Underfills for CSP and BGA include Namics, Henkel, ThreeBond, Won Chemical, AIM Solder, Fuji Chemical, Shenzhen Laucal Advanced Material, Dongguan Hanstars and Hengchuang Material. etc. In 2021, the global six largest players have a share approximately % in terms of revenue.

The North America Underfills for CSP and BGA market is estimated at US$ million in 2021, while China is forecast to reach US$ million by 2028. The proportion of the China is % in 2021 and it is predicted that the share will reach % in 2028, trailing a CAGR of % through the analysis period 2022-2028. As for the Europe Underfills for CSP and BGA landscape, Germany is projected to reach US$ million by 2028. and in Asia, the notable markets are Japan and South Korea, CAGR is % and % respectively for the next 6-year period.

Low Viscosity accounting for % of the Underfills for CSP and BGA global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR from 2022 to 2028. While CSP segment is altered to an % CAGR throughout this forecast period and will hold a share about % in 2028.

Segment Scope

An intensive study of key type and application segments has been done in this segmentation section. The authors of the report have provided reliable figures including sales and revenue forecast data by type and application for the period 2017-2028. They have also studied how the segments are gaining or losing growth in various geographies and their respective countries. Thanks to this study, readers can thoroughly grasp the growth pattern and potential of different segments.

Segment by Type

Low Viscosity

High Viscosity

Segment by Application

CSP

BGA

Regional Scope

This segment of the report offers a thorough regional study of the global Underfills for CSP and BGA market. Drivers and restraints for each region are broadly examined in the report. Readers will get familiar with the driving forces and challenges that are specific to the regions. The specialists have identified growth opportunities in key geographical regions and their respective countries to aid players to reinforce their presence. All the regions and their countries in the report are assessed based on the growth rate, revenue, and sales volume according to the consumption for the period 2017-2028. This geographical analysis will help readers to gain in-depth knowledge of the regional growth. The key geographical regions surveyed in this research report involve North America, Europe, Asia Pacific, Central and South America, and Middle East and Africa. The report has specifically covered major countries including United States, Canada, Germany, France, U.K., Italy, Russia, China, Japan, South Korea, India, Australia, China Taiwan, Indonesia, Thailand, Malaysia, Mexico, Brazil, Turkey, Saudi Arabia, UAE, etc.

Key Players

This section has provided an exhaustive analysis of the strategies that the companies are focusing on to stay ahead of other players. The strategies mainly involve research and development, new product developments, and mergers and acquisitions. The researchers have also provided revenue shares of the key companies, company overview, and the latest company developments so as to help players to sustain the cutthroat competition. In this section, the report offers global revenue and sales data of manufacturers for the period 2017-2022. Following is the list of key manufacturers observed in this research study:

Namics

Henkel

ThreeBond

Won Chemical

AIM Solder

Fuji Chemical

Shenzhen Laucal Advanced Material

Dongguan Hanstars

Hengchuang Material

Frequently Asked Questions

Which application segment captured the leading share in the Underfills for CSP and BGA market?

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Which technological trends are likely to affect the Underfills for CSP and BGA market?

What is the expected Underfills for CSP and BGA market size by 2028?

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Which region is projected to witness the fastest growth in the future?

What factors are restraining the Underfills for CSP and BGA market growth?

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