According to our (Global Info Research) latest study, the global Under Screen Fingerprint Module Packaging market size was valued at US$ 2446 million in 2025 and is forecast to a readjusted size of US$ 3294 million by 2032 with a CAGR of 4.4% during review period.
Under-screen fingerprint module packaging is a key technology that integrates optical or ultrasonic fingerprint sensors under the smartphone screen, ensuring that the sensor can achieve efficient fingerprint recognition without affecting the screen display effect. This packaging method not only improves the overall aesthetics and user experience of the device, but also makes it possible to achieve a higher screen-to-body ratio. Under-screen fingerprint modules are usually composed of multiple components, including optical sensors, microlens arrays, filters, and protective layers, which work together to capture high-quality fingerprint images.
This report is a detailed and comprehensive analysis for global Under Screen Fingerprint Module Packaging market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Under Screen Fingerprint Module Packaging market size and forecasts, in consumption value ($ Million), 2021-2032
Global Under Screen Fingerprint Module Packaging market size and forecasts by region and country, in consumption value ($ Million), 2021-2032
Global Under Screen Fingerprint Module Packaging market size and forecasts, by Type and by Application, in consumption value ($ Million), 2021-2032
Global Under Screen Fingerprint Module Packaging market shares of main players, in revenue ($ Million), 2021-2026
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Under Screen Fingerprint Module Packaging
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Under Screen Fingerprint Module Packaging market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Samsung Electronics, TDK, OFILM Group, Q Technology Group, BYD Semiconductor, GIS Taiwan, Truly Opto-electronics, Primax Electronics, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market segmentation
Under Screen Fingerprint Module Packaging market is split by Type and by Application. For the period 2021-2032, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Optical Type
Ultrasonic Type
Capacitive Type
Market segment by Application
Smartphone
Tablet
Smart Door Lock
Others
Market segment by players, this report covers
Samsung Electronics
TDK
OFILM Group
Q Technology Group
BYD Semiconductor
GIS Taiwan
Truly Opto-electronics
Primax Electronics
Market segment by regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia, Italy and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia and Rest of Asia-Pacific)
South America (Brazil, Rest of South America)
Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)
The content of the study subjects, includes a total of 13 chapters:
Chapter 1, to describe Under Screen Fingerprint Module Packaging product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top players of Under Screen Fingerprint Module Packaging, with revenue, gross margin, and global market share of Under Screen Fingerprint Module Packaging from 2021 to 2026.
Chapter 3, the Under Screen Fingerprint Module Packaging competitive situation, revenue, and global market share of top players are analyzed emphatically by landscape contrast.
Chapter 4 and 5, to segment the market size by Type and by Application, with consumption value and growth rate by Type, by Application, from 2021 to 2032.
Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2021 to 2026.and Under Screen Fingerprint Module Packaging market forecast, by regions, by Type and by Application, with consumption value, from 2027 to 2032.
Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis.
Chapter 12, the key raw materials and key suppliers, and industry chain of Under Screen Fingerprint Module Packaging.
Chapter 13, to describe Under Screen Fingerprint Module Packaging research findings and conclusion.
Summary:
Get latest Market Research Reports on Under Screen Fingerprint Module Packaging. Industry analysis & Market Report on Under Screen Fingerprint Module Packaging is a syndicated market report, published as Global Under Screen Fingerprint Module Packaging Market 2026 by Company, Regions, Type and Application, Forecast to 2032. It is complete Research Study and Industry Analysis of Under Screen Fingerprint Module Packaging market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.