Report Detail
Global Thin Wafer Temporary Bonding Adhesive Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029
- RnM4540914 |
- 19 July, 2023 |
- Global |
- 94 Pages |
- GIR (Global Info Research) |
- Chemical & Material
According to our (Global Info Research) latest study, the global Thin Wafer Temporary Bonding Adhesive market size was valued at USD 183.2 million in 2022 and is forecast to a readjusted size of USD 343 million by 2029 with a CAGR of 9.4% during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Thin Wafer Temporary Bonding Adhesive can bonded with different surface, This product can be used for backside processes such as fixing, thinning, etching, passivation, electroplating, and reflow soldering of thin wafers below 100μm.
This report is a detailed and comprehensive analysis for global Thin Wafer Temporary Bonding Adhesive market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2023, are provided.
Key Features:
Global Thin Wafer Temporary Bonding Adhesive market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2018-2029
Global Thin Wafer Temporary Bonding Adhesive market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2018-2029
Global Thin Wafer Temporary Bonding Adhesive market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2018-2029
Global Thin Wafer Temporary Bonding Adhesive market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/Ton), 2018-2023
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Thin Wafer Temporary Bonding Adhesive
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Thin Wafer Temporary Bonding Adhesive market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include 3M, Daxin Materials, Brewer Science, AI Technology and YINCAE Advanced Materials, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.
Market Segmentation
Thin Wafer Temporary Bonding Adhesive market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Thermal Slide-off Debonding
Mechanical Debonding
Laser Debonding
Market segment by Application
MEMS
Advanced Packaging
CMOS
Other
Major players covered
3M
Daxin Materials
Brewer Science
AI Technology
YINCAE Advanced Materials
Micro Materials
Promerus
Daetec
Suntific Materials
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Thin Wafer Temporary Bonding Adhesive product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Thin Wafer Temporary Bonding Adhesive, with price, sales, revenue and global market share of Thin Wafer Temporary Bonding Adhesive from 2018 to 2023.
Chapter 3, the Thin Wafer Temporary Bonding Adhesive competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Thin Wafer Temporary Bonding Adhesive breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2018 to 2029.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2018 to 2029.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2022.and Thin Wafer Temporary Bonding Adhesive market forecast, by regions, type and application, with sales and revenue, from 2024 to 2029.
Chapter 12, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War.
Chapter 13, the key raw materials and key suppliers, and industry chain of Thin Wafer Temporary Bonding Adhesive.
Chapter 14 and 15, to describe Thin Wafer Temporary Bonding Adhesive sales channel, distributors, customers, research findings and conclusion.
1 Market Overview
- 1.1 Product Overview and Scope of Thin Wafer Temporary Bonding Adhesive
- 1.2 Market Estimation Caveats and Base Year
- 1.3 Market Analysis by Type
- 1.3.1 Overview: Global Thin Wafer Temporary Bonding Adhesive Consumption Value by Type: 2018 Versus 2022 Versus 2029
- 1.3.2 Thermal Slide-off Debonding
- 1.3.3 Mechanical Debonding
- 1.3.4 Laser Debonding
- 1.4 Market Analysis by Application
- 1.4.1 Overview: Global Thin Wafer Temporary Bonding Adhesive Consumption Value by Application: 2018 Versus 2022 Versus 2029
- 1.4.2 MEMS
- 1.4.3 Advanced Packaging
- 1.4.4 CMOS
- 1.4.5 Other
- 1.5 Global Thin Wafer Temporary Bonding Adhesive Market Size & Forecast
- 1.5.1 Global Thin Wafer Temporary Bonding Adhesive Consumption Value (2018 & 2022 & 2029)
- 1.5.2 Global Thin Wafer Temporary Bonding Adhesive Sales Quantity (2018-2029)
- 1.5.3 Global Thin Wafer Temporary Bonding Adhesive Average Price (2018-2029)
2 Manufacturers Profiles
- 2.1 3M
- 2.1.1 3M Details
- 2.1.2 3M Major Business
- 2.1.3 3M Thin Wafer Temporary Bonding Adhesive Product and Services
- 2.1.4 3M Thin Wafer Temporary Bonding Adhesive Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
- 2.1.5 3M Recent Developments/Updates
- 2.2 Daxin Materials
- 2.2.1 Daxin Materials Details
- 2.2.2 Daxin Materials Major Business
- 2.2.3 Daxin Materials Thin Wafer Temporary Bonding Adhesive Product and Services
- 2.2.4 Daxin Materials Thin Wafer Temporary Bonding Adhesive Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
- 2.2.5 Daxin Materials Recent Developments/Updates
- 2.3 Brewer Science
- 2.3.1 Brewer Science Details
- 2.3.2 Brewer Science Major Business
- 2.3.3 Brewer Science Thin Wafer Temporary Bonding Adhesive Product and Services
- 2.3.4 Brewer Science Thin Wafer Temporary Bonding Adhesive Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
- 2.3.5 Brewer Science Recent Developments/Updates
- 2.4 AI Technology
- 2.4.1 AI Technology Details
- 2.4.2 AI Technology Major Business
- 2.4.3 AI Technology Thin Wafer Temporary Bonding Adhesive Product and Services
- 2.4.4 AI Technology Thin Wafer Temporary Bonding Adhesive Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
- 2.4.5 AI Technology Recent Developments/Updates
- 2.5 YINCAE Advanced Materials
- 2.5.1 YINCAE Advanced Materials Details
- 2.5.2 YINCAE Advanced Materials Major Business
- 2.5.3 YINCAE Advanced Materials Thin Wafer Temporary Bonding Adhesive Product and Services
- 2.5.4 YINCAE Advanced Materials Thin Wafer Temporary Bonding Adhesive Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
- 2.5.5 YINCAE Advanced Materials Recent Developments/Updates
- 2.6 Micro Materials
- 2.6.1 Micro Materials Details
- 2.6.2 Micro Materials Major Business
- 2.6.3 Micro Materials Thin Wafer Temporary Bonding Adhesive Product and Services
- 2.6.4 Micro Materials Thin Wafer Temporary Bonding Adhesive Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
- 2.6.5 Micro Materials Recent Developments/Updates
- 2.7 Promerus
- 2.7.1 Promerus Details
- 2.7.2 Promerus Major Business
- 2.7.3 Promerus Thin Wafer Temporary Bonding Adhesive Product and Services
- 2.7.4 Promerus Thin Wafer Temporary Bonding Adhesive Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
- 2.7.5 Promerus Recent Developments/Updates
- 2.8 Daetec
- 2.8.1 Daetec Details
- 2.8.2 Daetec Major Business
- 2.8.3 Daetec Thin Wafer Temporary Bonding Adhesive Product and Services
- 2.8.4 Daetec Thin Wafer Temporary Bonding Adhesive Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
- 2.8.5 Daetec Recent Developments/Updates
- 2.9 Suntific Materials
- 2.9.1 Suntific Materials Details
- 2.9.2 Suntific Materials Major Business
- 2.9.3 Suntific Materials Thin Wafer Temporary Bonding Adhesive Product and Services
- 2.9.4 Suntific Materials Thin Wafer Temporary Bonding Adhesive Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
- 2.9.5 Suntific Materials Recent Developments/Updates
3 Competitive Environment: Thin Wafer Temporary Bonding Adhesive by Manufacturer
- 3.1 Global Thin Wafer Temporary Bonding Adhesive Sales Quantity by Manufacturer (2018-2023)
- 3.2 Global Thin Wafer Temporary Bonding Adhesive Revenue by Manufacturer (2018-2023)
- 3.3 Global Thin Wafer Temporary Bonding Adhesive Average Price by Manufacturer (2018-2023)
- 3.4 Market Share Analysis (2022)
- 3.4.1 Producer Shipments of Thin Wafer Temporary Bonding Adhesive by Manufacturer Revenue ($MM) and Market Share (%): 2022
- 3.4.2 Top 3 Thin Wafer Temporary Bonding Adhesive Manufacturer Market Share in 2022
- 3.4.2 Top 6 Thin Wafer Temporary Bonding Adhesive Manufacturer Market Share in 2022
- 3.5 Thin Wafer Temporary Bonding Adhesive Market: Overall Company Footprint Analysis
- 3.5.1 Thin Wafer Temporary Bonding Adhesive Market: Region Footprint
- 3.5.2 Thin Wafer Temporary Bonding Adhesive Market: Company Product Type Footprint
- 3.5.3 Thin Wafer Temporary Bonding Adhesive Market: Company Product Application Footprint
- 3.6 New Market Entrants and Barriers to Market Entry
- 3.7 Mergers, Acquisition, Agreements, and Collaborations
4 Consumption Analysis by Region
- 4.1 Global Thin Wafer Temporary Bonding Adhesive Market Size by Region
- 4.1.1 Global Thin Wafer Temporary Bonding Adhesive Sales Quantity by Region (2018-2029)
- 4.1.2 Global Thin Wafer Temporary Bonding Adhesive Consumption Value by Region (2018-2029)
- 4.1.3 Global Thin Wafer Temporary Bonding Adhesive Average Price by Region (2018-2029)
- 4.2 North America Thin Wafer Temporary Bonding Adhesive Consumption Value (2018-2029)
- 4.3 Europe Thin Wafer Temporary Bonding Adhesive Consumption Value (2018-2029)
- 4.4 Asia-Pacific Thin Wafer Temporary Bonding Adhesive Consumption Value (2018-2029)
- 4.5 South America Thin Wafer Temporary Bonding Adhesive Consumption Value (2018-2029)
- 4.6 Middle East and Africa Thin Wafer Temporary Bonding Adhesive Consumption Value (2018-2029)
5 Market Segment by Type
- 5.1 Global Thin Wafer Temporary Bonding Adhesive Sales Quantity by Type (2018-2029)
- 5.2 Global Thin Wafer Temporary Bonding Adhesive Consumption Value by Type (2018-2029)
- 5.3 Global Thin Wafer Temporary Bonding Adhesive Average Price by Type (2018-2029)
6 Market Segment by Application
- 6.1 Global Thin Wafer Temporary Bonding Adhesive Sales Quantity by Application (2018-2029)
- 6.2 Global Thin Wafer Temporary Bonding Adhesive Consumption Value by Application (2018-2029)
- 6.3 Global Thin Wafer Temporary Bonding Adhesive Average Price by Application (2018-2029)
7 North America
- 7.1 North America Thin Wafer Temporary Bonding Adhesive Sales Quantity by Type (2018-2029)
- 7.2 North America Thin Wafer Temporary Bonding Adhesive Sales Quantity by Application (2018-2029)
- 7.3 North America Thin Wafer Temporary Bonding Adhesive Market Size by Country
- 7.3.1 North America Thin Wafer Temporary Bonding Adhesive Sales Quantity by Country (2018-2029)
- 7.3.2 North America Thin Wafer Temporary Bonding Adhesive Consumption Value by Country (2018-2029)
- 7.3.3 United States Market Size and Forecast (2018-2029)
- 7.3.4 Canada Market Size and Forecast (2018-2029)
- 7.3.5 Mexico Market Size and Forecast (2018-2029)
8 Europe
- 8.1 Europe Thin Wafer Temporary Bonding Adhesive Sales Quantity by Type (2018-2029)
- 8.2 Europe Thin Wafer Temporary Bonding Adhesive Sales Quantity by Application (2018-2029)
- 8.3 Europe Thin Wafer Temporary Bonding Adhesive Market Size by Country
- 8.3.1 Europe Thin Wafer Temporary Bonding Adhesive Sales Quantity by Country (2018-2029)
- 8.3.2 Europe Thin Wafer Temporary Bonding Adhesive Consumption Value by Country (2018-2029)
- 8.3.3 Germany Market Size and Forecast (2018-2029)
- 8.3.4 France Market Size and Forecast (2018-2029)
- 8.3.5 United Kingdom Market Size and Forecast (2018-2029)
- 8.3.6 Russia Market Size and Forecast (2018-2029)
- 8.3.7 Italy Market Size and Forecast (2018-2029)
9 Asia-Pacific
- 9.1 Asia-Pacific Thin Wafer Temporary Bonding Adhesive Sales Quantity by Type (2018-2029)
- 9.2 Asia-Pacific Thin Wafer Temporary Bonding Adhesive Sales Quantity by Application (2018-2029)
- 9.3 Asia-Pacific Thin Wafer Temporary Bonding Adhesive Market Size by Region
- 9.3.1 Asia-Pacific Thin Wafer Temporary Bonding Adhesive Sales Quantity by Region (2018-2029)
- 9.3.2 Asia-Pacific Thin Wafer Temporary Bonding Adhesive Consumption Value by Region (2018-2029)
- 9.3.3 China Market Size and Forecast (2018-2029)
- 9.3.4 Japan Market Size and Forecast (2018-2029)
- 9.3.5 Korea Market Size and Forecast (2018-2029)
- 9.3.6 India Market Size and Forecast (2018-2029)
- 9.3.7 Southeast Asia Market Size and Forecast (2018-2029)
- 9.3.8 Australia Market Size and Forecast (2018-2029)
10 South America
- 10.1 South America Thin Wafer Temporary Bonding Adhesive Sales Quantity by Type (2018-2029)
- 10.2 South America Thin Wafer Temporary Bonding Adhesive Sales Quantity by Application (2018-2029)
- 10.3 South America Thin Wafer Temporary Bonding Adhesive Market Size by Country
- 10.3.1 South America Thin Wafer Temporary Bonding Adhesive Sales Quantity by Country (2018-2029)
- 10.3.2 South America Thin Wafer Temporary Bonding Adhesive Consumption Value by Country (2018-2029)
- 10.3.3 Brazil Market Size and Forecast (2018-2029)
- 10.3.4 Argentina Market Size and Forecast (2018-2029)
11 Middle East & Africa
- 11.1 Middle East & Africa Thin Wafer Temporary Bonding Adhesive Sales Quantity by Type (2018-2029)
- 11.2 Middle East & Africa Thin Wafer Temporary Bonding Adhesive Sales Quantity by Application (2018-2029)
- 11.3 Middle East & Africa Thin Wafer Temporary Bonding Adhesive Market Size by Country
- 11.3.1 Middle East & Africa Thin Wafer Temporary Bonding Adhesive Sales Quantity by Country (2018-2029)
- 11.3.2 Middle East & Africa Thin Wafer Temporary Bonding Adhesive Consumption Value by Country (2018-2029)
- 11.3.3 Turkey Market Size and Forecast (2018-2029)
- 11.3.4 Egypt Market Size and Forecast (2018-2029)
- 11.3.5 Saudi Arabia Market Size and Forecast (2018-2029)
- 11.3.6 South Africa Market Size and Forecast (2018-2029)
12 Market Dynamics
- 12.1 Thin Wafer Temporary Bonding Adhesive Market Drivers
- 12.2 Thin Wafer Temporary Bonding Adhesive Market Restraints
- 12.3 Thin Wafer Temporary Bonding Adhesive Trends Analysis
- 12.4 Porters Five Forces Analysis
- 12.4.1 Threat of New Entrants
- 12.4.2 Bargaining Power of Suppliers
- 12.4.3 Bargaining Power of Buyers
- 12.4.4 Threat of Substitutes
- 12.4.5 Competitive Rivalry
- 12.5 Influence of COVID-19 and Russia-Ukraine War
- 12.5.1 Influence of COVID-19
- 12.5.2 Influence of Russia-Ukraine War
13 Raw Material and Industry Chain
- 13.1 Raw Material of Thin Wafer Temporary Bonding Adhesive and Key Manufacturers
- 13.2 Manufacturing Costs Percentage of Thin Wafer Temporary Bonding Adhesive
- 13.3 Thin Wafer Temporary Bonding Adhesive Production Process
- 13.4 Thin Wafer Temporary Bonding Adhesive Industrial Chain
14 Shipments by Distribution Channel
- 14.1 Sales Channel
- 14.1.1 Direct to End-User
- 14.1.2 Distributors
- 14.2 Thin Wafer Temporary Bonding Adhesive Typical Distributors
- 14.3 Thin Wafer Temporary Bonding Adhesive Typical Customers
15 Research Findings and Conclusion
16 Appendix
- 16.1 Methodology
- 16.2 Research Process and Data Source
Summary:
Get latest Market Research Reports on Thin Wafer Temporary Bonding Adhesive. Industry analysis & Market Report on Thin Wafer Temporary Bonding Adhesive is a syndicated market report, published as Global Thin Wafer Temporary Bonding Adhesive Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029. It is complete Research Study and Industry Analysis of Thin Wafer Temporary Bonding Adhesive market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.
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