According to our (Global Info Research) latest study, the global Thermal Spray Coatings for Semiconductor Equipment market size was valued at US$ 673 million in 2025 and is forecast to a readjusted size of US$ 986 million by 2032 with a CAGR of 5.6% during review period.
Manufacturing silicon wafers and semiconductors require a harsh environment. This abrasive environment dramatically shortens the life of chamber components used to house the process, threatening the quality of the highly sensitive products. This report studies the coating service for semiconductor equipment parts, like chambers, showerhead (GDP), electrostatic chuck (ESC), liners, baffle, shield cover, heater, shutter, focus ring, edge ring, ceramic window, etch gas injector, etc.
North American market for thermal spray coatings for semiconductor equipment is estimated to increase from $ 220.58 million in 2024 to reach $ 326.14 million by 2031, at a CAGR of 6.07% during the forecast period of 2025 through 2031.
Asia-Pacific market for thermal spray coatings for semiconductor equipment is estimated to increase from $ 407.53 million in 2024 to reach $ 674.74 million by 2031, at a CAGR of 7.86% during the forecast period of 2025 through 2031.
Europe market for thermal spray coatings for semiconductor equipment is estimated to increase from $ 66.62 million in 2024 to reach $ 91.83 million by 2031, at a CAGR of 5.32% during the forecast period of 2025 through 2031.
In terms of coating materials, ceramic coating is dominating the market, with a share about 69.39%. And in terms coating technology, plasma spray coating in the largest segment, holds 72.48 percent in 2024, and will reach 74.68% in 2031. In next few years, the PVD, CVD & ALD Coating technology will grow faster.
Currently etching is the largest application, has a share about 45.18%, followed by thin film (CVD, PVD, ALD), and Ion Implant.
The key players of coating service are mainly located in the USA, Germany, Japan, South Korea, China Taiwan, Singapore, and China Mainland. The global top five players hold a share about 58.52%, while top 10 players occupied over 72.73 percent. The global PVD, CVD and ALD coating method market is dominated by companies from USA, Japan, South Korea, and Europe. Key companies of PVD, CVD and ALD coating method include KoMiCo, Cinos, TOCALO, WONIK QnC, Beneq, Entegris, Inficon and Oerlikon Balzers. Top five players occupy for over 74% market share in 2024.
In the North America market, the key players are UCT (Quantum Clean), Pentagon Technologies, Enpro Industries (NxEdge), Mitsubishi Chemical (Cleanpart), KoMiCo (USA division), FM Industries, Oerlikon Balzers, Beneq, APS Materials, Inc., Entegris, and SilcoTek, etc. In 2024, the North America top five players had a share approximately 65% in terms of revenue.
In the China Taiwan market, the key players are UCT (Ultra Clean Holdings, Inc), Enpro Industries, TOCALO Co., Ltd., Mitsubishi Chemical (Cleanpart), KoMiCo, KERTZ HIGH TECH, Hung Jie Technology Corporation, and HTCSolar, etc.
In Japan, the key player is TOCALO Co., Ltd., etc.
In South Korea, the key players are KoMiCo, UCT (Ultra Clean Holdings, Inc), Cinos, Hansol IONES, WONIK QnC, DFtech, TOPWINTECH, FEMVIX, SEWON HARDFACING CO., LTD, and Value Engineering Co., Ltd, etc.
In China mainland market, the key players are KoMiCo, Cinos, TOCALO Co., Ltd., DFtech, Jiangsu Kaiweitesi Semiconductor Technology Co., Ltd., HCUT Co., Ltd, Ferrotec (Anhui) Technology Development Co., Ltd, Shanghai Companion, Chongqing Genori Technology Co., Ltd, and GRAND HITEK, etc.
Over the next 3–5 years, coating services for semiconductor fabrication equipment parts should show structural growth tied to both capex momentum and the expanding installed base, with an accelerating upgrade cycle toward higher-end materials and denser process routes. SEMI projects global semiconductor manufacturing equipment sales to rise for three consecutive years and reach about $156B in 2027, driven primarily by AI-related investments in leading-edge logic and advanced memory (including technology migration and 3D architectures), which implies higher intensity and larger fleets of etch/deposition tools—and therefore a larger recurring need for particle control, contamination risk reduction, and uptime preservation through recoating and surface protection. Technology pathways are likely to stratify: plasma spray remains the volume workhorse, but harsher plasma duty cycles make coating degradation and particle shedding more consequential, strengthening the pull toward denser, cleaner thin-film and hybrid multilayer approaches (PVD/ALD and composite stacks are explicitly positioned to reduce particles, improve process control, and extend component life). In parallel, the materials roadmap continues to broaden from single oxides toward fluorine-containing yttrium systems (fluorides/oxyfluorides) and complex oxides; YOF/YF₃ are widely discussed as promising plasma-resistant alternatives to yttria under fluorine-rich chemistries, while upstream suppliers already commercialize granulated thermal-spray powders spanning yttrium oxides, fluorides, oxyfluorides, and complex oxides—helping move material innovation from lab exploration to engineering-scale supply. Overall, the sector’s upside will be increasingly determined by qualification depth and data-backed reliability (particles/trace contamination/lifetime) and by high-purity powder availability plus regionalized service delivery near fab clusters—trends reinforced by SEMI’s outlook that equipment spending growth is broad-based across regions and supported by incentives and regionalization efforts.
This report is a detailed and comprehensive analysis for global Thermal Spray Coatings for Semiconductor Equipment market. Both quantitative and qualitative analyses are presented by company, by region & country, by Material Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Thermal Spray Coatings for Semiconductor Equipment market size and forecasts, in consumption value ($ Million), 2021-2032
Global Thermal Spray Coatings for Semiconductor Equipment market size and forecasts by region and country, in consumption value ($ Million), 2021-2032
Global Thermal Spray Coatings for Semiconductor Equipment market size and forecasts, by Material Type and by Application, in consumption value ($ Million), 2021-2032
Global Thermal Spray Coatings for Semiconductor Equipment market shares of main players, in revenue ($ Million), 2021-2026
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Thermal Spray Coatings for Semiconductor Equipment
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Thermal Spray Coatings for Semiconductor Equipment market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include TOCALO Co., Ltd., KoMiCo, UCT (Ultra Clean Holdings, Inc), Cinos, Enpro Industries, Pentagon Technologies, Mitsubishi Chemical (Cleanpart), Oerlikon Balzers, Frontken Corporation Berhad, Hansol IONES, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market segmentation
Thermal Spray Coatings for Semiconductor Equipment market is split by Material Type and by Application. For the period 2021-2032, the growth among segments provides accurate calculations and forecasts for Consumption Value by Material Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Material Type
Ceramic Coating
Metal & Alloy Coating
Market segment by Technology
Plasma Spray Coating
Arc Spray Coating
PVD, CVD & ALD Coating
Market segment by Process Node
High End / Advanced <14nm
Mid End 18/22/28-90nm
Low End >110nm
Market segment by Application
Etching
Thin Film
Diffusion
Ion Implant
Others
Market segment by players, this report covers
TOCALO Co., Ltd.
KoMiCo
UCT (Ultra Clean Holdings, Inc)
Cinos
Enpro Industries
Pentagon Technologies
Mitsubishi Chemical (Cleanpart)
Oerlikon Balzers
Frontken Corporation Berhad
Hansol IONES
Jiangsu Kaiweitesi Semiconductor
FM Industries
KERTZ HIGH TECH
TOPWINTECH
SilcoTek
APS Materials, Inc.
Entegris
Ferrotec (Anhui) Technology Development
DFtech
WONIK QnC
FEMVIX
GRAND HITEK
HCUT Co., Ltd
Shanghai Companion
Hung Jie Technology Corporation
Alumiplate
Value Engineering Co., Ltd
Beneq
Persys Group
HTCSolar
ASSET Solutions, Inc.
Inficon
Vivid Inc.
SEWON HARDFACING
Alcadyne
Chongqing Genori Technology
Market segment by regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia, Italy and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia and Rest of Asia-Pacific)
South America (Brazil, Rest of South America)
Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)
The content of the study subjects, includes a total of 13 chapters:
Chapter 1, to describe Thermal Spray Coatings for Semiconductor Equipment product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top players of Thermal Spray Coatings for Semiconductor Equipment, with revenue, gross margin, and global market share of Thermal Spray Coatings for Semiconductor Equipment from 2021 to 2026.
Chapter 3, the Thermal Spray Coatings for Semiconductor Equipment competitive situation, revenue, and global market share of top players are analyzed emphatically by landscape contrast.
Chapter 4 and 5, to segment the market size by Material Type and by Application, with consumption value and growth rate by Material Type, by Application, from 2021 to 2032.
Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2021 to 2026.and Thermal Spray Coatings for Semiconductor Equipment market forecast, by regions, by Material Type and by Application, with consumption value, from 2027 to 2032.
Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis.
Chapter 12, the key raw materials and key suppliers, and industry chain of Thermal Spray Coatings for Semiconductor Equipment.
Chapter 13, to describe Thermal Spray Coatings for Semiconductor Equipment research findings and conclusion.
Summary:
Get latest Market Research Reports on Thermal Spray Coatings for Semiconductor Equipment. Industry analysis & Market Report on Thermal Spray Coatings for Semiconductor Equipment is a syndicated market report, published as Global Thermal Spray Coatings for Semiconductor Equipment Market 2026 by Company, Regions, Type and Application, Forecast to 2032. It is complete Research Study and Industry Analysis of Thermal Spray Coatings for Semiconductor Equipment market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.