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Chemical & Material Global Thermal Pad for Board-Level Packaging Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

  • RnM4644883
    • |
  • 09 November, 2025
    • |
  • Global
    • |
  • 106 Pages
    • |
  • GIR
    • |
  • Chemical & Material

According to our (Global Info Research) latest study, the global Thermal Pad for Board-Level Packaging market size was valued at US$ million in 2024 and is forecast to a readjusted size of USD million by 2031 with a CAGR of %during review period.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
Thermal pads for board-level packaging are specially designed thermal conductive materials that are used between PCB and packaged electronic components to help heat conduction effectively to prevent overheating of electronic components that may affect performance or shorten life. They are usually made of soft thermally conductive silicone, thermally conductive ceramic powder and other materials, and have good thermal conductivity and electrical insulation, making them suitable for dual functions of heat conduction and buffering in electronic packaging.
This report is a detailed and comprehensive analysis for global Thermal Pad for Board-Level Packaging market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Thermal Pad for Board-Level Packaging market size and forecasts, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sq m), 2020-2031
Global Thermal Pad for Board-Level Packaging market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sq m), 2020-2031
Global Thermal Pad for Board-Level Packaging market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sq m), 2020-2031
Global Thermal Pad for Board-Level Packaging market shares of main players, shipments in revenue ($ Million), sales quantity (K Sqm), and ASP (US$/Sq m), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Thermal Pad for Board-Level Packaging
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Thermal Pad for Board-Level Packaging market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Henkel Adhesives, DuPont, 3M, Rogers Corporation, Shin-Etsu Chemical, Fujipoly, Dow, Honeywell, Zhsio, Darbond, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Thermal Pad for Board-Level Packaging market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Silicone Thermal Pad
Ceramic Thermal Pad
Market segment by Application
PCB
LED
Others
Major players covered
Henkel Adhesives
DuPont
3M
Rogers Corporation
Shin-Etsu Chemical
Fujipoly
Dow
Honeywell
Zhsio
Darbond
Goldlink Tongda Electronics
Cybrid Technologies
Aok Technologies
Bornsun Composite Materials
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Thermal Pad for Board-Level Packaging product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Thermal Pad for Board-Level Packaging, with price, sales quantity, revenue, and global market share of Thermal Pad for Board-Level Packaging from 2020 to 2025.
Chapter 3, the Thermal Pad for Board-Level Packaging competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Thermal Pad for Board-Level Packaging breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Thermal Pad for Board-Level Packaging market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Thermal Pad for Board-Level Packaging.
Chapter 14 and 15, to describe Thermal Pad for Board-Level Packaging sales channel, distributors, customers, research findings and conclusion.


1 Market Overview

  • 1.1 Product Overview and Scope
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Market Analysis by Type
    • 1.3.1 Overview: Global Thermal Pad for Board-Level Packaging Consumption Value by Type: 2020 Versus 2024 Versus 2031
    • 1.3.2 Silicone Thermal Pad
    • 1.3.3 Ceramic Thermal Pad
  • 1.4 Market Analysis by Application
    • 1.4.1 Overview: Global Thermal Pad for Board-Level Packaging Consumption Value by Application: 2020 Versus 2024 Versus 2031
    • 1.4.2 PCB
    • 1.4.3 LED
    • 1.4.4 Others
  • 1.5 Global Thermal Pad for Board-Level Packaging Market Size & Forecast
    • 1.5.1 Global Thermal Pad for Board-Level Packaging Consumption Value (2020 & 2024 & 2031)
    • 1.5.2 Global Thermal Pad for Board-Level Packaging Sales Quantity (2020-2031)
    • 1.5.3 Global Thermal Pad for Board-Level Packaging Average Price (2020-2031)

2 Manufacturers Profiles

  • 2.1 Henkel Adhesives
    • 2.1.1 Henkel Adhesives Details
    • 2.1.2 Henkel Adhesives Major Business
    • 2.1.3 Henkel Adhesives Thermal Pad for Board-Level Packaging Product and Services
    • 2.1.4 Henkel Adhesives Thermal Pad for Board-Level Packaging Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.1.5 Henkel Adhesives Recent Developments/Updates
  • 2.2 DuPont
    • 2.2.1 DuPont Details
    • 2.2.2 DuPont Major Business
    • 2.2.3 DuPont Thermal Pad for Board-Level Packaging Product and Services
    • 2.2.4 DuPont Thermal Pad for Board-Level Packaging Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.2.5 DuPont Recent Developments/Updates
  • 2.3 3M
    • 2.3.1 3M Details
    • 2.3.2 3M Major Business
    • 2.3.3 3M Thermal Pad for Board-Level Packaging Product and Services
    • 2.3.4 3M Thermal Pad for Board-Level Packaging Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.3.5 3M Recent Developments/Updates
  • 2.4 Rogers Corporation
    • 2.4.1 Rogers Corporation Details
    • 2.4.2 Rogers Corporation Major Business
    • 2.4.3 Rogers Corporation Thermal Pad for Board-Level Packaging Product and Services
    • 2.4.4 Rogers Corporation Thermal Pad for Board-Level Packaging Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.4.5 Rogers Corporation Recent Developments/Updates
  • 2.5 Shin-Etsu Chemical
    • 2.5.1 Shin-Etsu Chemical Details
    • 2.5.2 Shin-Etsu Chemical Major Business
    • 2.5.3 Shin-Etsu Chemical Thermal Pad for Board-Level Packaging Product and Services
    • 2.5.4 Shin-Etsu Chemical Thermal Pad for Board-Level Packaging Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.5.5 Shin-Etsu Chemical Recent Developments/Updates
  • 2.6 Fujipoly
    • 2.6.1 Fujipoly Details
    • 2.6.2 Fujipoly Major Business
    • 2.6.3 Fujipoly Thermal Pad for Board-Level Packaging Product and Services
    • 2.6.4 Fujipoly Thermal Pad for Board-Level Packaging Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.6.5 Fujipoly Recent Developments/Updates
  • 2.7 Dow
    • 2.7.1 Dow Details
    • 2.7.2 Dow Major Business
    • 2.7.3 Dow Thermal Pad for Board-Level Packaging Product and Services
    • 2.7.4 Dow Thermal Pad for Board-Level Packaging Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.7.5 Dow Recent Developments/Updates
  • 2.8 Honeywell
    • 2.8.1 Honeywell Details
    • 2.8.2 Honeywell Major Business
    • 2.8.3 Honeywell Thermal Pad for Board-Level Packaging Product and Services
    • 2.8.4 Honeywell Thermal Pad for Board-Level Packaging Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.8.5 Honeywell Recent Developments/Updates
  • 2.9 Zhsio
    • 2.9.1 Zhsio Details
    • 2.9.2 Zhsio Major Business
    • 2.9.3 Zhsio Thermal Pad for Board-Level Packaging Product and Services
    • 2.9.4 Zhsio Thermal Pad for Board-Level Packaging Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.9.5 Zhsio Recent Developments/Updates
  • 2.10 Darbond
    • 2.10.1 Darbond Details
    • 2.10.2 Darbond Major Business
    • 2.10.3 Darbond Thermal Pad for Board-Level Packaging Product and Services
    • 2.10.4 Darbond Thermal Pad for Board-Level Packaging Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.10.5 Darbond Recent Developments/Updates
  • 2.11 Goldlink Tongda Electronics
    • 2.11.1 Goldlink Tongda Electronics Details
    • 2.11.2 Goldlink Tongda Electronics Major Business
    • 2.11.3 Goldlink Tongda Electronics Thermal Pad for Board-Level Packaging Product and Services
    • 2.11.4 Goldlink Tongda Electronics Thermal Pad for Board-Level Packaging Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.11.5 Goldlink Tongda Electronics Recent Developments/Updates
  • 2.12 Cybrid Technologies
    • 2.12.1 Cybrid Technologies Details
    • 2.12.2 Cybrid Technologies Major Business
    • 2.12.3 Cybrid Technologies Thermal Pad for Board-Level Packaging Product and Services
    • 2.12.4 Cybrid Technologies Thermal Pad for Board-Level Packaging Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.12.5 Cybrid Technologies Recent Developments/Updates
  • 2.13 Aok Technologies
    • 2.13.1 Aok Technologies Details
    • 2.13.2 Aok Technologies Major Business
    • 2.13.3 Aok Technologies Thermal Pad for Board-Level Packaging Product and Services
    • 2.13.4 Aok Technologies Thermal Pad for Board-Level Packaging Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.13.5 Aok Technologies Recent Developments/Updates
  • 2.14 Bornsun Composite Materials
    • 2.14.1 Bornsun Composite Materials Details
    • 2.14.2 Bornsun Composite Materials Major Business
    • 2.14.3 Bornsun Composite Materials Thermal Pad for Board-Level Packaging Product and Services
    • 2.14.4 Bornsun Composite Materials Thermal Pad for Board-Level Packaging Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.14.5 Bornsun Composite Materials Recent Developments/Updates

3 Competitive Environment: Thermal Pad for Board-Level Packaging by Manufacturer

  • 3.1 Global Thermal Pad for Board-Level Packaging Sales Quantity by Manufacturer (2020-2025)
  • 3.2 Global Thermal Pad for Board-Level Packaging Revenue by Manufacturer (2020-2025)
  • 3.3 Global Thermal Pad for Board-Level Packaging Average Price by Manufacturer (2020-2025)
  • 3.4 Market Share Analysis (2024)
    • 3.4.1 Producer Shipments of Thermal Pad for Board-Level Packaging by Manufacturer Revenue ($MM) and Market Share (%): 2024
    • 3.4.2 Top 3 Thermal Pad for Board-Level Packaging Manufacturer Market Share in 2024
    • 3.4.3 Top 6 Thermal Pad for Board-Level Packaging Manufacturer Market Share in 2024
  • 3.5 Thermal Pad for Board-Level Packaging Market: Overall Company Footprint Analysis
    • 3.5.1 Thermal Pad for Board-Level Packaging Market: Region Footprint
    • 3.5.2 Thermal Pad for Board-Level Packaging Market: Company Product Type Footprint
    • 3.5.3 Thermal Pad for Board-Level Packaging Market: Company Product Application Footprint
  • 3.6 New Market Entrants and Barriers to Market Entry
  • 3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

  • 4.1 Global Thermal Pad for Board-Level Packaging Market Size by Region
    • 4.1.1 Global Thermal Pad for Board-Level Packaging Sales Quantity by Region (2020-2031)
    • 4.1.2 Global Thermal Pad for Board-Level Packaging Consumption Value by Region (2020-2031)
    • 4.1.3 Global Thermal Pad for Board-Level Packaging Average Price by Region (2020-2031)
  • 4.2 North America Thermal Pad for Board-Level Packaging Consumption Value (2020-2031)
  • 4.3 Europe Thermal Pad for Board-Level Packaging Consumption Value (2020-2031)
  • 4.4 Asia-Pacific Thermal Pad for Board-Level Packaging Consumption Value (2020-2031)
  • 4.5 South America Thermal Pad for Board-Level Packaging Consumption Value (2020-2031)
  • 4.6 Middle East & Africa Thermal Pad for Board-Level Packaging Consumption Value (2020-2031)

5 Market Segment by Type

  • 5.1 Global Thermal Pad for Board-Level Packaging Sales Quantity by Type (2020-2031)
  • 5.2 Global Thermal Pad for Board-Level Packaging Consumption Value by Type (2020-2031)
  • 5.3 Global Thermal Pad for Board-Level Packaging Average Price by Type (2020-2031)

6 Market Segment by Application

  • 6.1 Global Thermal Pad for Board-Level Packaging Sales Quantity by Application (2020-2031)
  • 6.2 Global Thermal Pad for Board-Level Packaging Consumption Value by Application (2020-2031)
  • 6.3 Global Thermal Pad for Board-Level Packaging Average Price by Application (2020-2031)

7 North America

  • 7.1 North America Thermal Pad for Board-Level Packaging Sales Quantity by Type (2020-2031)
  • 7.2 North America Thermal Pad for Board-Level Packaging Sales Quantity by Application (2020-2031)
  • 7.3 North America Thermal Pad for Board-Level Packaging Market Size by Country
    • 7.3.1 North America Thermal Pad for Board-Level Packaging Sales Quantity by Country (2020-2031)
    • 7.3.2 North America Thermal Pad for Board-Level Packaging Consumption Value by Country (2020-2031)
    • 7.3.3 United States Market Size and Forecast (2020-2031)
    • 7.3.4 Canada Market Size and Forecast (2020-2031)
    • 7.3.5 Mexico Market Size and Forecast (2020-2031)

8 Europe

  • 8.1 Europe Thermal Pad for Board-Level Packaging Sales Quantity by Type (2020-2031)
  • 8.2 Europe Thermal Pad for Board-Level Packaging Sales Quantity by Application (2020-2031)
  • 8.3 Europe Thermal Pad for Board-Level Packaging Market Size by Country
    • 8.3.1 Europe Thermal Pad for Board-Level Packaging Sales Quantity by Country (2020-2031)
    • 8.3.2 Europe Thermal Pad for Board-Level Packaging Consumption Value by Country (2020-2031)
    • 8.3.3 Germany Market Size and Forecast (2020-2031)
    • 8.3.4 France Market Size and Forecast (2020-2031)
    • 8.3.5 United Kingdom Market Size and Forecast (2020-2031)
    • 8.3.6 Russia Market Size and Forecast (2020-2031)
    • 8.3.7 Italy Market Size and Forecast (2020-2031)

9 Asia-Pacific

  • 9.1 Asia-Pacific Thermal Pad for Board-Level Packaging Sales Quantity by Type (2020-2031)
  • 9.2 Asia-Pacific Thermal Pad for Board-Level Packaging Sales Quantity by Application (2020-2031)
  • 9.3 Asia-Pacific Thermal Pad for Board-Level Packaging Market Size by Region
    • 9.3.1 Asia-Pacific Thermal Pad for Board-Level Packaging Sales Quantity by Region (2020-2031)
    • 9.3.2 Asia-Pacific Thermal Pad for Board-Level Packaging Consumption Value by Region (2020-2031)
    • 9.3.3 China Market Size and Forecast (2020-2031)
    • 9.3.4 Japan Market Size and Forecast (2020-2031)
    • 9.3.5 South Korea Market Size and Forecast (2020-2031)
    • 9.3.6 India Market Size and Forecast (2020-2031)
    • 9.3.7 Southeast Asia Market Size and Forecast (2020-2031)
    • 9.3.8 Australia Market Size and Forecast (2020-2031)

10 South America

  • 10.1 South America Thermal Pad for Board-Level Packaging Sales Quantity by Type (2020-2031)
  • 10.2 South America Thermal Pad for Board-Level Packaging Sales Quantity by Application (2020-2031)
  • 10.3 South America Thermal Pad for Board-Level Packaging Market Size by Country
    • 10.3.1 South America Thermal Pad for Board-Level Packaging Sales Quantity by Country (2020-2031)
    • 10.3.2 South America Thermal Pad for Board-Level Packaging Consumption Value by Country (2020-2031)
    • 10.3.3 Brazil Market Size and Forecast (2020-2031)
    • 10.3.4 Argentina Market Size and Forecast (2020-2031)

11 Middle East & Africa

  • 11.1 Middle East & Africa Thermal Pad for Board-Level Packaging Sales Quantity by Type (2020-2031)
  • 11.2 Middle East & Africa Thermal Pad for Board-Level Packaging Sales Quantity by Application (2020-2031)
  • 11.3 Middle East & Africa Thermal Pad for Board-Level Packaging Market Size by Country
    • 11.3.1 Middle East & Africa Thermal Pad for Board-Level Packaging Sales Quantity by Country (2020-2031)
    • 11.3.2 Middle East & Africa Thermal Pad for Board-Level Packaging Consumption Value by Country (2020-2031)
    • 11.3.3 Turkey Market Size and Forecast (2020-2031)
    • 11.3.4 Egypt Market Size and Forecast (2020-2031)
    • 11.3.5 Saudi Arabia Market Size and Forecast (2020-2031)
    • 11.3.6 South Africa Market Size and Forecast (2020-2031)

12 Market Dynamics

  • 12.1 Thermal Pad for Board-Level Packaging Market Drivers
  • 12.2 Thermal Pad for Board-Level Packaging Market Restraints
  • 12.3 Thermal Pad for Board-Level Packaging Trends Analysis
  • 12.4 Porters Five Forces Analysis
    • 12.4.1 Threat of New Entrants
    • 12.4.2 Bargaining Power of Suppliers
    • 12.4.3 Bargaining Power of Buyers
    • 12.4.4 Threat of Substitutes
    • 12.4.5 Competitive Rivalry

13 Raw Material and Industry Chain

  • 13.1 Raw Material of Thermal Pad for Board-Level Packaging and Key Manufacturers
  • 13.2 Manufacturing Costs Percentage of Thermal Pad for Board-Level Packaging
  • 13.3 Thermal Pad for Board-Level Packaging Production Process
  • 13.4 Industry Value Chain Analysis

14 Shipments by Distribution Channel

  • 14.1 Sales Channel
    • 14.1.1 Direct to End-User
    • 14.1.2 Distributors
  • 14.2 Thermal Pad for Board-Level Packaging Typical Distributors
  • 14.3 Thermal Pad for Board-Level Packaging Typical Customers

15 Research Findings and Conclusion

    16 Appendix

    • 16.1 Methodology
    • 16.2 Research Process and Data Source

    Summary:
    Get latest Market Research Reports on Thermal Pad for Board-Level Packaging. Industry analysis & Market Report on Thermal Pad for Board-Level Packaging is a syndicated market report, published as Global Thermal Pad for Board-Level Packaging Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031. It is complete Research Study and Industry Analysis of Thermal Pad for Board-Level Packaging market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.

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