Thermal interface material is a kind of material applied between power devices and electronic radiators. It is mainly used to fill the micro voids and uneven holes on the surface caused by the connection or contact between the two materials to improve the heat dissipation performance.
Global Thermal Interface Materials key players are mainly located in US, Europe and Japan, like Dow, Panasonic, Parker Hannifin, Shin-Etsu Chemical, Laird, Henkel, Fujipoly, Tanyuan Technology and DuPont, etc. Global top five players hold a share nearly 40 percent.
Market Analysis and Insights: Global Thermal Interface Materials for Electronics Cooling Market
The global Thermal Interface Materials for Electronics Cooling market was valued at US$ XX in 2020 and will reach US$ XX million by the end of 2027, growing at a CAGR of XX% during 2022-2027.
Global Thermal Interface Materials for Electronics Cooling Scope and Market Size
The global Thermal Interface Materials for Electronics Cooling market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global Thermal Interface Materials for Electronics Cooling market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), by Type and by Application for the period 2016-2027.
Segment by Type
Greases
Elastomeric Pads
Thermal Tapes
Phase Change Materials
Other
Segment by Application
Electronics
Power Devices
Others
The Thermal Interface Materials for Electronics Cooling market is analysed and market size information is provided by regions (countries). Segment by Application, the Thermal Interface Materials for Electronics Cooling market is segmented into North America, Europe, China, Japan, Southeast Asia, India and Other Regions.
By Company
Dow
Panasonic
Parker Hannifin
Shin-Etsu Chemical
Laird
Henkel
Fujipoly
DuPont
Aavid (Boyd Corporation)
3M
Wacker
H.B. Fuller Company
Denka Company Limited
Dexerials Corporation
Tanyuan Technology
Jones Tech PLC
Shenzhen FRD Science & Technology
Summary:
Get latest Market Research Reports on Thermal Interface Materials For Electronics Cooling. Industry analysis & Market Report on Thermal Interface Materials For Electronics Cooling is a syndicated market report, published as Global Thermal Interface Materials for Electronics Cooling Sales Market Report 2021. It is complete Research Study and Industry Analysis of Thermal Interface Materials For Electronics Cooling market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.