Report Detail
Global Temporary Wafer Bonding Materials Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031
- RnM4628312 |
- 26 September, 2025 |
- Global |
- 121 Pages |
- GIR |
- Chemical & Material
According to our (Global Info Research) latest study, the global Temporary Wafer Bonding Materials market size was valued at US$ 121 million in 2024 and is forecast to a readjusted size of USD 183 million by 2031 with a CAGR of 6.2% during review period.
Temporary wafer bonding materials play a critical role in semiconductor manufacturing. They provide rigid support for ultra-thin wafers during the backside processing, ensuring the wafers can withstand complex back-end processing operations. These materials are characterized by excellent removability and thermal stability, making them suitable for high-temperature and chemical environments. They are widely used in 3D packaging, MEMS device manufacturing, and the production of high-performance semiconductor devices. By employing temporary bonding, wafer thinning and subsequent processes can be performed while preventing damage and deformation of the wafers during handling.
The market for temporary wafer bonding materials is currently in a critical phase of continuous technological evolution. These materials are widely used in advanced packaging and 3D integration processes in semiconductor manufacturing, primarily aiming to support non-destructive bonding and debonding of ultra-thin wafers. The mainstream materials in the market include inorganic substances (e.g., hydrogenated amorphous silicon) and various polymers (e.g., polyimide, PEEK, and PDMS). Their application often corresponds to specific debonding techniques, such as thermal slide debonding, solvent-based debonding, mechanical debonding, and laser debonding, with the maturity and adaptability of these techniques influencing market performance.
In the future, the development of temporary wafer bonding materials will focus on more efficient and lower-damage debonding processes. For instance, improvements in the precision and speed of laser debonding and air-jetting technologies are expected to drive market growth significantly. Additionally, with ongoing innovations in new electronic devices and semiconductor technologies, the demand for higher-performance and more stable temporary bonding materials will continue to rise. Moreover, the push for sustainable development is driving the industry towards environmentally friendly and recyclable materials, which will inject new vitality into the market.
The key drivers for market growth include the increasing demand for advanced packaging technologies in the semiconductor industry and breakthroughs in materials science. However, there are notable barriers, such as the high cost of developing high-performance materials, mismatches between debonding techniques and equipment, and the challenges of promoting emerging technical standards. Furthermore, technical barriers and intellectual property issues among manufacturers limit further integration and development in the industry.
This report is a detailed and comprehensive analysis for global Temporary Wafer Bonding Materials market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Temporary Wafer Bonding Materials market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/kg), 2020-2031
Global Temporary Wafer Bonding Materials market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/kg), 2020-2031
Global Temporary Wafer Bonding Materials market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/kg), 2020-2031
Global Temporary Wafer Bonding Materials market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/kg), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Temporary Wafer Bonding Materials
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Temporary Wafer Bonding Materials market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include 3M, Nikka Seiko, Brewer Science, Sekisui Chemical, Tokyo Ohka Kogyo, AI Technology, YINCAE Advanced Materials, Valtech Corporation, HD MicroSystems, Samcien Semiconductor Materials, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Temporary Wafer Bonding Materials market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Thermal Slide Debonding
Mechanical Peeling
Laser Ablation
Chemical Dissolution
Market segment by Application
Advanced Packaging
MEMS
CIS
Others
Major players covered
3M
Nikka Seiko
Brewer Science
Sekisui Chemical
Tokyo Ohka Kogyo
AI Technology
YINCAE Advanced Materials
Valtech Corporation
HD MicroSystems
Samcien Semiconductor Materials
Hubei Dinglong
PhiChem Corporation
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Temporary Wafer Bonding Materials product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Temporary Wafer Bonding Materials, with price, sales quantity, revenue, and global market share of Temporary Wafer Bonding Materials from 2020 to 2025.
Chapter 3, the Temporary Wafer Bonding Materials competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Temporary Wafer Bonding Materials breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Temporary Wafer Bonding Materials market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Temporary Wafer Bonding Materials.
Chapter 14 and 15, to describe Temporary Wafer Bonding Materials sales channel, distributors, customers, research findings and conclusion.
1 Market Overview
- 1.1 Product Overview and Scope
- 1.2 Market Estimation Caveats and Base Year
- 1.3 Market Analysis by Type
- 1.3.1 Overview: Global Temporary Wafer Bonding Materials Consumption Value by Type: 2020 Versus 2024 Versus 2031
- 1.3.2 Thermal Slide Debonding
- 1.3.3 Mechanical Peeling
- 1.3.4 Laser Ablation
- 1.3.5 Chemical Dissolution
- 1.4 Market Analysis by Application
- 1.4.1 Overview: Global Temporary Wafer Bonding Materials Consumption Value by Application: 2020 Versus 2024 Versus 2031
- 1.4.2 Advanced Packaging
- 1.4.3 MEMS
- 1.4.4 CIS
- 1.4.5 Others
- 1.5 Global Temporary Wafer Bonding Materials Market Size & Forecast
- 1.5.1 Global Temporary Wafer Bonding Materials Consumption Value (2020 & 2024 & 2031)
- 1.5.2 Global Temporary Wafer Bonding Materials Sales Quantity (2020-2031)
- 1.5.3 Global Temporary Wafer Bonding Materials Average Price (2020-2031)
2 Manufacturers Profiles
- 2.1 3M
- 2.1.1 3M Details
- 2.1.2 3M Major Business
- 2.1.3 3M Temporary Wafer Bonding Materials Product and Services
- 2.1.4 3M Temporary Wafer Bonding Materials Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
- 2.1.5 3M Recent Developments/Updates
- 2.2 Nikka Seiko
- 2.2.1 Nikka Seiko Details
- 2.2.2 Nikka Seiko Major Business
- 2.2.3 Nikka Seiko Temporary Wafer Bonding Materials Product and Services
- 2.2.4 Nikka Seiko Temporary Wafer Bonding Materials Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
- 2.2.5 Nikka Seiko Recent Developments/Updates
- 2.3 Brewer Science
- 2.3.1 Brewer Science Details
- 2.3.2 Brewer Science Major Business
- 2.3.3 Brewer Science Temporary Wafer Bonding Materials Product and Services
- 2.3.4 Brewer Science Temporary Wafer Bonding Materials Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
- 2.3.5 Brewer Science Recent Developments/Updates
- 2.4 Sekisui Chemical
- 2.4.1 Sekisui Chemical Details
- 2.4.2 Sekisui Chemical Major Business
- 2.4.3 Sekisui Chemical Temporary Wafer Bonding Materials Product and Services
- 2.4.4 Sekisui Chemical Temporary Wafer Bonding Materials Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
- 2.4.5 Sekisui Chemical Recent Developments/Updates
- 2.5 Tokyo Ohka Kogyo
- 2.5.1 Tokyo Ohka Kogyo Details
- 2.5.2 Tokyo Ohka Kogyo Major Business
- 2.5.3 Tokyo Ohka Kogyo Temporary Wafer Bonding Materials Product and Services
- 2.5.4 Tokyo Ohka Kogyo Temporary Wafer Bonding Materials Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
- 2.5.5 Tokyo Ohka Kogyo Recent Developments/Updates
- 2.6 AI Technology
- 2.6.1 AI Technology Details
- 2.6.2 AI Technology Major Business
- 2.6.3 AI Technology Temporary Wafer Bonding Materials Product and Services
- 2.6.4 AI Technology Temporary Wafer Bonding Materials Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
- 2.6.5 AI Technology Recent Developments/Updates
- 2.7 YINCAE Advanced Materials
- 2.7.1 YINCAE Advanced Materials Details
- 2.7.2 YINCAE Advanced Materials Major Business
- 2.7.3 YINCAE Advanced Materials Temporary Wafer Bonding Materials Product and Services
- 2.7.4 YINCAE Advanced Materials Temporary Wafer Bonding Materials Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
- 2.7.5 YINCAE Advanced Materials Recent Developments/Updates
- 2.8 Valtech Corporation
- 2.8.1 Valtech Corporation Details
- 2.8.2 Valtech Corporation Major Business
- 2.8.3 Valtech Corporation Temporary Wafer Bonding Materials Product and Services
- 2.8.4 Valtech Corporation Temporary Wafer Bonding Materials Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
- 2.8.5 Valtech Corporation Recent Developments/Updates
- 2.9 HD MicroSystems
- 2.9.1 HD MicroSystems Details
- 2.9.2 HD MicroSystems Major Business
- 2.9.3 HD MicroSystems Temporary Wafer Bonding Materials Product and Services
- 2.9.4 HD MicroSystems Temporary Wafer Bonding Materials Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
- 2.9.5 HD MicroSystems Recent Developments/Updates
- 2.10 Samcien Semiconductor Materials
- 2.10.1 Samcien Semiconductor Materials Details
- 2.10.2 Samcien Semiconductor Materials Major Business
- 2.10.3 Samcien Semiconductor Materials Temporary Wafer Bonding Materials Product and Services
- 2.10.4 Samcien Semiconductor Materials Temporary Wafer Bonding Materials Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
- 2.10.5 Samcien Semiconductor Materials Recent Developments/Updates
- 2.11 Hubei Dinglong
- 2.11.1 Hubei Dinglong Details
- 2.11.2 Hubei Dinglong Major Business
- 2.11.3 Hubei Dinglong Temporary Wafer Bonding Materials Product and Services
- 2.11.4 Hubei Dinglong Temporary Wafer Bonding Materials Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
- 2.11.5 Hubei Dinglong Recent Developments/Updates
- 2.12 PhiChem Corporation
- 2.12.1 PhiChem Corporation Details
- 2.12.2 PhiChem Corporation Major Business
- 2.12.3 PhiChem Corporation Temporary Wafer Bonding Materials Product and Services
- 2.12.4 PhiChem Corporation Temporary Wafer Bonding Materials Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
- 2.12.5 PhiChem Corporation Recent Developments/Updates
3 Competitive Environment: Temporary Wafer Bonding Materials by Manufacturer
- 3.1 Global Temporary Wafer Bonding Materials Sales Quantity by Manufacturer (2020-2025)
- 3.2 Global Temporary Wafer Bonding Materials Revenue by Manufacturer (2020-2025)
- 3.3 Global Temporary Wafer Bonding Materials Average Price by Manufacturer (2020-2025)
- 3.4 Market Share Analysis (2024)
- 3.4.1 Producer Shipments of Temporary Wafer Bonding Materials by Manufacturer Revenue ($MM) and Market Share (%): 2024
- 3.4.2 Top 3 Temporary Wafer Bonding Materials Manufacturer Market Share in 2024
- 3.4.3 Top 6 Temporary Wafer Bonding Materials Manufacturer Market Share in 2024
- 3.5 Temporary Wafer Bonding Materials Market: Overall Company Footprint Analysis
- 3.5.1 Temporary Wafer Bonding Materials Market: Region Footprint
- 3.5.2 Temporary Wafer Bonding Materials Market: Company Product Type Footprint
- 3.5.3 Temporary Wafer Bonding Materials Market: Company Product Application Footprint
- 3.6 New Market Entrants and Barriers to Market Entry
- 3.7 Mergers, Acquisition, Agreements, and Collaborations
4 Consumption Analysis by Region
- 4.1 Global Temporary Wafer Bonding Materials Market Size by Region
- 4.1.1 Global Temporary Wafer Bonding Materials Sales Quantity by Region (2020-2031)
- 4.1.2 Global Temporary Wafer Bonding Materials Consumption Value by Region (2020-2031)
- 4.1.3 Global Temporary Wafer Bonding Materials Average Price by Region (2020-2031)
- 4.2 North America Temporary Wafer Bonding Materials Consumption Value (2020-2031)
- 4.3 Europe Temporary Wafer Bonding Materials Consumption Value (2020-2031)
- 4.4 Asia-Pacific Temporary Wafer Bonding Materials Consumption Value (2020-2031)
- 4.5 South America Temporary Wafer Bonding Materials Consumption Value (2020-2031)
- 4.6 Middle East & Africa Temporary Wafer Bonding Materials Consumption Value (2020-2031)
5 Market Segment by Type
- 5.1 Global Temporary Wafer Bonding Materials Sales Quantity by Type (2020-2031)
- 5.2 Global Temporary Wafer Bonding Materials Consumption Value by Type (2020-2031)
- 5.3 Global Temporary Wafer Bonding Materials Average Price by Type (2020-2031)
6 Market Segment by Application
- 6.1 Global Temporary Wafer Bonding Materials Sales Quantity by Application (2020-2031)
- 6.2 Global Temporary Wafer Bonding Materials Consumption Value by Application (2020-2031)
- 6.3 Global Temporary Wafer Bonding Materials Average Price by Application (2020-2031)
7 North America
- 7.1 North America Temporary Wafer Bonding Materials Sales Quantity by Type (2020-2031)
- 7.2 North America Temporary Wafer Bonding Materials Sales Quantity by Application (2020-2031)
- 7.3 North America Temporary Wafer Bonding Materials Market Size by Country
- 7.3.1 North America Temporary Wafer Bonding Materials Sales Quantity by Country (2020-2031)
- 7.3.2 North America Temporary Wafer Bonding Materials Consumption Value by Country (2020-2031)
- 7.3.3 United States Market Size and Forecast (2020-2031)
- 7.3.4 Canada Market Size and Forecast (2020-2031)
- 7.3.5 Mexico Market Size and Forecast (2020-2031)
8 Europe
- 8.1 Europe Temporary Wafer Bonding Materials Sales Quantity by Type (2020-2031)
- 8.2 Europe Temporary Wafer Bonding Materials Sales Quantity by Application (2020-2031)
- 8.3 Europe Temporary Wafer Bonding Materials Market Size by Country
- 8.3.1 Europe Temporary Wafer Bonding Materials Sales Quantity by Country (2020-2031)
- 8.3.2 Europe Temporary Wafer Bonding Materials Consumption Value by Country (2020-2031)
- 8.3.3 Germany Market Size and Forecast (2020-2031)
- 8.3.4 France Market Size and Forecast (2020-2031)
- 8.3.5 United Kingdom Market Size and Forecast (2020-2031)
- 8.3.6 Russia Market Size and Forecast (2020-2031)
- 8.3.7 Italy Market Size and Forecast (2020-2031)
9 Asia-Pacific
- 9.1 Asia-Pacific Temporary Wafer Bonding Materials Sales Quantity by Type (2020-2031)
- 9.2 Asia-Pacific Temporary Wafer Bonding Materials Sales Quantity by Application (2020-2031)
- 9.3 Asia-Pacific Temporary Wafer Bonding Materials Market Size by Region
- 9.3.1 Asia-Pacific Temporary Wafer Bonding Materials Sales Quantity by Region (2020-2031)
- 9.3.2 Asia-Pacific Temporary Wafer Bonding Materials Consumption Value by Region (2020-2031)
- 9.3.3 China Market Size and Forecast (2020-2031)
- 9.3.4 Japan Market Size and Forecast (2020-2031)
- 9.3.5 South Korea Market Size and Forecast (2020-2031)
- 9.3.6 India Market Size and Forecast (2020-2031)
- 9.3.7 Southeast Asia Market Size and Forecast (2020-2031)
- 9.3.8 Australia Market Size and Forecast (2020-2031)
10 South America
- 10.1 South America Temporary Wafer Bonding Materials Sales Quantity by Type (2020-2031)
- 10.2 South America Temporary Wafer Bonding Materials Sales Quantity by Application (2020-2031)
- 10.3 South America Temporary Wafer Bonding Materials Market Size by Country
- 10.3.1 South America Temporary Wafer Bonding Materials Sales Quantity by Country (2020-2031)
- 10.3.2 South America Temporary Wafer Bonding Materials Consumption Value by Country (2020-2031)
- 10.3.3 Brazil Market Size and Forecast (2020-2031)
- 10.3.4 Argentina Market Size and Forecast (2020-2031)
11 Middle East & Africa
- 11.1 Middle East & Africa Temporary Wafer Bonding Materials Sales Quantity by Type (2020-2031)
- 11.2 Middle East & Africa Temporary Wafer Bonding Materials Sales Quantity by Application (2020-2031)
- 11.3 Middle East & Africa Temporary Wafer Bonding Materials Market Size by Country
- 11.3.1 Middle East & Africa Temporary Wafer Bonding Materials Sales Quantity by Country (2020-2031)
- 11.3.2 Middle East & Africa Temporary Wafer Bonding Materials Consumption Value by Country (2020-2031)
- 11.3.3 Turkey Market Size and Forecast (2020-2031)
- 11.3.4 Egypt Market Size and Forecast (2020-2031)
- 11.3.5 Saudi Arabia Market Size and Forecast (2020-2031)
- 11.3.6 South Africa Market Size and Forecast (2020-2031)
12 Market Dynamics
- 12.1 Temporary Wafer Bonding Materials Market Drivers
- 12.2 Temporary Wafer Bonding Materials Market Restraints
- 12.3 Temporary Wafer Bonding Materials Trends Analysis
- 12.4 Porters Five Forces Analysis
- 12.4.1 Threat of New Entrants
- 12.4.2 Bargaining Power of Suppliers
- 12.4.3 Bargaining Power of Buyers
- 12.4.4 Threat of Substitutes
- 12.4.5 Competitive Rivalry
13 Raw Material and Industry Chain
- 13.1 Raw Material of Temporary Wafer Bonding Materials and Key Manufacturers
- 13.2 Manufacturing Costs Percentage of Temporary Wafer Bonding Materials
- 13.3 Temporary Wafer Bonding Materials Production Process
- 13.4 Industry Value Chain Analysis
14 Shipments by Distribution Channel
- 14.1 Sales Channel
- 14.1.1 Direct to End-User
- 14.1.2 Distributors
- 14.2 Temporary Wafer Bonding Materials Typical Distributors
- 14.3 Temporary Wafer Bonding Materials Typical Customers
15 Research Findings and Conclusion
16 Appendix
- 16.1 Methodology
- 16.2 Research Process and Data Source
Summary:
Get latest Market Research Reports on Temporary Wafer Bonding Materials. Industry analysis & Market Report on Temporary Wafer Bonding Materials is a syndicated market report, published as Global Temporary Wafer Bonding Materials Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031. It is complete Research Study and Industry Analysis of Temporary Wafer Bonding Materials market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.
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