Global Stacked CMOS Image Sensor Market 2026 by Manufacturers, Regions, Type and Application, Forecast to 2032

According to our (Global Info Research) latest study, the global Stacked CMOS Image Sensor market size was valued at US$ 5802 million in 2025 and is forecast to a readjusted size of US$ 12151 million by 2032 with a CAGR of 10.6% during review period.
In 2024, global Stack CMOS Image Sensor production reached approximately 1.55 billion Units, with an average global market price of around US$ 3.65 per unit.
A Stacked CMOS Image Sensor (Stacked CIS) is an upgraded architecture of CMOS image sensor, which realizes higher performance and smaller size by separating and stacking the two core functional modules of the sensor: the pixel array layer (responsible for photoelectric conversion) and the logic circuit layer (responsible for signal processing and readout). It is the mainstream architecture of high-performance CIS in current consumer electronics, automotive, and professional imaging fields.
The CMOS image sensor industry chain presents a vertical hierarchical structure with clear division of labor, spanning from upstream core material and equipment supply, midstream sensor design, manufacturing and packaging, to downstream application terminal integration. The industry has strong technical barriers, high concentration of leading enterprises, and close collaborative links between upstream and downstream links.
I. Upstream: Core Materials & Equipment (Technical Core, High Barriers)
The upstream segment provides the essential materials, equipment and intellectual property (IP) required for CIS design and manufacturing, and is the foundation of the entire industry chain. The market is dominated by a small number of international enterprises.
1. Core Materials
Semiconductor Wafer Substrate for CIS: chip manufacturing, the most critical material with the highest cost.
Photoresist: Key material for photolithography process, determines pixel precision.
Metal Target Material: Used for depositing metal wiring layers (e.g., copper, aluminum).
Packaging Materials: Include lead frames, encapsulants, bonding wires, etc.
2. Manufacturing Equipment
The equipment accounts for a large proportion of CIS production costs, and the core links are monopolized by overseas enterprises:
Photolithography Machine: The core equipment for pixel pattern transfer, directly determines the pixel size and sensor resolution. The leading enterprise is ASML (EUV lithography machines are used for advanced process CIS).
Etching Equipment: Used for pattern processing of wafer layers, with representatives such as Applied Materials, Tokyo Electron (TEL).
Deposition Equipment: For film deposition of various material layers, leading manufacturers include Applied Materials, TEL.
Testing Equipment: Used for performance testing of CIS chips, such as Teradyne, Advantest.
3. IP & Design Tools
IP Authorization: Core technologies such as pixel structure (BSI/Stacked), global shutter, and HDR algorithms are mostly held by professional IP companies, such as ARM, Synopsys, Cadence.
EDA Tools: Essential for CIS circuit design, the market is monopolized by Synopsys, Cadence, and Mentor Graphics.
II. Midstream: CIS Design, Manufacturing & Packaging (Value Core, High Concentration)
The midstream is the core value link of the industry chain, covering three key links: chip design, wafer fabrication, and packaging and testing. The industry is divided into two business models: IDM (Integrated Device Manufacturer) and Fabless + Foundry + OSAT.
1. Chip Design (Fabless/IDM Design Division)
The link determines the technical route and performance parameters of CIS (e.g., pixel structure, resolution, dynamic range). It has high R&D investment and strong technical barriers, and the market concentration is extremely high.
IDM Mode Enterprises: Integrate design, manufacturing, packaging and testing, with strong technical strength. Representative enterprises: Sony Semiconductor Solutions, Samsung Electronics, OmniVision (partially self-manufactured).
Fabless Mode Enterprises: Focus on design, outsource manufacturing and packaging to third parties. Representative enterprises: On Semiconductor, SK Hynix, GalaxyCore.
2. Wafer Fabrication (Foundry)
It is responsible for manufacturing CIS chips according to the design scheme, and the advanced process (e.g., 45nm, 28nm) is the key to improving sensor performance.
Main Foundries: TSMC (the largest foundry, focusing on high-end stacked CIS), UMC, GlobalFoundries, SMIC (focusing on mid-to-low-end CIS process).
IDM Self-Manufacturing Lines: Sony and Samsung have their own advanced wafer factories, which can realize the rapid iteration of proprietary technologies (e.g., Sony's Stacked CMOS).
3. Packaging and Testing (OSAT)
The link directly affects the reliability, size and heat dissipation performance of CIS, and the advanced packaging technology is the key to miniaturization and high performance.
Traditional Packaging: Includes wire bonding, encapsulation, etc., suitable for mid-to-low-end CIS, with manufacturers such as ASE Group, Amkor Technology.
Advanced Packaging: Flip-chip packaging (Flip Chip), wafer-level packaging (WLP), chip-scale packaging (CSP) are the mainstream, which can reduce the sensor size and improve the light sensitivity. Leading enterprises: ASE Group, Amkor, STATS ChipPAC.
Testing: Includes wafer testing (CP) and final testing (FT), to ensure the yield and performance consistency of CIS, with manufacturers such as Xcerra, Teradyne.
III. Downstream: Application Terminal Integration (Demand Core, Diversified Scenarios)
Downstream applications cover consumer electronics, automotive electronics, industrial detection, security monitoring, medical imaging and other fields. The demand of different scenarios drives the iteration of CIS technology, and the B2B field has become the main growth engine in recent years.
1. Consumer Electronics (Traditional Main Market, Gradual Saturation)
Application Scenarios: Smartphones (front and rear cameras), tablets, laptops, digital cameras, drones.
Demand Characteristics: Pursue high resolution (100MP+), small pixel size (0.7μm), stacked structure, but the market growth is slowing down with the saturation of smartphone shipments.
Key Customers: Apple, Samsung, Xiaomi, Huawei, DJI.
2. Automotive Electronics (Fastest Growing Track, High Barriers)
Application Scenarios: Vehicle-mounted cameras (front view, rear view, surround view, in-cabin monitoring), LiDAR supporting sensors, ADAS systems.
Demand Characteristics: Need to meet AEC-Q100 automotive-grade certification, with high requirements for high temperature resistance, anti-electromagnetic interference, high dynamic range (HDR > 120dB) and reliability. The single-vehicle CIS loading quantity can reach 8-16 units with the upgrade of autonomous driving.
Key Customers: Tesla, BYD, Volkswagen, Bosch, Continental.
3. Security Monitoring (Stable Demand, High Performance Requirements)
Application Scenarios: Network cameras (IPC), analog cameras, ball machines, video recorders (NVR).
Demand Characteristics: Emphasize low illumination imaging ability, wide dynamic range, and night vision effect. 4K high-definition and AI intelligent recognition are the main trends.
Key Customers: Hikvision, Dahua Technology, Uniview.
4. Industrial & Medical Fields (High Profit Margin, Professional Demand)
Industrial Detection: Machine vision cameras, semiconductor detection equipment, barcode scanners, requiring global shutter, high frame rate (thousands of frames/second) and high precision. Key customers: Keyence, Cognex.
Medical Imaging: Endoscopes, dental imaging equipment, portable detectors, requiring high signal-to-noise ratio, low radiation and miniaturization. Key customers: Olympus, Fujifilm.
IV. Industry Chain Characteristics & Profit Distribution
Profit Concentration: The upstream equipment and midstream design links occupy the highest profit margin, while the downstream application terminal profit margin is relatively low.
Technical Synergy: The iteration of downstream application demand (e.g., automotive high dynamic range, industrial global shutter) drives the R&D of midstream design and upstream material and equipment technologies, forming a positive feedback loop.
Regional Concentration: The upstream and midstream high-end links are concentrated in Japan, South Korea, the United States and Taiwan of China; the downstream application market is dominated by China, which is the largest CIS consumer market in the world.
This report is a detailed and comprehensive analysis for global Stacked CMOS Image Sensor market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Stacked CMOS Image Sensor market size and forecasts, in consumption value ($ Million), sales quantity (Million Units), and average selling prices (US$/Unit), 2021-2032
Global Stacked CMOS Image Sensor market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Million Units), and average selling prices (US$/Unit), 2021-2032
Global Stacked CMOS Image Sensor market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Million Units), and average selling prices (US$/Unit), 2021-2032
Global Stacked CMOS Image Sensor market shares of main players, shipments in revenue ($ Million), sales quantity (Million Units), and ASP (US$/Unit), 2021-2026
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Stacked CMOS Image Sensor
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Stacked CMOS Image Sensor market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include SONY, Samsung, OmniVision, STMicroelectronics, On Semi, GalaxyCore, SOI, Smartsens Technology, Canon, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Stacked CMOS Image Sensor market is split by Type and by Application. For the period 2021-2032, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
12MP
26MP
Others
Market segment by Stacking Layer Count
2‑Stack CIS
3‑Stack CIS
Multi‑Stack CIS (≥4 layers)
Market segment by Bonding Technology
Micro‑bump Bonding
Cu‑Cu Hybrid Bonding
Through‑Silicon Vias (TSV) Bonding
Market segment by Application
Mobile Phone
Automobile
Others
Major players covered
SONY
Samsung
OmniVision
STMicroelectronics
On Semi
GalaxyCore
SOI
Smartsens Technology
Canon
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Stacked CMOS Image Sensor product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Stacked CMOS Image Sensor, with price, sales quantity, revenue, and global market share of Stacked CMOS Image Sensor from 2021 to 2026.
Chapter 3, the Stacked CMOS Image Sensor competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Stacked CMOS Image Sensor breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2021 to 2032.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2021 to 2032.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2021 to 2026.and Stacked CMOS Image Sensor market forecast, by regions, by Type, and by Application, with sales and revenue, from 2027 to 2032.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Stacked CMOS Image Sensor.
Chapter 14 and 15, to describe Stacked CMOS Image Sensor sales channel, distributors, customers, research findings and conclusion.