Report Detail

Other Global Sputtering Target Material Market Data Survey Report 2013-2025

  • RnM3331979
  • |
  • 19 April, 2019
  • |
  • Global
  • |
  • 59 Pages
  • |
  • HeyReport
  • |
  • Other

Summary
Sputtering is the process of forming a thin film when the object is attached to the target substrate by the sputtering and scattering, and the sputtering target is the material for high-speed particle bombardment. This report studies the sputtering target material market.
The global Sputtering Target Material market will reach xxx Million USD in 2019 with CAGR xx% 2019-2025. The main contents of the report including:
Global market size and forecast
Regional market size, production data and export & import
Key manufacturers profile, products & services, sales data of business
Global market size by Major Application
Global market size by Major Type
Key manufacturers are included based on company profile, sales data and product specifications etc.:
JX Nippon Mining & Metals Corporation
TOSOH
Sumitomo Chemical
Mitsui Mining & Smelting
ULVAC
Praxair
Grikin
Plansee
Ningbo Jiangfeng
Honeywell
Materion (Heraeus)
Acetron
Changzhou Sujing Electronic Material
Luoyang Sifon Electronic Materials
Major applications as follows:
Semiconductor
Solar Energy
Flat Panel Display
Major Type as follows:
Metal Target
Alloy Target
Ceramic Compound Target
Regional market size, production data and export & import:
Asia-Pacific
North America
Europe
South America
Middle East & Africa


Table of Contents

    1 Global Market Overview

    • 1.1 Scope of Statistics
      • 1.1.1 Scope of Products
      • 1.1.2 Scope of Manufacturers
      • 1.1.3 Scope of Application
      • 1.1.4 Scope of Type
      • 1.1.5 Scope of Regions/Countries
    • 1.2 Global Market Size

    2 Regional Market

    • 2.1 Regional Production
    • 2.2 Regional Demand
    • 2.3 Regional Trade

    3 Key Manufacturers

    • 3.1 JX Nippon Mining & Metals Corporation
      • 3.1.1 Company Information
      • 3.1.2 Product & Services
      • 3.1.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
      • 3.1.4 Recent Development
    • 3.2 TOSOH
      • 3.2.1 Company Information
      • 3.2.2 Product & Services
      • 3.2.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
      • 3.2.4 Recent Development
    • 3.3 Sumitomo Chemical
      • 3.3.1 Company Information
      • 3.3.2 Product & Services
      • 3.3.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
      • 3.3.4 Recent Development
    • 3.4 Mitsui Mining & Smelting
      • 3.4.1 Company Information
      • 3.4.2 Product & Services
      • 3.4.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
      • 3.4.4 Recent Development
    • 3.5 ULVAC
      • 3.5.1 Company Information
      • 3.5.2 Product & Services
      • 3.5.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
      • 3.5.4 Recent Development
    • 3.6 Praxair
      • 3.6.1 Company Information
      • 3.6.2 Product & Services
      • 3.6.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
      • 3.6.4 Recent Development
    • 3.7 Grikin
      • 3.7.1 Company Information
      • 3.7.2 Product & Services
      • 3.7.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
      • 3.7.4 Recent Development
    • 3.8 Plansee
      • 3.8.1 Company Information
      • 3.8.2 Product & Services
      • 3.8.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
      • 3.8.4 Recent Development
    • 3.9 Ningbo Jiangfeng
      • 3.9.1 Company Information
      • 3.9.2 Product & Services
      • 3.9.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
      • 3.9.4 Recent Development
    • 3.10 Honeywell
      • 3.10.1 Company Information
      • 3.10.2 Product & Services
      • 3.10.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
      • 3.10.4 Recent Development
    • 3.11 Materion (Heraeus)
      • 3.11.1 Company Information
      • 3.11.2 Product & Services
      • 3.11.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
      • 3.11.4 Recent Development
    • 3.12 Acetron
      • 3.12.1 Company Information
      • 3.12.2 Product & Services
      • 3.12.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
      • 3.12.4 Recent Development
    • 3.13 Changzhou Sujing Electronic Material
      • 3.13.1 Company Information
      • 3.13.2 Product & Services
      • 3.13.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
    • 3.14 Luoyang Sifon Electronic Materials
      • 3.14.1 Company Information
      • 3.14.2 Product & Services
      • 3.14.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)

    4 Major Application

    • 4.1 Semiconductor
      • 4.1.1 Overview
      • 4.1.2 Semiconductor Market Size and Forecast
    • 4.2 Solar Energy
      • 4.2.1 Overview
      • 4.2.2 Solar Energy Market Size and Forecast
    • 4.3 Flat Panel Display
      • 4.3.1 Overview
      • 4.3.2 Flat Panel Display Market Size and Forecast

    5 Market by Type

      5.By Metal Target

      • 5.1 Metal Target
        • 5.1.1 Overview
        • 5.1.2 Metal Target Market Size and Forecast
      • 5.2 Alloy Target
        • 5.2.1 Overview
        • 5.2.2 Alloy Target Market Size and Forecast
      • 5.3 Ceramic Compound Target
        • 5.3.1 Overview
        • 5.3.2 Ceramic Compound Target Market Size and Forecast

      6 Price Overview

      • 6.1 Price by Manufacturers
      • 6.2 Price by Application
      • 6.3 Price by Type

      7 Conclusion

      Summary:
      Get latest Market Research Reports on Sputtering Target Material . Industry analysis & Market Report on Sputtering Target Material is a syndicated market report, published as Global Sputtering Target Material Market Data Survey Report 2013-2025. It is complete Research Study and Industry Analysis of Sputtering Target Material market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.

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