Report Detail

Chemical & Material Global Solder Bumps Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

  • RnM4596818
  • |
  • 02 July, 2024
  • |
  • Global
  • |
  • 107 Pages
  • |
  • GIR (Global Info Research)
  • |
  • Chemical & Material

According to our (Global Info Research) latest study, the global Solder Bumps market size was valued at USD 235 million in 2023 and is forecast to a readjusted size of USD 347.3 million by 2030 with a CAGR of 5.7% during review period.
Wafer bumping is an essential to flip chip or board level semiconductor packaging. Bumping is an advanced wafer level process technology where "bumps" or "balls" made of solder are formed on the wafers in a whole wafer form before the wafer is being diced into individual chips. Those "bumps", which can be composed from eutectic, lead free, high lead materials, or Cu pillar on wafer are the fundamental interconnect components that will interconnect the die and the substrate together into a single package. These bumps not only provide a connected path between die and substrate, but also play an important role in the electrical, mechanical and thermal performance in the flip chip package.

Flip chip assembly package has traditionally been used for high-end niche applications. Recent technology development has adopted this process to be widely used in today's consumer electronics applications. For the performance driven market, flip chip interconnection reduces signal propagation delay, provide much better bandwidth, and relieves the constraints of power and ground distribution. For the form factor driven market, such as mobile applications, replacing wire bonding by flip chip interconnects reduces the size and weight of the package.
The Global Info Research report includes an overview of the development of the Solder Bumps industry chain, the market status of BGA (Lead Solder Bumps, Lead Free Solder Bumps), CSP & WLCSP (Lead Solder Bumps, Lead Free Solder Bumps), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Solder Bumps.
Regionally, the report analyzes the Solder Bumps markets in key regions. North America and Europe are experiencing steady growth, driven by government initiatives and increasing consumer awareness. Asia-Pacific, particularly China, leads the global Solder Bumps market, with robust domestic demand, supportive policies, and a strong manufacturing base.
Key Features:
The report presents comprehensive understanding of the Solder Bumps market. It provides a holistic view of the industry, as well as detailed insights into individual components and stakeholders. The report analysis market dynamics, trends, challenges, and opportunities within the Solder Bumps industry.
The report involves analyzing the market at a macro level:
Market Sizing and Segmentation: Report collect data on the overall market size, including the sales quantity (K MT), revenue generated, and market share of different by Type (e.g., Lead Solder Bumps, Lead Free Solder Bumps).
Industry Analysis: Report analyse the broader industry trends, such as government policies and regulations, technological advancements, consumer preferences, and market dynamics. This analysis helps in understanding the key drivers and challenges influencing the Solder Bumps market.
Regional Analysis: The report involves examining the Solder Bumps market at a regional or national level. Report analyses regional factors such as government incentives, infrastructure development, economic conditions, and consumer behaviour to identify variations and opportunities within different markets.
Market Projections: Report covers the gathered data and analysis to make future projections and forecasts for the Solder Bumps market. This may include estimating market growth rates, predicting market demand, and identifying emerging trends.
The report also involves a more granular approach to Solder Bumps:
Company Analysis: Report covers individual Solder Bumps manufacturers, suppliers, and other relevant industry players. This analysis includes studying their financial performance, market positioning, product portfolios, partnerships, and strategies.
Consumer Analysis: Report covers data on consumer behaviour, preferences, and attitudes towards Solder Bumps This may involve surveys, interviews, and analysis of consumer reviews and feedback from different by Application (BGA, CSP & WLCSP).
Technology Analysis: Report covers specific technologies relevant to Solder Bumps. It assesses the current state, advancements, and potential future developments in Solder Bumps areas.
Competitive Landscape: By analyzing individual companies, suppliers, and consumers, the report present insights into the competitive landscape of the Solder Bumps market. This analysis helps understand market share, competitive advantages, and potential areas for differentiation among industry players.
Market Validation: The report involves validating findings and projections through primary research, such as surveys, interviews, and focus groups.
Market Segmentation
Solder Bumps market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value.
Market segment by Type
Lead Solder Bumps
Lead Free Solder Bumps
Market segment by Application
BGA
CSP & WLCSP
Flip-Chip & Others
Major players covered
Senju Metal
DS HiMetal
MKE
YCTC
Accurus
PMTC
Shanghai hiking solder material
Shenmao Technology
Nippon Micrometal
Indium Corporation
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Solder Bumps product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Solder Bumps, with price, sales, revenue and global market share of Solder Bumps from 2019 to 2024.
Chapter 3, the Solder Bumps competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Solder Bumps breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2019 to 2030.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2019 to 2030.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2023.and Solder Bumps market forecast, by regions, type and application, with sales and revenue, from 2025 to 2030.
Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Solder Bumps.
Chapter 14 and 15, to describe Solder Bumps sales channel, distributors, customers, research findings and conclusion.


1 Market Overview

  • 1.1 Product Overview and Scope of Solder Bumps
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Market Analysis by Type
    • 1.3.1 Overview: Global Solder Bumps Consumption Value by Type: 2019 Versus 2023 Versus 2030
    • 1.3.2 Lead Solder Bumps
    • 1.3.3 Lead Free Solder Bumps
  • 1.4 Market Analysis by Application
    • 1.4.1 Overview: Global Solder Bumps Consumption Value by Application: 2019 Versus 2023 Versus 2030
    • 1.4.2 BGA
    • 1.4.3 CSP & WLCSP
    • 1.4.4 Flip-Chip & Others
  • 1.5 Global Solder Bumps Market Size & Forecast
    • 1.5.1 Global Solder Bumps Consumption Value (2019 & 2023 & 2030)
    • 1.5.2 Global Solder Bumps Sales Quantity (2019-2030)
    • 1.5.3 Global Solder Bumps Average Price (2019-2030)

2 Manufacturers Profiles

  • 2.1 Senju Metal
    • 2.1.1 Senju Metal Details
    • 2.1.2 Senju Metal Major Business
    • 2.1.3 Senju Metal Solder Bumps Product and Services
    • 2.1.4 Senju Metal Solder Bumps Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.1.5 Senju Metal Recent Developments/Updates
  • 2.2 DS HiMetal
    • 2.2.1 DS HiMetal Details
    • 2.2.2 DS HiMetal Major Business
    • 2.2.3 DS HiMetal Solder Bumps Product and Services
    • 2.2.4 DS HiMetal Solder Bumps Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.2.5 DS HiMetal Recent Developments/Updates
  • 2.3 MKE
    • 2.3.1 MKE Details
    • 2.3.2 MKE Major Business
    • 2.3.3 MKE Solder Bumps Product and Services
    • 2.3.4 MKE Solder Bumps Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.3.5 MKE Recent Developments/Updates
  • 2.4 YCTC
    • 2.4.1 YCTC Details
    • 2.4.2 YCTC Major Business
    • 2.4.3 YCTC Solder Bumps Product and Services
    • 2.4.4 YCTC Solder Bumps Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.4.5 YCTC Recent Developments/Updates
  • 2.5 Accurus
    • 2.5.1 Accurus Details
    • 2.5.2 Accurus Major Business
    • 2.5.3 Accurus Solder Bumps Product and Services
    • 2.5.4 Accurus Solder Bumps Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.5.5 Accurus Recent Developments/Updates
  • 2.6 PMTC
    • 2.6.1 PMTC Details
    • 2.6.2 PMTC Major Business
    • 2.6.3 PMTC Solder Bumps Product and Services
    • 2.6.4 PMTC Solder Bumps Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.6.5 PMTC Recent Developments/Updates
  • 2.7 Shanghai hiking solder material
    • 2.7.1 Shanghai hiking solder material Details
    • 2.7.2 Shanghai hiking solder material Major Business
    • 2.7.3 Shanghai hiking solder material Solder Bumps Product and Services
    • 2.7.4 Shanghai hiking solder material Solder Bumps Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.7.5 Shanghai hiking solder material Recent Developments/Updates
  • 2.8 Shenmao Technology
    • 2.8.1 Shenmao Technology Details
    • 2.8.2 Shenmao Technology Major Business
    • 2.8.3 Shenmao Technology Solder Bumps Product and Services
    • 2.8.4 Shenmao Technology Solder Bumps Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.8.5 Shenmao Technology Recent Developments/Updates
  • 2.9 Nippon Micrometal
    • 2.9.1 Nippon Micrometal Details
    • 2.9.2 Nippon Micrometal Major Business
    • 2.9.3 Nippon Micrometal Solder Bumps Product and Services
    • 2.9.4 Nippon Micrometal Solder Bumps Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.9.5 Nippon Micrometal Recent Developments/Updates
  • 2.10 Indium Corporation
    • 2.10.1 Indium Corporation Details
    • 2.10.2 Indium Corporation Major Business
    • 2.10.3 Indium Corporation Solder Bumps Product and Services
    • 2.10.4 Indium Corporation Solder Bumps Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2019-2024)
    • 2.10.5 Indium Corporation Recent Developments/Updates

3 Competitive Environment: Solder Bumps by Manufacturer

  • 3.1 Global Solder Bumps Sales Quantity by Manufacturer (2019-2024)
  • 3.2 Global Solder Bumps Revenue by Manufacturer (2019-2024)
  • 3.3 Global Solder Bumps Average Price by Manufacturer (2019-2024)
  • 3.4 Market Share Analysis (2023)
    • 3.4.1 Producer Shipments of Solder Bumps by Manufacturer Revenue ($MM) and Market Share (%): 2023
    • 3.4.2 Top 3 Solder Bumps Manufacturer Market Share in 2023
    • 3.4.2 Top 6 Solder Bumps Manufacturer Market Share in 2023
  • 3.5 Solder Bumps Market: Overall Company Footprint Analysis
    • 3.5.1 Solder Bumps Market: Region Footprint
    • 3.5.2 Solder Bumps Market: Company Product Type Footprint
    • 3.5.3 Solder Bumps Market: Company Product Application Footprint
  • 3.6 New Market Entrants and Barriers to Market Entry
  • 3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

  • 4.1 Global Solder Bumps Market Size by Region
    • 4.1.1 Global Solder Bumps Sales Quantity by Region (2019-2030)
    • 4.1.2 Global Solder Bumps Consumption Value by Region (2019-2030)
    • 4.1.3 Global Solder Bumps Average Price by Region (2019-2030)
  • 4.2 North America Solder Bumps Consumption Value (2019-2030)
  • 4.3 Europe Solder Bumps Consumption Value (2019-2030)
  • 4.4 Asia-Pacific Solder Bumps Consumption Value (2019-2030)
  • 4.5 South America Solder Bumps Consumption Value (2019-2030)
  • 4.6 Middle East and Africa Solder Bumps Consumption Value (2019-2030)

5 Market Segment by Type

  • 5.1 Global Solder Bumps Sales Quantity by Type (2019-2030)
  • 5.2 Global Solder Bumps Consumption Value by Type (2019-2030)
  • 5.3 Global Solder Bumps Average Price by Type (2019-2030)

6 Market Segment by Application

  • 6.1 Global Solder Bumps Sales Quantity by Application (2019-2030)
  • 6.2 Global Solder Bumps Consumption Value by Application (2019-2030)
  • 6.3 Global Solder Bumps Average Price by Application (2019-2030)

7 North America

  • 7.1 North America Solder Bumps Sales Quantity by Type (2019-2030)
  • 7.2 North America Solder Bumps Sales Quantity by Application (2019-2030)
  • 7.3 North America Solder Bumps Market Size by Country
    • 7.3.1 North America Solder Bumps Sales Quantity by Country (2019-2030)
    • 7.3.2 North America Solder Bumps Consumption Value by Country (2019-2030)
    • 7.3.3 United States Market Size and Forecast (2019-2030)
    • 7.3.4 Canada Market Size and Forecast (2019-2030)
    • 7.3.5 Mexico Market Size and Forecast (2019-2030)

8 Europe

  • 8.1 Europe Solder Bumps Sales Quantity by Type (2019-2030)
  • 8.2 Europe Solder Bumps Sales Quantity by Application (2019-2030)
  • 8.3 Europe Solder Bumps Market Size by Country
    • 8.3.1 Europe Solder Bumps Sales Quantity by Country (2019-2030)
    • 8.3.2 Europe Solder Bumps Consumption Value by Country (2019-2030)
    • 8.3.3 Germany Market Size and Forecast (2019-2030)
    • 8.3.4 France Market Size and Forecast (2019-2030)
    • 8.3.5 United Kingdom Market Size and Forecast (2019-2030)
    • 8.3.6 Russia Market Size and Forecast (2019-2030)
    • 8.3.7 Italy Market Size and Forecast (2019-2030)

9 Asia-Pacific

  • 9.1 Asia-Pacific Solder Bumps Sales Quantity by Type (2019-2030)
  • 9.2 Asia-Pacific Solder Bumps Sales Quantity by Application (2019-2030)
  • 9.3 Asia-Pacific Solder Bumps Market Size by Region
    • 9.3.1 Asia-Pacific Solder Bumps Sales Quantity by Region (2019-2030)
    • 9.3.2 Asia-Pacific Solder Bumps Consumption Value by Region (2019-2030)
    • 9.3.3 China Market Size and Forecast (2019-2030)
    • 9.3.4 Japan Market Size and Forecast (2019-2030)
    • 9.3.5 Korea Market Size and Forecast (2019-2030)
    • 9.3.6 India Market Size and Forecast (2019-2030)
    • 9.3.7 Southeast Asia Market Size and Forecast (2019-2030)
    • 9.3.8 Australia Market Size and Forecast (2019-2030)

10 South America

  • 10.1 South America Solder Bumps Sales Quantity by Type (2019-2030)
  • 10.2 South America Solder Bumps Sales Quantity by Application (2019-2030)
  • 10.3 South America Solder Bumps Market Size by Country
    • 10.3.1 South America Solder Bumps Sales Quantity by Country (2019-2030)
    • 10.3.2 South America Solder Bumps Consumption Value by Country (2019-2030)
    • 10.3.3 Brazil Market Size and Forecast (2019-2030)
    • 10.3.4 Argentina Market Size and Forecast (2019-2030)

11 Middle East & Africa

  • 11.1 Middle East & Africa Solder Bumps Sales Quantity by Type (2019-2030)
  • 11.2 Middle East & Africa Solder Bumps Sales Quantity by Application (2019-2030)
  • 11.3 Middle East & Africa Solder Bumps Market Size by Country
    • 11.3.1 Middle East & Africa Solder Bumps Sales Quantity by Country (2019-2030)
    • 11.3.2 Middle East & Africa Solder Bumps Consumption Value by Country (2019-2030)
    • 11.3.3 Turkey Market Size and Forecast (2019-2030)
    • 11.3.4 Egypt Market Size and Forecast (2019-2030)
    • 11.3.5 Saudi Arabia Market Size and Forecast (2019-2030)
    • 11.3.6 South Africa Market Size and Forecast (2019-2030)

12 Market Dynamics

  • 12.1 Solder Bumps Market Drivers
  • 12.2 Solder Bumps Market Restraints
  • 12.3 Solder Bumps Trends Analysis
  • 12.4 Porters Five Forces Analysis
    • 12.4.1 Threat of New Entrants
    • 12.4.2 Bargaining Power of Suppliers
    • 12.4.3 Bargaining Power of Buyers
    • 12.4.4 Threat of Substitutes
    • 12.4.5 Competitive Rivalry

13 Raw Material and Industry Chain

  • 13.1 Raw Material of Solder Bumps and Key Manufacturers
  • 13.2 Manufacturing Costs Percentage of Solder Bumps
  • 13.3 Solder Bumps Production Process
  • 13.4 Solder Bumps Industrial Chain

14 Shipments by Distribution Channel

  • 14.1 Sales Channel
    • 14.1.1 Direct to End-User
    • 14.1.2 Distributors
  • 14.2 Solder Bumps Typical Distributors
  • 14.3 Solder Bumps Typical Customers

15 Research Findings and Conclusion

    16 Appendix

    • 16.1 Methodology
    • 16.2 Research Process and Data Source

    Summary:
    Get latest Market Research Reports on Solder Bumps. Industry analysis & Market Report on Solder Bumps is a syndicated market report, published as Global Solder Bumps Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030. It is complete Research Study and Industry Analysis of Solder Bumps market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.

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