Report Detail
Global Solder Bumps Market Professional Survey Report 2019
- RnM3816317 |
- 15 October, 2019 |
- Global |
- 100 Pages |
- QYResearch |
- Electronics & Semiconductor
The global Solder Bumps market was valued at million US$ in 2018 and will reach million US$ by the end of 2025, growing at a CAGR of during 2019-2025.
This report focuses on Solder Bumps volume and value at global level, regional level and company level. From a global perspective, this report represents overall Solder Bumps market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of Solder Bumps in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their Solder Bumps manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.
The following manufacturers are covered:
Senju Metal (Japan)
DS HiMetal (Korea)
MKE (Korea)
YCTC (Taiwan)
Nippon Micrometal (Japan)
Accurus (Taiwan)
PMTC (Taiwan)
Shanghai hiking solder material (China)
Shenmao Technology (Taiwan)
Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India
Segment by Type
Lead Solder Bumps
Lead Free Solder Bumps
Segment by Application
BGA
CSP & WLCSP
Flip-Chip & Others
Table of Contents
Executive Summary
1 Industry Overview of Solder Bumps
- 1.1 Definition of Solder Bumps
- 1.2 Solder Bumps Segment by Type
- 1.2.1 Global Solder Bumps Production Growth Rate Comparison by Types (2014-2025)
- 1.2.2 Lead Solder Bumps
- 1.2.3 Lead Free Solder Bumps
- 1.3 Solder Bumps Segment by Applications
- 1.3.1 Global Solder Bumps Consumption Comparison by Applications (2014-2025)
- 1.3.2 BGA
- 1.3.3 CSP & WLCSP
- 1.3.4 Flip-Chip & Others
- 1.4 Global Solder Bumps Overall Market
- 1.4.1 Global Solder Bumps Revenue (2014-2025)
- 1.4.2 Global Solder Bumps Production (2014-2025)
- 1.4.3 North America Solder Bumps Status and Prospect (2014-2025)
- 1.4.4 Europe Solder Bumps Status and Prospect (2014-2025)
- 1.4.5 China Solder Bumps Status and Prospect (2014-2025)
- 1.4.6 Japan Solder Bumps Status and Prospect (2014-2025)
- 1.4.7 Southeast Asia Solder Bumps Status and Prospect (2014-2025)
- 1.4.8 India Solder Bumps Status and Prospect (2014-2025)
2 Manufacturing Cost Structure Analysis
- 2.1 Raw Material and Suppliers
- 2.2 Manufacturing Cost Structure Analysis of Solder Bumps
- 2.3 Manufacturing Process Analysis of Solder Bumps
- 2.4 Industry Chain Structure of Solder Bumps
3 Development and Manufacturing Plants Analysis of Solder Bumps
- 3.1 Capacity and Commercial Production Date
- 3.2 Global Solder Bumps Manufacturing Plants Distribution
- 3.3 Major Manufacturers Technology Source and Market Position of Solder Bumps
- 3.4 Recent Development and Expansion Plans
4 Key Figures of Major Manufacturers
- 4.1 Solder Bumps Production and Capacity Analysis
- 4.2 Solder Bumps Revenue Analysis
- 4.3 Solder Bumps Price Analysis
- 4.4 Market Concentration Degree
5 Solder Bumps Regional Market Analysis
- 5.1 Solder Bumps Production by Regions
- 5.1.1 Global Solder Bumps Production by Regions
- 5.1.2 Global Solder Bumps Revenue by Regions
- 5.2 Solder Bumps Consumption by Regions
- 5.3 North America Solder Bumps Market Analysis
- 5.3.1 North America Solder Bumps Production
- 5.3.2 North America Solder Bumps Revenue
- 5.3.3 Key Manufacturers in North America
- 5.3.4 North America Solder Bumps Import and Export
- 5.4 Europe Solder Bumps Market Analysis
- 5.4.1 Europe Solder Bumps Production
- 5.4.2 Europe Solder Bumps Revenue
- 5.4.3 Key Manufacturers in Europe
- 5.4.4 Europe Solder Bumps Import and Export
- 5.5 China Solder Bumps Market Analysis
- 5.5.1 China Solder Bumps Production
- 5.5.2 China Solder Bumps Revenue
- 5.5.3 Key Manufacturers in China
- 5.5.4 China Solder Bumps Import and Export
- 5.6 Japan Solder Bumps Market Analysis
- 5.6.1 Japan Solder Bumps Production
- 5.6.2 Japan Solder Bumps Revenue
- 5.6.3 Key Manufacturers in Japan
- 5.6.4 Japan Solder Bumps Import and Export
- 5.7 Southeast Asia Solder Bumps Market Analysis
- 5.7.1 Southeast Asia Solder Bumps Production
- 5.7.2 Southeast Asia Solder Bumps Revenue
- 5.7.3 Key Manufacturers in Southeast Asia
- 5.7.4 Southeast Asia Solder Bumps Import and Export
- 5.8 India Solder Bumps Market Analysis
- 5.8.1 India Solder Bumps Production
- 5.8.2 India Solder Bumps Revenue
- 5.8.3 Key Manufacturers in India
- 5.8.4 India Solder Bumps Import and Export
6 Solder Bumps Segment Market Analysis (by Type)
- 6.1 Global Solder Bumps Production by Type
- 6.2 Global Solder Bumps Revenue by Type
- 6.3 Solder Bumps Price by Type
7 Solder Bumps Segment Market Analysis (by Application)
- 7.1 Global Solder Bumps Consumption by Application
- 7.2 Global Solder Bumps Consumption Market Share by Application (2014-2019)
8 Solder Bumps Major Manufacturers Analysis
- 8.1 Senju Metal (Japan)
- 8.1.1 Senju Metal (Japan) Solder Bumps Production Sites and Area Served
- 8.1.2 Senju Metal (Japan) Product Introduction, Application and Specification
- 8.1.3 Senju Metal (Japan) Solder Bumps Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.1.4 Main Business and Markets Served
- 8.2 DS HiMetal (Korea)
- 8.2.1 DS HiMetal (Korea) Solder Bumps Production Sites and Area Served
- 8.2.2 DS HiMetal (Korea) Product Introduction, Application and Specification
- 8.2.3 DS HiMetal (Korea) Solder Bumps Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.2.4 Main Business and Markets Served
- 8.3 MKE (Korea)
- 8.3.1 MKE (Korea) Solder Bumps Production Sites and Area Served
- 8.3.2 MKE (Korea) Product Introduction, Application and Specification
- 8.3.3 MKE (Korea) Solder Bumps Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.3.4 Main Business and Markets Served
- 8.4 YCTC (Taiwan)
- 8.4.1 YCTC (Taiwan) Solder Bumps Production Sites and Area Served
- 8.4.2 YCTC (Taiwan) Product Introduction, Application and Specification
- 8.4.3 YCTC (Taiwan) Solder Bumps Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.4.4 Main Business and Markets Served
- 8.5 Nippon Micrometal (Japan)
- 8.5.1 Nippon Micrometal (Japan) Solder Bumps Production Sites and Area Served
- 8.5.2 Nippon Micrometal (Japan) Product Introduction, Application and Specification
- 8.5.3 Nippon Micrometal (Japan) Solder Bumps Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.5.4 Main Business and Markets Served
- 8.6 Accurus (Taiwan)
- 8.6.1 Accurus (Taiwan) Solder Bumps Production Sites and Area Served
- 8.6.2 Accurus (Taiwan) Product Introduction, Application and Specification
- 8.6.3 Accurus (Taiwan) Solder Bumps Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.6.4 Main Business and Markets Served
- 8.7 PMTC (Taiwan)
- 8.7.1 PMTC (Taiwan) Solder Bumps Production Sites and Area Served
- 8.7.2 PMTC (Taiwan) Product Introduction, Application and Specification
- 8.7.3 PMTC (Taiwan) Solder Bumps Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.7.4 Main Business and Markets Served
- 8.8 Shanghai hiking solder material (China)
- 8.8.1 Shanghai hiking solder material (China) Solder Bumps Production Sites and Area Served
- 8.8.2 Shanghai hiking solder material (China) Product Introduction, Application and Specification
- 8.8.3 Shanghai hiking solder material (China) Solder Bumps Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.8.4 Main Business and Markets Served
- 8.9 Shenmao Technology (Taiwan)
- 8.9.1 Shenmao Technology (Taiwan) Solder Bumps Production Sites and Area Served
- 8.9.2 Shenmao Technology (Taiwan) Product Introduction, Application and Specification
- 8.9.3 Shenmao Technology (Taiwan) Solder Bumps Production, Revenue, Ex-factory Price and Gross Margin (2014-2019)
- 8.9.4 Main Business and Markets Served
9 Development Trend of Analysis of Solder Bumps Market
- 9.1 Global Solder Bumps Market Trend Analysis
- 9.1.1 Global Solder Bumps Market Size (Volume and Value) Forecast 2019-2025
- 9.2 Solder Bumps Regional Market Trend
- 9.2.1 North America Solder Bumps Forecast 2019-2025
- 9.2.2 Europe Solder Bumps Forecast 2019-2025
- 9.2.3 China Solder Bumps Forecast 2019-2025
- 9.2.4 Japan Solder Bumps Forecast 2019-2025
- 9.2.5 Southeast Asia Solder Bumps Forecast 2019-2025
- 9.2.6 India Solder Bumps Forecast 2019-2025
- 9.3 Solder Bumps Market Trend (Product Type)
- 9.4 Solder Bumps Market Trend (Application)
- 10.1 Marketing Channel
- 10.1.1 Direct Marketing
- 10.1.2 Indirect Marketing
- 10.3 Solder Bumps Customers
11 Market Dynamics
- 11.1 Market Trends
- 11.2 Opportunities
- 11.3 Market Drivers
- 11.4 Challenges
- 11.5 Influence Factors
12 Conclusion
13 Appendix
- 13.1 Methodology/Research Approach
- 13.1.1 Research Programs/Design
- 13.1.2 Market Size Estimation
- 13.1.3 Market Breakdown and Data Triangulation
- 13.2 Data Source
- 13.2.1 Secondary Sources
- 13.2.2 Primary Sources
- 13.3 Author List
Summary:
Get latest Market Research Reports on Solder Bumps. Industry analysis & Market Report on Solder Bumps is a syndicated market report, published as Global Solder Bumps Market Professional Survey Report 2019. It is complete Research Study and Industry Analysis of Solder Bumps market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.
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