According to our (Global Info Research) latest study, the global Soft Board FPC market size was valued at US$ 5402 million in 2025 and is forecast to a readjusted size of US$ 6768 million by 2032 with a CAGR of 3.3% during review period.
FPC is a flexible and foldable printed circuit board based on polyimide or polyester film, which has high reliability and excellent flexibility. The advantages of soft board FPC are: small size and light weight, suitable for high-density, miniaturization and lightweight electronic product design. It is highly flexible and can move and expand arbitrarily in three-dimensional space, realizing the integration of component assembly and wire connection. Good heat dissipation performance can reduce the operating temperature of the circuit and improve the stability and life of the circuit. Save space and materials, reduce the number of circuit board layers and connectors, and reduce costs and repair rates.
FPC has the characteristics of small size, light weight, and bendability. It fits the popular trend of lightweight electronic products and is widely used in consumer electronics such as smartphones, tablets, and PCs. Later, with the popularity of emerging products such as new energy vehicles, AR/VR, and wearable devices, the application field of FPC has been further expanded. At the end of the 20th century, affected by the transfer of FPC industries in the United States and other places, the FPC industry in countries or regions such as Japan, South Korea, and Taiwan, China grew rapidly and became the main production base of FPC in the world. Domestic FPC companies have a short development time and are restricted by funds, scale, technology reserves, and upstream and downstream. There is still a certain gap in comprehensive competitiveness with international leading companies. Thanks to the flexibility, lightness, reliability, and excellent electrical performance of FPC, the application scenarios of FPC are constantly expanding, especially the innovative development of consumer electronics, automotive electronics, medical equipment, industrial automation, aerospace, new energy and energy storage, 5G communications, etc., providing possibilities for the in-depth development of FPC. For example, in the field of smartphones, FPC can be applied to modules such as antennas, camera modules, screen connections, fingerprint recognition, battery connections, and wireless charging; in the field of automotive electronics, FPC can be applied to modules such as battery management systems (BMS), sensors, advanced driver assistance systems (ADAS), and in-vehicle entertainment systems; in the medical field, FPC can be applied to modules such as portable medical devices and wearable health monitoring devices; in the industrial field, FPC can be applied to modules such as sensors and actuators, robots, and industrial computers. The diversified development of application scenarios has driven the continued growth of FPC market demand.
Integration and lightweight are the two core advantages of FPC. In terms of integration, FPC can reduce the number of connectors or traditional wiring harnesses, simplify the assembly process, and can also be designed into a multi-layer structure. Metallized holes are formed by drilling and electroplating to achieve conductive connections between different layers, achieve high-density wiring in a limited space, reduce the distance between electronic components and improve overall performance. In terms of lightweight, FPC uses thin substrates such as polyimide (PI) film to reduce the space occupied and weight of equipment. If a car uses FPC flexible flat wiring harness instead of traditional wiring harness, the overall weight of the wiring harness will be reduced by about 50% and the volume will be reduced by about 60%. Therefore, with the advantages of integration and lightweight, the penetration rate of FPC in terminal applications such as smartphones and automotive electronics will continue to increase.
This report is a detailed and comprehensive analysis for global Soft Board FPC market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Soft Board FPC market size and forecasts, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2021-2032
Global Soft Board FPC market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2021-2032
Global Soft Board FPC market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2021-2032
Global Soft Board FPC market shares of main players, shipments in revenue ($ Million), sales quantity (K Units), and ASP (US$/Unit), 2021-2026
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Soft Board FPC
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Soft Board FPC market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include BEST FLEXIBLE CIRCUITS, UnitePCB, Nippon Mektron, Flexible Circuits Inc., SEI, Fujikura, SIFLEX, Bhflex, Interflex, Daeduck Electronics, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Soft Board FPC market is split by Type and by Application. For the period 2021-2032, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Single Sided FPC
Double Sided FPC
Multi-sided FPC
Market segment by Application
Communications Industry
Consumer Electronics Industry
Automobile Industry
Medical Industry
Others
Major players covered
BEST FLEXIBLE CIRCUITS
UnitePCB
Nippon Mektron
Flexible Circuits Inc.
SEI
Fujikura
SIFLEX
Bhflex
Interflex
Daeduck Electronics
Topsun
MFS
Zhen Ding Tech
JLC
CMD
Sun&Lynn Circuits
DSBJ
Flexium Interconnect
CAREER TECHNOLOGY (MFG.)
HONFLEX
KINWONG
ichia
AKM Industrial Company
JCD
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Soft Board FPC product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Soft Board FPC, with price, sales quantity, revenue, and global market share of Soft Board FPC from 2021 to 2026.
Chapter 3, the Soft Board FPC competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Soft Board FPC breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2021 to 2032.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2021 to 2032.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2021 to 2026.and Soft Board FPC market forecast, by regions, by Type, and by Application, with sales and revenue, from 2027 to 2032.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Soft Board FPC.
Chapter 14 and 15, to describe Soft Board FPC sales channel, distributors, customers, research findings and conclusion.
Summary:
Get latest Market Research Reports on Soft Board FPC. Industry analysis & Market Report on Soft Board FPC is a syndicated market report, published as Global Soft Board FPC Market 2026 by Manufacturers, Regions, Type and Application, Forecast to 2032. It is complete Research Study and Industry Analysis of Soft Board FPC market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.