This report studies the Silicon on Insulator (SOI) market. Silicon on Insulator (SOI) is a semiconductor fabrication technique developed by IBM that uses pure crystal silicon and silicon oxide for integrated circuits (ICs) and microchips. An SOI microchip processing speed is often 30% faster than today's complementary metal-oxide semiconductor (CMOS)-based chips and power consumption is reduced 80%, which makes them ideal for mobile devices. SOI chips also reduce the soft error rate, which is data corruption caused by cosmic rays and natural radioactive background signals.
Silicon on Insulator (SOI) is a new type of starting material for the chipmaking process. SOI wafers have three layers; a thin surface layer of silicon (from a few hundred Angstrom to several microns thick) where the transistors are formed, an underlying layer of insulating material on a support or "handle" bulk silicon wafer. The insulating layer, usually made of silicon dioxide, is referred to as the "buried oxide" or "BOX", and is usually a few thousand Angstroms thick. Transistors built within the top silicon layer, switch signals faster, run at lower voltages, and are much less vulnerable to signal noise from background cosmic ray particles. Each transistor is isolated from its neighbor by a complete layer of silicon dioxide. These transistors are immune to "latch-up" problems and can be spaced closer together than transistors built on bulk silicon wafers. Building circuits on SOI increases Fab productivity by allowing for more compact circuit designs, yielding more chips per wafer.
SOI enables increased chip functionality without the cost of major Fab process equipment changes. Faster circuit operation and lower operating voltages have produced a powerful surge in the performance of high-speed network servers and new designs for hand-held computing and communication devices with longer battery life. Advanced circuits, using multiple layers of SOI-type device silicon, can lead the way to a coupling of electrical and optical signal processing into a single chip resulting in a dramatic broadening of communication bandwidth and new applications such as global-ranging, direct-link entertainment and communication to hand-held devices.
The market in APAC is expected to grow at the highest CAGR during 2018–2023. APAC is witnessing an increase in the use of SOI products owing to the presence of a large number of consumer electronic companies, smartphone manufacturers, and wafer and foundry players in APAC.
In 2019, the market size of Silicon on Insulator is 500 million US$ and it will reach 1830 million US$ in 2025, growing at a CAGR of 17.6% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Silicon on Insulator.
This report studies the global market size of Silicon on Insulator, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
This study presents the Silicon on Insulator production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.
For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.
In global market, the following companies are covered:
Soitec SA
Shin-Etsu Chemical
SunEdison
...
Market Segment by Product Type
300mm SOI
Small Diameters
Market Segment by Application
Automobile and Smart Industry
Consumer Electronic
Others
Key Regions split in this report: breakdown data for each region.
United States
China
European Union
Rest of World (Japan, Korea, India and Southeast Asia)
The study objectives are:
To analyze and research the Silicon on Insulator status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
To present the key Silicon on Insulator manufacturers, presenting the sales, revenue, market share, and recent development for key players.
To split the breakdown data by regions, type, companies and applications
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market
In this study, the years considered to estimate the market size of Silicon on Insulator are as follows:
History Year: 2014-2018
Base Year: 2018
Estimated Year: 2019
Forecast Year 2019 to 2025
Summary:
Get latest Market Research Reports on Silicon on Insulator. Industry analysis & Market Report on Silicon on Insulator is a syndicated market report, published as Global (United States, European Union and China) Silicon on Insulator Market Research Report 2019-2025. It is complete Research Study and Industry Analysis of Silicon on Insulator market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.