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Machinery & Equipment Global Semiconductor Transfer Molding Equipment Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

  • RnM4627501
    • |
  • 26 September, 2025
    • |
  • Global
    • |
  • 105 Pages
    • |
  • GIR
    • |
  • Machinery & Equipment

According to our (Global Info Research) latest study, the global Semiconductor Transfer Molding Equipment market size was valued at US$ 1807 million in 2024 and is forecast to a readjusted size of USD 2745 million by 2031 with a CAGR of 6.4% during review period.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
Semiconductor transfer molding equipment is a key equipment dedicated to packaging integrated circuit chips. It is mainly used to achieve the uniform injection of thermosetting plastic packaging materials into the mold under high temperature and high pressure, thereby completing the chip packaging process. This type of equipment is widely used in various packaging forms such as discrete devices, power modules, BGA, QFN, SOP, etc., with significant advantages such as high packaging efficiency, high molding accuracy, and high material utilization. Transfer molding technology, with its excellent sealing and thermal conductivity, can effectively protect chips from external moisture, mechanical shock and chemical corrosion, extend chip life and improve product reliability.
Market Trends
In applications such as power devices, automotive electronics, 5G communication chips, and industrial control chips that require extremely high packaging reliability, transfer molding has become an irreplaceable key process with its excellent packaging consistency and excellent mechanical and electrical protection performance. The market demand for miniaturized, high-density, and high-power packaging has driven the demand for high-precision and high-efficiency transfer molding equipment. At the same time, the continuous evolution of packaging forms, such as multi-chip packaging (MCM) and system-level packaging (SiP), is also driving the equipment from a single function to multi-cavity, high automation and intelligence.
Market Disadvantages
The core technology of high-end equipment is mainly in the hands of a few equipment manufacturers in Japan, South Korea, Europe and the United States. The core links involved, such as mold precision processing, temperature control system, and injection precision control, have high technical barriers, and domestic manufacturers are still in the catching-up stage. Due to the complex structure and high degree of automation of the equipment, customers tend to choose equipment brands with mature cases and long-term stable operation records when purchasing, which forms a market access barrier for new entrants.
Market Outlook
Emerging fields such as smart terminals, electric vehicles, and the Internet of Things continue to generate huge demand for high-reliability packaging, thereby driving molding equipment to develop in the direction of higher precision, stronger stability, and higher integration. In the future, equipment will place more emphasis on the combination of automation and informatization, such as the introduction of AI detection, remote operation and maintenance, and real-time data analysis to improve packaging quality control and production efficiency. In addition, with the continuous transfer of global semiconductor manufacturing capabilities to the Asia-Pacific region and the strong support of the "domestic substitution" policy, local equipment companies are expected to usher in the dual opportunities of technological breakthroughs and increased market share.
This report is a detailed and comprehensive analysis for global Semiconductor Transfer Molding Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Semiconductor Transfer Molding Equipment market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global Semiconductor Transfer Molding Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global Semiconductor Transfer Molding Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global Semiconductor Transfer Molding Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K US$/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Semiconductor Transfer Molding Equipment
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Semiconductor Transfer Molding Equipment market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include TOWA Corporation, ASMPT, Yamaha Motor Robotics Holdings, I-PEX, Besi, Takara Tool & Die, Boschman, FUSEI MENIX, Shanghai Xinsheng Semiconductor Technology, Guangdong Taijin Semiconductor Technology, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Semiconductor Transfer Molding Equipment market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Automatic
Semi-automatic
Manual
Market segment by Application
BGA
QFN
QFP
Others
Major players covered
TOWA Corporation
ASMPT
Yamaha Motor Robotics Holdings
I-PEX
Besi
Takara Tool & Die
Boschman
FUSEI MENIX
Shanghai Xinsheng Semiconductor Technology
Guangdong Taijin Semiconductor Technology
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Semiconductor Transfer Molding Equipment product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Semiconductor Transfer Molding Equipment, with price, sales quantity, revenue, and global market share of Semiconductor Transfer Molding Equipment from 2020 to 2025.
Chapter 3, the Semiconductor Transfer Molding Equipment competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Semiconductor Transfer Molding Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Semiconductor Transfer Molding Equipment market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Semiconductor Transfer Molding Equipment.
Chapter 14 and 15, to describe Semiconductor Transfer Molding Equipment sales channel, distributors, customers, research findings and conclusion.


1 Market Overview

  • 1.1 Product Overview and Scope
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Market Analysis by Type
    • 1.3.1 Overview: Global Semiconductor Transfer Molding Equipment Consumption Value by Type: 2020 Versus 2024 Versus 2031
    • 1.3.2 Automatic
    • 1.3.3 Semi-automatic
    • 1.3.4 Manual
  • 1.4 Market Analysis by Application
    • 1.4.1 Overview: Global Semiconductor Transfer Molding Equipment Consumption Value by Application: 2020 Versus 2024 Versus 2031
    • 1.4.2 BGA
    • 1.4.3 QFN
    • 1.4.4 QFP
    • 1.4.5 Others
  • 1.5 Global Semiconductor Transfer Molding Equipment Market Size & Forecast
    • 1.5.1 Global Semiconductor Transfer Molding Equipment Consumption Value (2020 & 2024 & 2031)
    • 1.5.2 Global Semiconductor Transfer Molding Equipment Sales Quantity (2020-2031)
    • 1.5.3 Global Semiconductor Transfer Molding Equipment Average Price (2020-2031)

2 Manufacturers Profiles

  • 2.1 TOWA Corporation
    • 2.1.1 TOWA Corporation Details
    • 2.1.2 TOWA Corporation Major Business
    • 2.1.3 TOWA Corporation Semiconductor Transfer Molding Equipment Product and Services
    • 2.1.4 TOWA Corporation Semiconductor Transfer Molding Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.1.5 TOWA Corporation Recent Developments/Updates
  • 2.2 ASMPT
    • 2.2.1 ASMPT Details
    • 2.2.2 ASMPT Major Business
    • 2.2.3 ASMPT Semiconductor Transfer Molding Equipment Product and Services
    • 2.2.4 ASMPT Semiconductor Transfer Molding Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.2.5 ASMPT Recent Developments/Updates
  • 2.3 Yamaha Motor Robotics Holdings
    • 2.3.1 Yamaha Motor Robotics Holdings Details
    • 2.3.2 Yamaha Motor Robotics Holdings Major Business
    • 2.3.3 Yamaha Motor Robotics Holdings Semiconductor Transfer Molding Equipment Product and Services
    • 2.3.4 Yamaha Motor Robotics Holdings Semiconductor Transfer Molding Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.3.5 Yamaha Motor Robotics Holdings Recent Developments/Updates
  • 2.4 I-PEX
    • 2.4.1 I-PEX Details
    • 2.4.2 I-PEX Major Business
    • 2.4.3 I-PEX Semiconductor Transfer Molding Equipment Product and Services
    • 2.4.4 I-PEX Semiconductor Transfer Molding Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.4.5 I-PEX Recent Developments/Updates
  • 2.5 Besi
    • 2.5.1 Besi Details
    • 2.5.2 Besi Major Business
    • 2.5.3 Besi Semiconductor Transfer Molding Equipment Product and Services
    • 2.5.4 Besi Semiconductor Transfer Molding Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.5.5 Besi Recent Developments/Updates
  • 2.6 Takara Tool & Die
    • 2.6.1 Takara Tool & Die Details
    • 2.6.2 Takara Tool & Die Major Business
    • 2.6.3 Takara Tool & Die Semiconductor Transfer Molding Equipment Product and Services
    • 2.6.4 Takara Tool & Die Semiconductor Transfer Molding Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.6.5 Takara Tool & Die Recent Developments/Updates
  • 2.7 Boschman
    • 2.7.1 Boschman Details
    • 2.7.2 Boschman Major Business
    • 2.7.3 Boschman Semiconductor Transfer Molding Equipment Product and Services
    • 2.7.4 Boschman Semiconductor Transfer Molding Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.7.5 Boschman Recent Developments/Updates
  • 2.8 FUSEI MENIX
    • 2.8.1 FUSEI MENIX Details
    • 2.8.2 FUSEI MENIX Major Business
    • 2.8.3 FUSEI MENIX Semiconductor Transfer Molding Equipment Product and Services
    • 2.8.4 FUSEI MENIX Semiconductor Transfer Molding Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.8.5 FUSEI MENIX Recent Developments/Updates
  • 2.9 Shanghai Xinsheng Semiconductor Technology
    • 2.9.1 Shanghai Xinsheng Semiconductor Technology Details
    • 2.9.2 Shanghai Xinsheng Semiconductor Technology Major Business
    • 2.9.3 Shanghai Xinsheng Semiconductor Technology Semiconductor Transfer Molding Equipment Product and Services
    • 2.9.4 Shanghai Xinsheng Semiconductor Technology Semiconductor Transfer Molding Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.9.5 Shanghai Xinsheng Semiconductor Technology Recent Developments/Updates
  • 2.10 Guangdong Taijin Semiconductor Technology
    • 2.10.1 Guangdong Taijin Semiconductor Technology Details
    • 2.10.2 Guangdong Taijin Semiconductor Technology Major Business
    • 2.10.3 Guangdong Taijin Semiconductor Technology Semiconductor Transfer Molding Equipment Product and Services
    • 2.10.4 Guangdong Taijin Semiconductor Technology Semiconductor Transfer Molding Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.10.5 Guangdong Taijin Semiconductor Technology Recent Developments/Updates

3 Competitive Environment: Semiconductor Transfer Molding Equipment by Manufacturer

  • 3.1 Global Semiconductor Transfer Molding Equipment Sales Quantity by Manufacturer (2020-2025)
  • 3.2 Global Semiconductor Transfer Molding Equipment Revenue by Manufacturer (2020-2025)
  • 3.3 Global Semiconductor Transfer Molding Equipment Average Price by Manufacturer (2020-2025)
  • 3.4 Market Share Analysis (2024)
    • 3.4.1 Producer Shipments of Semiconductor Transfer Molding Equipment by Manufacturer Revenue ($MM) and Market Share (%): 2024
    • 3.4.2 Top 3 Semiconductor Transfer Molding Equipment Manufacturer Market Share in 2024
    • 3.4.3 Top 6 Semiconductor Transfer Molding Equipment Manufacturer Market Share in 2024
  • 3.5 Semiconductor Transfer Molding Equipment Market: Overall Company Footprint Analysis
    • 3.5.1 Semiconductor Transfer Molding Equipment Market: Region Footprint
    • 3.5.2 Semiconductor Transfer Molding Equipment Market: Company Product Type Footprint
    • 3.5.3 Semiconductor Transfer Molding Equipment Market: Company Product Application Footprint
  • 3.6 New Market Entrants and Barriers to Market Entry
  • 3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

  • 4.1 Global Semiconductor Transfer Molding Equipment Market Size by Region
    • 4.1.1 Global Semiconductor Transfer Molding Equipment Sales Quantity by Region (2020-2031)
    • 4.1.2 Global Semiconductor Transfer Molding Equipment Consumption Value by Region (2020-2031)
    • 4.1.3 Global Semiconductor Transfer Molding Equipment Average Price by Region (2020-2031)
  • 4.2 North America Semiconductor Transfer Molding Equipment Consumption Value (2020-2031)
  • 4.3 Europe Semiconductor Transfer Molding Equipment Consumption Value (2020-2031)
  • 4.4 Asia-Pacific Semiconductor Transfer Molding Equipment Consumption Value (2020-2031)
  • 4.5 South America Semiconductor Transfer Molding Equipment Consumption Value (2020-2031)
  • 4.6 Middle East & Africa Semiconductor Transfer Molding Equipment Consumption Value (2020-2031)

5 Market Segment by Type

  • 5.1 Global Semiconductor Transfer Molding Equipment Sales Quantity by Type (2020-2031)
  • 5.2 Global Semiconductor Transfer Molding Equipment Consumption Value by Type (2020-2031)
  • 5.3 Global Semiconductor Transfer Molding Equipment Average Price by Type (2020-2031)

6 Market Segment by Application

  • 6.1 Global Semiconductor Transfer Molding Equipment Sales Quantity by Application (2020-2031)
  • 6.2 Global Semiconductor Transfer Molding Equipment Consumption Value by Application (2020-2031)
  • 6.3 Global Semiconductor Transfer Molding Equipment Average Price by Application (2020-2031)

7 North America

  • 7.1 North America Semiconductor Transfer Molding Equipment Sales Quantity by Type (2020-2031)
  • 7.2 North America Semiconductor Transfer Molding Equipment Sales Quantity by Application (2020-2031)
  • 7.3 North America Semiconductor Transfer Molding Equipment Market Size by Country
    • 7.3.1 North America Semiconductor Transfer Molding Equipment Sales Quantity by Country (2020-2031)
    • 7.3.2 North America Semiconductor Transfer Molding Equipment Consumption Value by Country (2020-2031)
    • 7.3.3 United States Market Size and Forecast (2020-2031)
    • 7.3.4 Canada Market Size and Forecast (2020-2031)
    • 7.3.5 Mexico Market Size and Forecast (2020-2031)

8 Europe

  • 8.1 Europe Semiconductor Transfer Molding Equipment Sales Quantity by Type (2020-2031)
  • 8.2 Europe Semiconductor Transfer Molding Equipment Sales Quantity by Application (2020-2031)
  • 8.3 Europe Semiconductor Transfer Molding Equipment Market Size by Country
    • 8.3.1 Europe Semiconductor Transfer Molding Equipment Sales Quantity by Country (2020-2031)
    • 8.3.2 Europe Semiconductor Transfer Molding Equipment Consumption Value by Country (2020-2031)
    • 8.3.3 Germany Market Size and Forecast (2020-2031)
    • 8.3.4 France Market Size and Forecast (2020-2031)
    • 8.3.5 United Kingdom Market Size and Forecast (2020-2031)
    • 8.3.6 Russia Market Size and Forecast (2020-2031)
    • 8.3.7 Italy Market Size and Forecast (2020-2031)

9 Asia-Pacific

  • 9.1 Asia-Pacific Semiconductor Transfer Molding Equipment Sales Quantity by Type (2020-2031)
  • 9.2 Asia-Pacific Semiconductor Transfer Molding Equipment Sales Quantity by Application (2020-2031)
  • 9.3 Asia-Pacific Semiconductor Transfer Molding Equipment Market Size by Region
    • 9.3.1 Asia-Pacific Semiconductor Transfer Molding Equipment Sales Quantity by Region (2020-2031)
    • 9.3.2 Asia-Pacific Semiconductor Transfer Molding Equipment Consumption Value by Region (2020-2031)
    • 9.3.3 China Market Size and Forecast (2020-2031)
    • 9.3.4 Japan Market Size and Forecast (2020-2031)
    • 9.3.5 South Korea Market Size and Forecast (2020-2031)
    • 9.3.6 India Market Size and Forecast (2020-2031)
    • 9.3.7 Southeast Asia Market Size and Forecast (2020-2031)
    • 9.3.8 Australia Market Size and Forecast (2020-2031)

10 South America

  • 10.1 South America Semiconductor Transfer Molding Equipment Sales Quantity by Type (2020-2031)
  • 10.2 South America Semiconductor Transfer Molding Equipment Sales Quantity by Application (2020-2031)
  • 10.3 South America Semiconductor Transfer Molding Equipment Market Size by Country
    • 10.3.1 South America Semiconductor Transfer Molding Equipment Sales Quantity by Country (2020-2031)
    • 10.3.2 South America Semiconductor Transfer Molding Equipment Consumption Value by Country (2020-2031)
    • 10.3.3 Brazil Market Size and Forecast (2020-2031)
    • 10.3.4 Argentina Market Size and Forecast (2020-2031)

11 Middle East & Africa

  • 11.1 Middle East & Africa Semiconductor Transfer Molding Equipment Sales Quantity by Type (2020-2031)
  • 11.2 Middle East & Africa Semiconductor Transfer Molding Equipment Sales Quantity by Application (2020-2031)
  • 11.3 Middle East & Africa Semiconductor Transfer Molding Equipment Market Size by Country
    • 11.3.1 Middle East & Africa Semiconductor Transfer Molding Equipment Sales Quantity by Country (2020-2031)
    • 11.3.2 Middle East & Africa Semiconductor Transfer Molding Equipment Consumption Value by Country (2020-2031)
    • 11.3.3 Turkey Market Size and Forecast (2020-2031)
    • 11.3.4 Egypt Market Size and Forecast (2020-2031)
    • 11.3.5 Saudi Arabia Market Size and Forecast (2020-2031)
    • 11.3.6 South Africa Market Size and Forecast (2020-2031)

12 Market Dynamics

  • 12.1 Semiconductor Transfer Molding Equipment Market Drivers
  • 12.2 Semiconductor Transfer Molding Equipment Market Restraints
  • 12.3 Semiconductor Transfer Molding Equipment Trends Analysis
  • 12.4 Porters Five Forces Analysis
    • 12.4.1 Threat of New Entrants
    • 12.4.2 Bargaining Power of Suppliers
    • 12.4.3 Bargaining Power of Buyers
    • 12.4.4 Threat of Substitutes
    • 12.4.5 Competitive Rivalry

13 Raw Material and Industry Chain

  • 13.1 Raw Material of Semiconductor Transfer Molding Equipment and Key Manufacturers
  • 13.2 Manufacturing Costs Percentage of Semiconductor Transfer Molding Equipment
  • 13.3 Semiconductor Transfer Molding Equipment Production Process
  • 13.4 Industry Value Chain Analysis

14 Shipments by Distribution Channel

  • 14.1 Sales Channel
    • 14.1.1 Direct to End-User
    • 14.1.2 Distributors
  • 14.2 Semiconductor Transfer Molding Equipment Typical Distributors
  • 14.3 Semiconductor Transfer Molding Equipment Typical Customers

15 Research Findings and Conclusion

    16 Appendix

    • 16.1 Methodology
    • 16.2 Research Process and Data Source

    Summary:
    Get latest Market Research Reports on Semiconductor Transfer Molding Equipment. Industry analysis & Market Report on Semiconductor Transfer Molding Equipment is a syndicated market report, published as Global Semiconductor Transfer Molding Equipment Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031. It is complete Research Study and Industry Analysis of Semiconductor Transfer Molding Equipment market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.

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