Report Detail

Machinery & Equipment Global Semiconductor Assembly Equipments Market Research Report 2019

  • RnM3060297
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  • 05 March, 2019
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  • Global
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  • 105 Pages
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  • QYResearch
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  • Machinery & Equipment

Semiconductor chip assembly is a key component of the semiconductor supply chain. It is a part of the back-end process of chip formation. Chip assembly basically involves attaching or joining two or more semiconductor wafers or semiconductor devices to increase the functionality of chips. Machinery is used for making interconnects between an IC or any other semiconductor device during assembly. This connection ensures the flow of electricity in the semiconductor device.
The semiconductor assembly equipment market by die bonding equipment contributed to the maximum market shares during 2017 and the segment will continue its dominance during the estimated period as well. The growing demand for semiconductor chips from various end-user industries including energy, power, green cars, automobile, telecommunication, LED lighting, military, aerospace, and defense, and robotics, will positively influence the growth potential of this market segments.
The semiconductor assembly equipment market by OSATs dominated the market during 2017. The segment includes various players that are involved in packaging, assembly, and testing. The growth of the segment is determined by the overall growth of the semiconductor industry and the rising price of packaging, assembly, and testing equipment. According to this market research and analysis, this segment will continue to dominate the market throughout the forecast period.

The global Semiconductor Assembly Equipments market is valued at xx million US$ in 2018 is expected to reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Semiconductor Assembly Equipments volume and value at global level, regional level and company level. From a global perspective, this report represents overall Semiconductor Assembly Equipments market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan.
At company level, this report focuses on the production capacity, ex-factory price, revenue and market share for each manufacturer covered in this report.

The following manufacturers are covered:
ASM Pacific Technology
Kulicke & Soffa Industries
Palomar Technologies
Tokyo Electron
Tokyo Seimitsu
Besi
ChipMOS Technologies
DIAS Automation
Greatek Electronics
Hesse Mechatronics
Hybond
Shinkawa
Toray Engineering
West Bond

Segment by Regions
North America
Europe
China
Japan

Segment by Type
Die Bonding Equipment
Inspection and Dicing Equipment
Packaging Equipment
Wire Bonding Equipment
Plating Equipment
Other

Segment by Application
Integrated Device Manufacturer (IDMs)
Outsourced Semiconductor Assembly and Testing (OSATs)


Table of Contents

    Executive Summary

      1 Semiconductor Assembly Equipments Market Overview

      • 1.1 Product Overview and Scope of Semiconductor Assembly Equipments
      • 1.2 Semiconductor Assembly Equipments Segment by Type
        • 1.2.1 Global Semiconductor Assembly Equipments Production Growth Rate Comparison by Type (2014-2025)
        • 1.2.2 Die Bonding Equipment
        • 1.2.3 Inspection and Dicing Equipment
        • 1.2.4 Packaging Equipment
        • 1.2.5 Wire Bonding Equipment
        • 1.2.6 Plating Equipment
        • 1.2.7 Other
      • 1.3 Semiconductor Assembly Equipments Segment by Application
        • 1.3.1 Semiconductor Assembly Equipments Consumption Comparison by Application (2014-2025)
        • 1.3.2 Integrated Device Manufacturer (IDMs)
        • 1.3.3 Outsourced Semiconductor Assembly and Testing (OSATs)
      • 1.4 Global Semiconductor Assembly Equipments Market by Region
        • 1.4.1 Global Semiconductor Assembly Equipments Market Size Region
        • 1.4.2 North America Status and Prospect (2014-2025)
        • 1.4.3 Europe Status and Prospect (2014-2025)
        • 1.4.4 China Status and Prospect (2014-2025)
        • 1.4.5 Japan Status and Prospect (2014-2025)
      • 1.5 Global Semiconductor Assembly Equipments Market Size
        • 1.5.1 Global Semiconductor Assembly Equipments Revenue (2014-2025)
        • 1.5.2 Global Semiconductor Assembly Equipments Production (2014-2025)

      2 Global Semiconductor Assembly Equipments Market Competition by Manufacturers

      • 2.1 Global Semiconductor Assembly Equipments Production Market Share by Manufacturers (2014-2019)
      • 2.2 Global Semiconductor Assembly Equipments Revenue Share by Manufacturers (2014-2019)
      • 2.3 Global Semiconductor Assembly Equipments Average Price by Manufacturers (2014-2019)
      • 2.4 Manufacturers Semiconductor Assembly Equipments Production Sites, Area Served, Product Types
      • 2.5 Semiconductor Assembly Equipments Market Competitive Situation and Trends
        • 2.5.1 Semiconductor Assembly Equipments Market Concentration Rate
        • 2.5.2 Semiconductor Assembly Equipments Market Share of Top 3 and Top 5 Manufacturers
        • 2.5.3 Mergers & Acquisitions, Expansion

      3 Global Semiconductor Assembly Equipments Production Market Share by Regions

      • 3.1 Global Semiconductor Assembly Equipments Production Market Share by Regions
      • 3.2 Global Semiconductor Assembly Equipments Revenue Market Share by Regions (2014-2019)
      • 3.3 Global Semiconductor Assembly Equipments Production, Revenue, Price and Gross Margin (2014-2019)
      • 3.4 North America Semiconductor Assembly Equipments Production
        • 3.4.1 North America Semiconductor Assembly Equipments Production Growth Rate (2014-2019)
        • 3.4.2 North America Semiconductor Assembly Equipments Production, Revenue, Price and Gross Margin (2014-2019)
      • 3.5 Europe Semiconductor Assembly Equipments Production
        • 3.5.1 Europe Semiconductor Assembly Equipments Production Growth Rate (2014-2019)
        • 3.5.2 Europe Semiconductor Assembly Equipments Production, Revenue, Price and Gross Margin (2014-2019)
      • 3.6 China Semiconductor Assembly Equipments Production (2014-2019)
        • 3.6.1 China Semiconductor Assembly Equipments Production Growth Rate (2014-2019)
        • 3.6.2 China Semiconductor Assembly Equipments Production, Revenue, Price and Gross Margin (2014-2019)
      • 3.7 Japan Semiconductor Assembly Equipments Production (2014-2019)
        • 3.7.1 Japan Semiconductor Assembly Equipments Production Growth Rate (2014-2019)
        • 3.7.2 Japan Semiconductor Assembly Equipments Production, Revenue, Price and Gross Margin (2014-2019)

      4 Global Semiconductor Assembly Equipments Consumption by Regions

      • 4.1 Global Semiconductor Assembly Equipments Consumption by Regions
      • 4.2 North America Semiconductor Assembly Equipments Consumption (2014-2019)
      • 4.3 Europe Semiconductor Assembly Equipments Consumption (2014-2019)
      • 4.4 China Semiconductor Assembly Equipments Consumption (2014-2019)
      • 4.5 Japan Semiconductor Assembly Equipments Consumption (2014-2019)

      5 Global Semiconductor Assembly Equipments Production, Revenue, Price Trend by Type

      • 5.1 Global Semiconductor Assembly Equipments Production Market Share by Type (2014-2019)
      • 5.2 Global Semiconductor Assembly Equipments Revenue Market Share by Type (2014-2019)
      • 5.3 Global Semiconductor Assembly Equipments Price by Type (2014-2019)
      • 5.4 Global Semiconductor Assembly Equipments Production Growth by Type (2014-2019)

      6 Global Semiconductor Assembly Equipments Market Analysis by Applications

      • 6.1 Global Semiconductor Assembly Equipments Consumption Market Share by Application (2014-2019)
      • 6.2 Global Semiconductor Assembly Equipments Consumption Growth Rate by Application (2014-2019)

      7 Company Profiles and Key Figures in Semiconductor Assembly Equipments Business

      • 7.1 ASM Pacific Technology
        • 7.1.1 ASM Pacific Technology Semiconductor Assembly Equipments Production Sites and Area Served
        • 7.1.2 Semiconductor Assembly Equipments Product Introduction, Application and Specification
        • 7.1.3 ASM Pacific Technology Semiconductor Assembly Equipments Production, Revenue, Price and Gross Margin (2014-2019)
        • 7.1.4 Main Business and Markets Served
      • 7.2 Kulicke & Soffa Industries
        • 7.2.1 Kulicke & Soffa Industries Semiconductor Assembly Equipments Production Sites and Area Served
        • 7.2.2 Semiconductor Assembly Equipments Product Introduction, Application and Specification
        • 7.2.3 Kulicke & Soffa Industries Semiconductor Assembly Equipments Production, Revenue, Price and Gross Margin (2014-2019)
        • 7.2.4 Main Business and Markets Served
      • 7.3 Palomar Technologies
        • 7.3.1 Palomar Technologies Semiconductor Assembly Equipments Production Sites and Area Served
        • 7.3.2 Semiconductor Assembly Equipments Product Introduction, Application and Specification
        • 7.3.3 Palomar Technologies Semiconductor Assembly Equipments Production, Revenue, Price and Gross Margin (2014-2019)
        • 7.3.4 Main Business and Markets Served
      • 7.4 Tokyo Electron
        • 7.4.1 Tokyo Electron Semiconductor Assembly Equipments Production Sites and Area Served
        • 7.4.2 Semiconductor Assembly Equipments Product Introduction, Application and Specification
        • 7.4.3 Tokyo Electron Semiconductor Assembly Equipments Production, Revenue, Price and Gross Margin (2014-2019)
        • 7.4.4 Main Business and Markets Served
      • 7.5 Tokyo Seimitsu
        • 7.5.1 Tokyo Seimitsu Semiconductor Assembly Equipments Production Sites and Area Served
        • 7.5.2 Semiconductor Assembly Equipments Product Introduction, Application and Specification
        • 7.5.3 Tokyo Seimitsu Semiconductor Assembly Equipments Production, Revenue, Price and Gross Margin (2014-2019)
        • 7.5.4 Main Business and Markets Served
      • 7.6 Besi
        • 7.6.1 Besi Semiconductor Assembly Equipments Production Sites and Area Served
        • 7.6.2 Semiconductor Assembly Equipments Product Introduction, Application and Specification
        • 7.6.3 Besi Semiconductor Assembly Equipments Production, Revenue, Price and Gross Margin (2014-2019)
        • 7.6.4 Main Business and Markets Served
      • 7.7 ChipMOS Technologies
        • 7.7.1 ChipMOS Technologies Semiconductor Assembly Equipments Production Sites and Area Served
        • 7.7.2 Semiconductor Assembly Equipments Product Introduction, Application and Specification
        • 7.7.3 ChipMOS Technologies Semiconductor Assembly Equipments Production, Revenue, Price and Gross Margin (2014-2019)
        • 7.7.4 Main Business and Markets Served
      • 7.8 DIAS Automation
        • 7.8.1 DIAS Automation Semiconductor Assembly Equipments Production Sites and Area Served
        • 7.8.2 Semiconductor Assembly Equipments Product Introduction, Application and Specification
        • 7.8.3 DIAS Automation Semiconductor Assembly Equipments Production, Revenue, Price and Gross Margin (2014-2019)
        • 7.8.4 Main Business and Markets Served
      • 7.9 Greatek Electronics
        • 7.9.1 Greatek Electronics Semiconductor Assembly Equipments Production Sites and Area Served
        • 7.9.2 Semiconductor Assembly Equipments Product Introduction, Application and Specification
        • 7.9.3 Greatek Electronics Semiconductor Assembly Equipments Production, Revenue, Price and Gross Margin (2014-2019)
        • 7.9.4 Main Business and Markets Served
      • 7.10 Hesse Mechatronics
        • 7.10.1 Hesse Mechatronics Semiconductor Assembly Equipments Production Sites and Area Served
        • 7.10.2 Semiconductor Assembly Equipments Product Introduction, Application and Specification
        • 7.10.3 Hesse Mechatronics Semiconductor Assembly Equipments Production, Revenue, Price and Gross Margin (2014-2019)
        • 7.10.4 Main Business and Markets Served
      • 7.11 Hybond
      • 7.12 Shinkawa
      • 7.13 Toray Engineering
      • 7.14 West Bond

      8 Semiconductor Assembly Equipments Manufacturing Cost Analysis

      • 8.1 Semiconductor Assembly Equipments Key Raw Materials Analysis
        • 8.1.1 Key Raw Materials
        • 8.1.2 Price Trend of Key Raw Materials
        • 8.1.3 Key Suppliers of Raw Materials
      • 8.2 Proportion of Manufacturing Cost Structure
      • 8.3 Manufacturing Process Analysis of Semiconductor Assembly Equipments
      • 8.4 Semiconductor Assembly Equipments Industrial Chain Analysis

      9 Marketing Channel, Distributors and Customers

      • 9.1 Marketing Channel
        • 9.1.1 Direct Marketing
        • 9.1.2 Indirect Marketing
      • 9.2 Semiconductor Assembly Equipments Distributors List
      • 9.3 Semiconductor Assembly Equipments Customers

      10 Market Dynamics

      • 10.1 Market Trends
      • 10.2 Opportunities
      • 10.3 Market Drivers
      • 10.4 Challenges
      • 10.5 Influence Factors

      11 Global Semiconductor Assembly Equipments Market Forecast

      • 11.1 Global Semiconductor Assembly Equipments Production, Revenue Forecast
        • 11.1.1 Global Semiconductor Assembly Equipments Production Growth Rate Forecast (2019-2025)
        • 11.1.2 Global Semiconductor Assembly Equipments Revenue and Growth Rate Forecast (2019-2025)
        • 11.1.3 Global Semiconductor Assembly Equipments Price and Trend Forecast (2019-2025)
      • 11.2 Global Semiconductor Assembly Equipments Production Forecast by Regions (2019-2025)
        • 11.2.1 North America Semiconductor Assembly Equipments Production, Revenue Forecast (2019-2025)
        • 11.2.2 Europe Semiconductor Assembly Equipments Production, Revenue Forecast (2019-2025)
        • 11.2.3 China Semiconductor Assembly Equipments Production, Revenue Forecast (2019-2025)
        • 11.2.4 Japan Semiconductor Assembly Equipments Production, Revenue Forecast (2019-2025)
      • 11.3 Global Semiconductor Assembly Equipments Consumption Forecast by Regions (2019-2025)
        • 11.3.1 North America Semiconductor Assembly Equipments Consumption Forecast (2019-2025)
        • 11.3.2 Europe Semiconductor Assembly Equipments Consumption Forecast (2019-2025)
        • 11.3.3 China Semiconductor Assembly Equipments Consumption Forecast (2019-2025)
        • 11.3.4 Japan Semiconductor Assembly Equipments Consumption Forecast (2019-2025)
      • 11.4 Global Semiconductor Assembly Equipments Production, Revenue and Price Forecast by Type (2019-2025)
      • 11.5 Global Semiconductor Assembly Equipments Consumption Forecast by Application (2019-2025)

      12 Research Findings and Conclusion

        13 Methodology and Data Source

        • 13.1 Methodology/Research Approach
          • 13.1.1 Research Programs/Design
          • 13.1.2 Market Size Estimation
          • 13.1.3 Market Breakdown and Data Triangulation
        • 13.2 Data Source
          • 13.2.1 Secondary Sources
          • 13.2.2 Primary Sources
        • 13.3 Author List

        Summary:
        Get latest Market Research Reports on Semiconductor Assembly Equipments . Industry analysis & Market Report on Semiconductor Assembly Equipments is a syndicated market report, published as Global Semiconductor Assembly Equipments Market Research Report 2019. It is complete Research Study and Industry Analysis of Semiconductor Assembly Equipments market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.

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