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Electronics & Semiconductor Global Quad Flat No-leads (QFN) Package Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

  • RnM4627597
    • |
  • 26 September, 2025
    • |
  • Global
    • |
  • 109 Pages
    • |
  • GIR
    • |
  • Electronics & Semiconductor

According to our (Global Info Research) latest study, the global Quad Flat No-leads (QFN) Package market size was valued at US$ 1494 million in 2024 and is forecast to a readjusted size of USD 1939 million by 2031 with a CAGR of 3.8% during review period.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
Quad Flat No-Lead (QFN) is a surface-mount integrated circuit (IC) package designed to offer superior electrical and thermal performance while maintaining a compact form factor. It is a leadframe-based package where the leads do not extend beyond the package body, making it ideal for applications requiring high-density board assembly and improved thermal dissipation.
Market Drivers
Miniaturization of Electronic Devices: The ever - growing demand for smaller, lighter, and more portable electronic devices such as smartphones, tablets, and wearables is a major driver for the QFN package market. QFN packages' small form factor and low - profile design enable manufacturers to fit more components into a limited space, meeting the strict size and weight requirements of modern consumer electronics.
Increasing Demand in the Automotive Industry: With the advancement of automotive electronics, including electric vehicle (EV) battery management systems, advanced driver - assistance systems (ADAS), and in - vehicle infotainment systems, there is a rising need for reliable and high - performance semiconductor packages. QFN packages offer excellent thermal management and electrical performance, making them suitable for automotive applications where reliability and stability are crucial.
Growth of 5G and IoT Technologies: The rapid development of 5G communication and the Internet of Things (IoT) is fueling the demand for QFN packages. These technologies require high - frequency, high - speed signal processing, and QFN packages' low - inductance and low - resistance characteristics can effectively reduce signal interference and loss, ensuring stable and efficient data transmission.
Market Challenges
Intense Competition from Alternative Packages: The QFN package market faces fierce competition from other semiconductor packaging technologies such as Wafer - Level Chip - Scale Packages (WLCSP) and Ball Grid Arrays (BGA). These alternative packages also offer miniaturization and high - performance features, and in some cases, may have cost - advantages or better - suited characteristics for specific applications, posing a threat to the market share of QFN packages.
Complex Manufacturing Processes: The manufacturing of QFN packages involves complex processes, including lead - frame processing, wire bonding, and molding. Any deviation in these processes can lead to quality issues, such as voids in the mold compound or poor wire - bond reliability. Ensuring consistent quality control throughout the manufacturing process is a challenge for manufacturers, which can increase production costs and affect market competitiveness.
Fluctuating Raw Material Prices: The prices of raw materials used in QFN package manufacturing, such as copper, gold, and epoxy molding compounds, are subject to significant fluctuations due to global supply - demand imbalances, geopolitical factors, and currency exchange rate variations. These price fluctuations can disrupt production schedules and squeeze profit margins, making it difficult for manufacturers to accurately price their products and plan their operations.
This report is a detailed and comprehensive analysis for global Quad Flat No-leads (QFN) Package market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Quad Flat No-leads (QFN) Package market size and forecasts, in consumption value ($ Million), sales quantity (KK PCS), and average selling prices (US$/K PCS), 2020-2031
Global Quad Flat No-leads (QFN) Package market size and forecasts by region and country, in consumption value ($ Million), sales quantity (KK PCS), and average selling prices (US$/K PCS), 2020-2031
Global Quad Flat No-leads (QFN) Package market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (KK PCS), and average selling prices (US$/K PCS), 2020-2031
Global Quad Flat No-leads (QFN) Package market shares of main players, shipments in revenue ($ Million), sales quantity (KK PCS), and ASP (US$/K PCS), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Quad Flat No-leads (QFN) Package
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Quad Flat No-leads (QFN) Package market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include ASE(SPIL), Amkor Technology, JCET Group, Powertech Technology Inc., Tongfu Microelectronics, Tianshui Huatian Technology, UTAC, Orient Semiconductor, Forehope Electronic, ChipMOS, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Quad Flat No-leads (QFN) Package market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Small Size Package
Large Size Package
Market segment by Application
Automotive
Mobile & Consumer Devices
Client & Edge Computing
Enterprise & Cloud Infrastructure
Telecom & Networking
Industrial & Automation
Others
Major players covered
ASE(SPIL)
Amkor Technology
JCET Group
Powertech Technology Inc.
Tongfu Microelectronics
Tianshui Huatian Technology
UTAC
Orient Semiconductor
Forehope Electronic
ChipMOS
King Yuan Electronics
SFA Semicon
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Quad Flat No-leads (QFN) Package product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Quad Flat No-leads (QFN) Package, with price, sales quantity, revenue, and global market share of Quad Flat No-leads (QFN) Package from 2020 to 2025.
Chapter 3, the Quad Flat No-leads (QFN) Package competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Quad Flat No-leads (QFN) Package breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Quad Flat No-leads (QFN) Package market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Quad Flat No-leads (QFN) Package.
Chapter 14 and 15, to describe Quad Flat No-leads (QFN) Package sales channel, distributors, customers, research findings and conclusion.


1 Market Overview

  • 1.1 Product Overview and Scope
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Market Analysis by Type
    • 1.3.1 Overview: Global Quad Flat No-leads (QFN) Package Consumption Value by Type: 2020 Versus 2024 Versus 2031
    • 1.3.2 Small Size Package
    • 1.3.3 Large Size Package
  • 1.4 Market Analysis by Application
    • 1.4.1 Overview: Global Quad Flat No-leads (QFN) Package Consumption Value by Application: 2020 Versus 2024 Versus 2031
    • 1.4.2 Automotive
    • 1.4.3 Mobile & Consumer Devices
    • 1.4.4 Client & Edge Computing
    • 1.4.5 Enterprise & Cloud Infrastructure
    • 1.4.6 Telecom & Networking
    • 1.4.7 Industrial & Automation
    • 1.4.8 Others
  • 1.5 Global Quad Flat No-leads (QFN) Package Market Size & Forecast
    • 1.5.1 Global Quad Flat No-leads (QFN) Package Consumption Value (2020 & 2024 & 2031)
    • 1.5.2 Global Quad Flat No-leads (QFN) Package Sales Quantity (2020-2031)
    • 1.5.3 Global Quad Flat No-leads (QFN) Package Average Price (2020-2031)

2 Manufacturers Profiles

  • 2.1 ASE(SPIL)
    • 2.1.1 ASE(SPIL) Details
    • 2.1.2 ASE(SPIL) Major Business
    • 2.1.3 ASE(SPIL) Quad Flat No-leads (QFN) Package Product and Services
    • 2.1.4 ASE(SPIL) Quad Flat No-leads (QFN) Package Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.1.5 ASE(SPIL) Recent Developments/Updates
  • 2.2 Amkor Technology
    • 2.2.1 Amkor Technology Details
    • 2.2.2 Amkor Technology Major Business
    • 2.2.3 Amkor Technology Quad Flat No-leads (QFN) Package Product and Services
    • 2.2.4 Amkor Technology Quad Flat No-leads (QFN) Package Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.2.5 Amkor Technology Recent Developments/Updates
  • 2.3 JCET Group
    • 2.3.1 JCET Group Details
    • 2.3.2 JCET Group Major Business
    • 2.3.3 JCET Group Quad Flat No-leads (QFN) Package Product and Services
    • 2.3.4 JCET Group Quad Flat No-leads (QFN) Package Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.3.5 JCET Group Recent Developments/Updates
  • 2.4 Powertech Technology Inc.
    • 2.4.1 Powertech Technology Inc. Details
    • 2.4.2 Powertech Technology Inc. Major Business
    • 2.4.3 Powertech Technology Inc. Quad Flat No-leads (QFN) Package Product and Services
    • 2.4.4 Powertech Technology Inc. Quad Flat No-leads (QFN) Package Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.4.5 Powertech Technology Inc. Recent Developments/Updates
  • 2.5 Tongfu Microelectronics
    • 2.5.1 Tongfu Microelectronics Details
    • 2.5.2 Tongfu Microelectronics Major Business
    • 2.5.3 Tongfu Microelectronics Quad Flat No-leads (QFN) Package Product and Services
    • 2.5.4 Tongfu Microelectronics Quad Flat No-leads (QFN) Package Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.5.5 Tongfu Microelectronics Recent Developments/Updates
  • 2.6 Tianshui Huatian Technology
    • 2.6.1 Tianshui Huatian Technology Details
    • 2.6.2 Tianshui Huatian Technology Major Business
    • 2.6.3 Tianshui Huatian Technology Quad Flat No-leads (QFN) Package Product and Services
    • 2.6.4 Tianshui Huatian Technology Quad Flat No-leads (QFN) Package Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.6.5 Tianshui Huatian Technology Recent Developments/Updates
  • 2.7 UTAC
    • 2.7.1 UTAC Details
    • 2.7.2 UTAC Major Business
    • 2.7.3 UTAC Quad Flat No-leads (QFN) Package Product and Services
    • 2.7.4 UTAC Quad Flat No-leads (QFN) Package Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.7.5 UTAC Recent Developments/Updates
  • 2.8 Orient Semiconductor
    • 2.8.1 Orient Semiconductor Details
    • 2.8.2 Orient Semiconductor Major Business
    • 2.8.3 Orient Semiconductor Quad Flat No-leads (QFN) Package Product and Services
    • 2.8.4 Orient Semiconductor Quad Flat No-leads (QFN) Package Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.8.5 Orient Semiconductor Recent Developments/Updates
  • 2.9 Forehope Electronic
    • 2.9.1 Forehope Electronic Details
    • 2.9.2 Forehope Electronic Major Business
    • 2.9.3 Forehope Electronic Quad Flat No-leads (QFN) Package Product and Services
    • 2.9.4 Forehope Electronic Quad Flat No-leads (QFN) Package Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.9.5 Forehope Electronic Recent Developments/Updates
  • 2.10 ChipMOS
    • 2.10.1 ChipMOS Details
    • 2.10.2 ChipMOS Major Business
    • 2.10.3 ChipMOS Quad Flat No-leads (QFN) Package Product and Services
    • 2.10.4 ChipMOS Quad Flat No-leads (QFN) Package Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.10.5 ChipMOS Recent Developments/Updates
  • 2.11 King Yuan Electronics
    • 2.11.1 King Yuan Electronics Details
    • 2.11.2 King Yuan Electronics Major Business
    • 2.11.3 King Yuan Electronics Quad Flat No-leads (QFN) Package Product and Services
    • 2.11.4 King Yuan Electronics Quad Flat No-leads (QFN) Package Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.11.5 King Yuan Electronics Recent Developments/Updates
  • 2.12 SFA Semicon
    • 2.12.1 SFA Semicon Details
    • 2.12.2 SFA Semicon Major Business
    • 2.12.3 SFA Semicon Quad Flat No-leads (QFN) Package Product and Services
    • 2.12.4 SFA Semicon Quad Flat No-leads (QFN) Package Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2020-2025)
    • 2.12.5 SFA Semicon Recent Developments/Updates

3 Competitive Environment: Quad Flat No-leads (QFN) Package by Manufacturer

  • 3.1 Global Quad Flat No-leads (QFN) Package Sales Quantity by Manufacturer (2020-2025)
  • 3.2 Global Quad Flat No-leads (QFN) Package Revenue by Manufacturer (2020-2025)
  • 3.3 Global Quad Flat No-leads (QFN) Package Average Price by Manufacturer (2020-2025)
  • 3.4 Market Share Analysis (2024)
    • 3.4.1 Producer Shipments of Quad Flat No-leads (QFN) Package by Manufacturer Revenue ($MM) and Market Share (%): 2024
    • 3.4.2 Top 3 Quad Flat No-leads (QFN) Package Manufacturer Market Share in 2024
    • 3.4.3 Top 6 Quad Flat No-leads (QFN) Package Manufacturer Market Share in 2024
  • 3.5 Quad Flat No-leads (QFN) Package Market: Overall Company Footprint Analysis
    • 3.5.1 Quad Flat No-leads (QFN) Package Market: Region Footprint
    • 3.5.2 Quad Flat No-leads (QFN) Package Market: Company Product Type Footprint
    • 3.5.3 Quad Flat No-leads (QFN) Package Market: Company Product Application Footprint
  • 3.6 New Market Entrants and Barriers to Market Entry
  • 3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

  • 4.1 Global Quad Flat No-leads (QFN) Package Market Size by Region
    • 4.1.1 Global Quad Flat No-leads (QFN) Package Sales Quantity by Region (2020-2031)
    • 4.1.2 Global Quad Flat No-leads (QFN) Package Consumption Value by Region (2020-2031)
    • 4.1.3 Global Quad Flat No-leads (QFN) Package Average Price by Region (2020-2031)
  • 4.2 North America Quad Flat No-leads (QFN) Package Consumption Value (2020-2031)
  • 4.3 Europe Quad Flat No-leads (QFN) Package Consumption Value (2020-2031)
  • 4.4 Asia-Pacific Quad Flat No-leads (QFN) Package Consumption Value (2020-2031)
  • 4.5 South America Quad Flat No-leads (QFN) Package Consumption Value (2020-2031)
  • 4.6 Middle East & Africa Quad Flat No-leads (QFN) Package Consumption Value (2020-2031)

5 Market Segment by Type

  • 5.1 Global Quad Flat No-leads (QFN) Package Sales Quantity by Type (2020-2031)
  • 5.2 Global Quad Flat No-leads (QFN) Package Consumption Value by Type (2020-2031)
  • 5.3 Global Quad Flat No-leads (QFN) Package Average Price by Type (2020-2031)

6 Market Segment by Application

  • 6.1 Global Quad Flat No-leads (QFN) Package Sales Quantity by Application (2020-2031)
  • 6.2 Global Quad Flat No-leads (QFN) Package Consumption Value by Application (2020-2031)
  • 6.3 Global Quad Flat No-leads (QFN) Package Average Price by Application (2020-2031)

7 North America

  • 7.1 North America Quad Flat No-leads (QFN) Package Sales Quantity by Type (2020-2031)
  • 7.2 North America Quad Flat No-leads (QFN) Package Sales Quantity by Application (2020-2031)
  • 7.3 North America Quad Flat No-leads (QFN) Package Market Size by Country
    • 7.3.1 North America Quad Flat No-leads (QFN) Package Sales Quantity by Country (2020-2031)
    • 7.3.2 North America Quad Flat No-leads (QFN) Package Consumption Value by Country (2020-2031)
    • 7.3.3 United States Market Size and Forecast (2020-2031)
    • 7.3.4 Canada Market Size and Forecast (2020-2031)
    • 7.3.5 Mexico Market Size and Forecast (2020-2031)

8 Europe

  • 8.1 Europe Quad Flat No-leads (QFN) Package Sales Quantity by Type (2020-2031)
  • 8.2 Europe Quad Flat No-leads (QFN) Package Sales Quantity by Application (2020-2031)
  • 8.3 Europe Quad Flat No-leads (QFN) Package Market Size by Country
    • 8.3.1 Europe Quad Flat No-leads (QFN) Package Sales Quantity by Country (2020-2031)
    • 8.3.2 Europe Quad Flat No-leads (QFN) Package Consumption Value by Country (2020-2031)
    • 8.3.3 Germany Market Size and Forecast (2020-2031)
    • 8.3.4 France Market Size and Forecast (2020-2031)
    • 8.3.5 United Kingdom Market Size and Forecast (2020-2031)
    • 8.3.6 Russia Market Size and Forecast (2020-2031)
    • 8.3.7 Italy Market Size and Forecast (2020-2031)

9 Asia-Pacific

  • 9.1 Asia-Pacific Quad Flat No-leads (QFN) Package Sales Quantity by Type (2020-2031)
  • 9.2 Asia-Pacific Quad Flat No-leads (QFN) Package Sales Quantity by Application (2020-2031)
  • 9.3 Asia-Pacific Quad Flat No-leads (QFN) Package Market Size by Region
    • 9.3.1 Asia-Pacific Quad Flat No-leads (QFN) Package Sales Quantity by Region (2020-2031)
    • 9.3.2 Asia-Pacific Quad Flat No-leads (QFN) Package Consumption Value by Region (2020-2031)
    • 9.3.3 China Market Size and Forecast (2020-2031)
    • 9.3.4 Japan Market Size and Forecast (2020-2031)
    • 9.3.5 South Korea Market Size and Forecast (2020-2031)
    • 9.3.6 India Market Size and Forecast (2020-2031)
    • 9.3.7 Southeast Asia Market Size and Forecast (2020-2031)
    • 9.3.8 Australia Market Size and Forecast (2020-2031)

10 South America

  • 10.1 South America Quad Flat No-leads (QFN) Package Sales Quantity by Type (2020-2031)
  • 10.2 South America Quad Flat No-leads (QFN) Package Sales Quantity by Application (2020-2031)
  • 10.3 South America Quad Flat No-leads (QFN) Package Market Size by Country
    • 10.3.1 South America Quad Flat No-leads (QFN) Package Sales Quantity by Country (2020-2031)
    • 10.3.2 South America Quad Flat No-leads (QFN) Package Consumption Value by Country (2020-2031)
    • 10.3.3 Brazil Market Size and Forecast (2020-2031)
    • 10.3.4 Argentina Market Size and Forecast (2020-2031)

11 Middle East & Africa

  • 11.1 Middle East & Africa Quad Flat No-leads (QFN) Package Sales Quantity by Type (2020-2031)
  • 11.2 Middle East & Africa Quad Flat No-leads (QFN) Package Sales Quantity by Application (2020-2031)
  • 11.3 Middle East & Africa Quad Flat No-leads (QFN) Package Market Size by Country
    • 11.3.1 Middle East & Africa Quad Flat No-leads (QFN) Package Sales Quantity by Country (2020-2031)
    • 11.3.2 Middle East & Africa Quad Flat No-leads (QFN) Package Consumption Value by Country (2020-2031)
    • 11.3.3 Turkey Market Size and Forecast (2020-2031)
    • 11.3.4 Egypt Market Size and Forecast (2020-2031)
    • 11.3.5 Saudi Arabia Market Size and Forecast (2020-2031)
    • 11.3.6 South Africa Market Size and Forecast (2020-2031)

12 Market Dynamics

  • 12.1 Quad Flat No-leads (QFN) Package Market Drivers
  • 12.2 Quad Flat No-leads (QFN) Package Market Restraints
  • 12.3 Quad Flat No-leads (QFN) Package Trends Analysis
  • 12.4 Porters Five Forces Analysis
    • 12.4.1 Threat of New Entrants
    • 12.4.2 Bargaining Power of Suppliers
    • 12.4.3 Bargaining Power of Buyers
    • 12.4.4 Threat of Substitutes
    • 12.4.5 Competitive Rivalry

13 Raw Material and Industry Chain

  • 13.1 Raw Material of Quad Flat No-leads (QFN) Package and Key Manufacturers
  • 13.2 Manufacturing Costs Percentage of Quad Flat No-leads (QFN) Package
  • 13.3 Quad Flat No-leads (QFN) Package Production Process
  • 13.4 Industry Value Chain Analysis

14 Shipments by Distribution Channel

  • 14.1 Sales Channel
    • 14.1.1 Direct to End-User
    • 14.1.2 Distributors
  • 14.2 Quad Flat No-leads (QFN) Package Typical Distributors
  • 14.3 Quad Flat No-leads (QFN) Package Typical Customers

15 Research Findings and Conclusion

    16 Appendix

    • 16.1 Methodology
    • 16.2 Research Process and Data Source

    Summary:
    Get latest Market Research Reports on Quad Flat No-leads (QFN) Package. Industry analysis & Market Report on Quad Flat No-leads (QFN) Package is a syndicated market report, published as Global Quad Flat No-leads (QFN) Package Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031. It is complete Research Study and Industry Analysis of Quad Flat No-leads (QFN) Package market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.

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