According to our (Global Info Research) latest study, the global PUR Electronics Hot Melt Adhesive market size was valued at US$ 118 million in 2024 and is forecast to a readjusted size of USD 194 million by 2031 with a CAGR of 7.4% during review period.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
PUR electronics hot melt adhesive belongs to reactive polyurethane hot melt adhesive. Compared with other electronic glues, this type of product has a wide range of applicable materials, high bonding strength, and good flexibility, which can meet the bonding requirements of most electronic products; this type of product has good fluidity when heated, which is convenient for dispensing/coating, and the glue form is easier to control, giving more process possibilities; through formula design, PUR hot melt adhesive can meet the rework requirements of various materials, without residue or pollution, significantly reducing customer defective costs.
This report is a detailed and comprehensive analysis for global PUR Electronics Hot Melt Adhesive market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global PUR Electronics Hot Melt Adhesive market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/kg), 2020-2031
Global PUR Electronics Hot Melt Adhesive market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/kg), 2020-2031
Global PUR Electronics Hot Melt Adhesive market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/kg), 2020-2031
Global PUR Electronics Hot Melt Adhesive market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/kg), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for PUR Electronics Hot Melt Adhesive
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global PUR Electronics Hot Melt Adhesive market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Henkel, H. B. Fuller, Bostik (Arkema), Jowat Adhesives, 3M, Sika, Kleiberit, IWG, Aozon, Tex Year, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
PUR Electronics Hot Melt Adhesive market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Fast-curing Type
General Type
Market segment by Application
Chip Packaging
Consumer Electronics
Automotive Electronics
PCB
Other
Major players covered
Henkel
H. B. Fuller
Bostik (Arkema)
Jowat Adhesives
3M
Sika
Kleiberit
IWG
Aozon
Tex Year
Guangdong Haojing
Suntip Ahesive
MCS Co.
ShenZhen Txbond
Tianyang New Materials
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe PUR Electronics Hot Melt Adhesive product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of PUR Electronics Hot Melt Adhesive, with price, sales quantity, revenue, and global market share of PUR Electronics Hot Melt Adhesive from 2020 to 2025.
Chapter 3, the PUR Electronics Hot Melt Adhesive competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the PUR Electronics Hot Melt Adhesive breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and PUR Electronics Hot Melt Adhesive market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of PUR Electronics Hot Melt Adhesive.
Chapter 14 and 15, to describe PUR Electronics Hot Melt Adhesive sales channel, distributors, customers, research findings and conclusion.
Summary:
Get latest Market Research Reports on PUR Electronics Hot Melt Adhesive. Industry analysis & Market Report on PUR Electronics Hot Melt Adhesive is a syndicated market report, published as Global PUR Electronics Hot Melt Adhesive Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031. It is complete Research Study and Industry Analysis of PUR Electronics Hot Melt Adhesive market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.