Report Detail
Global Power Module Packaging Market Insights and Forecast to 2026
- RnM4114532 |
- 05 August, 2020 |
- Global |
- 154 Pages |
- QYResearch |
- Electronics & Semiconductor
Power Module Packaging market is segmented by Type, and by Application. Players, stakeholders, and other participants in the global Power Module Packaging market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2015-2026.
Segment by Type, the Power Module Packaging market is segmented into
GaN Module
SiC Module
FET Module
IGBT Module
Thyristors
Segment by Application, the Power Module Packaging market is segmented into
Electric Vehicles (EV)/Hybrid Electric Vehicles (HEV)
Motors
Rail Tractions
Wind Turbines
Photovoltaic Equipment
Regional and Country-level Analysis
The Power Module Packaging market is analysed and market size information is provided by regions (countries).
The key regions covered in the Power Module Packaging market report are North America, Europe, China, Japan and South Korea. It also covers key regions (countries), viz, the U.S., Canada, Germany, France, U.K., Italy, Russia, China, Japan, South Korea, India, Australia, Taiwan, Indonesia, Thailand, Malaysia, Philippines, Vietnam, Mexico, Brazil, Turkey, Saudi Arabia, U.A.E, etc.
The report includes country-wise and region-wise market size for the period 2015-2026. It also includes market size and forecast by Type, and by Application segment in terms of production capacity, price and revenue for the period 2015-2026.
Competitive Landscape and Power Module Packaging Market Share Analysis
Power Module Packaging market competitive landscape provides details and data information by manufacturers. The report offers comprehensive analysis and accurate statistics on production capacity, price, revenue of Power Module Packaging by the player for the period 2015-2020. It also offers detailed analysis supported by reliable statistics on production, revenue (global and regional level) by players for the period 2015-2020. Details included are company description, major business, company total revenue, and the production capacity, price, revenue generated in Power Module Packaging business, the date to enter into the Power Module Packaging market, Power Module Packaging product introduction, recent developments, etc.
The major vendors covered:
Texas Instruments Incorporated
Star Automations
DyDac Controls
SEMIKRON
IXYS Corporation
Infineon Technologies AG
Mitsubishi Electric Corporation
Fuji Electric Co. Ltd.
Sanken Electric Co., Ltd.
SanRex Corporation
ON Semiconductor
STMicroelectronics
Hitachi Power Semiconductor Device
ROHM
Danfoss
1 Study Coverage
- 1.1 Power Module Packaging Product Introduction
- 1.2 Key Market Segments in This Study
- 1.3 Key Manufacturers Covered: Ranking of Global Top Power Module Packaging Manufacturers by Revenue in 2019
- 1.4 Market by Type
- 1.4.1 Global Power Module Packaging Market Size Growth Rate by Type
- 1.4.2 GaN Module
- 1.4.3 SiC Module
- 1.4.4 FET Module
- 1.4.5 IGBT Module
- 1.4.6 Thyristors
- 1.5 Market by Application
- 1.5.1 Global Power Module Packaging Market Size Growth Rate by Application
- 1.5.2 Electric Vehicles (EV)/Hybrid Electric Vehicles (HEV)
- 1.5.3 Motors
- 1.5.4 Rail Tractions
- 1.5.5 Wind Turbines
- 1.5.6 Photovoltaic Equipment
- 1.6 Study Objectives
- 1.7 Years Considered
2 Executive Summary
- 2.1 Global Power Module Packaging Market Size, Estimates and Forecasts
- 2.1.1 Global Power Module Packaging Revenue Estimates and Forecasts 2015-2026
- 2.1.2 Global Power Module Packaging Production Capacity Estimates and Forecasts 2015-2026
- 2.1.3 Global Power Module Packaging Production Estimates and Forecasts 2015-2026
- 2.2 Global Power Module Packaging, Market Size by Producing Regions: 2015 VS 2020 VS 2026
- 2.3 Analysis of Competitive Landscape
- 2.3.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
- 2.3.2 Global Power Module Packaging Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
- 2.3.3 Global Power Module Packaging Manufacturers Geographical Distribution
- 2.4 Key Trends for Power Module Packaging Markets & Products
- 2.5 Primary Interviews with Key Power Module Packaging Players (Opinion Leaders)
3 Market Size by Manufacturers
- 3.1 Global Top Power Module Packaging Manufacturers by Production Capacity
- 3.1.1 Global Top Power Module Packaging Manufacturers by Production Capacity (2015-2020)
- 3.1.2 Global Top Power Module Packaging Manufacturers by Production (2015-2020)
- 3.1.3 Global Top Power Module Packaging Manufacturers Market Share by Production
- 3.2 Global Top Power Module Packaging Manufacturers by Revenue
- 3.2.1 Global Top Power Module Packaging Manufacturers by Revenue (2015-2020)
- 3.2.2 Global Top Power Module Packaging Manufacturers Market Share by Revenue (2015-2020)
- 3.2.3 Global Top 10 and Top 5 Companies by Power Module Packaging Revenue in 2019
- 3.3 Global Power Module Packaging Price by Manufacturers
- 3.4 Mergers & Acquisitions, Expansion Plans
4 Power Module Packaging Production by Regions
- 4.1 Global Power Module Packaging Historic Market Facts & Figures by Regions
- 4.1.1 Global Top Power Module Packaging Regions by Production (2015-2020)
- 4.1.2 Global Top Power Module Packaging Regions by Revenue (2015-2020)
- 4.2 North America
- 4.2.1 North America Power Module Packaging Production (2015-2020)
- 4.2.2 North America Power Module Packaging Revenue (2015-2020)
- 4.2.3 Key Players in North America
- 4.2.4 North America Power Module Packaging Import & Export (2015-2020)
- 4.3 Europe
- 4.3.1 Europe Power Module Packaging Production (2015-2020)
- 4.3.2 Europe Power Module Packaging Revenue (2015-2020)
- 4.3.3 Key Players in Europe
- 4.3.4 Europe Power Module Packaging Import & Export (2015-2020)
- 4.4 China
- 4.4.1 China Power Module Packaging Production (2015-2020)
- 4.4.2 China Power Module Packaging Revenue (2015-2020)
- 4.4.3 Key Players in China
- 4.4.4 China Power Module Packaging Import & Export (2015-2020)
- 4.5 Japan
- 4.5.1 Japan Power Module Packaging Production (2015-2020)
- 4.5.2 Japan Power Module Packaging Revenue (2015-2020)
- 4.5.3 Key Players in Japan
- 4.5.4 Japan Power Module Packaging Import & Export (2015-2020)
- 4.6 South Korea
- 4.6.1 South Korea Power Module Packaging Production (2015-2020)
- 4.6.2 South Korea Power Module Packaging Revenue (2015-2020)
- 4.6.3 Key Players in South Korea
- 4.6.4 South Korea Power Module Packaging Import & Export (2015-2020)
5 Power Module Packaging Consumption by Region
- 5.1 Global Top Power Module Packaging Regions by Consumption
- 5.1.1 Global Top Power Module Packaging Regions by Consumption (2015-2020)
- 5.1.2 Global Top Power Module Packaging Regions Market Share by Consumption (2015-2020)
- 5.2 North America
- 5.2.1 North America Power Module Packaging Consumption by Application
- 5.2.2 North America Power Module Packaging Consumption by Countries
- 5.2.3 U.S.
- 5.2.4 Canada
- 5.3 Europe
- 5.3.1 Europe Power Module Packaging Consumption by Application
- 5.3.2 Europe Power Module Packaging Consumption by Countries
- 5.3.3 Germany
- 5.3.4 France
- 5.3.5 U.K.
- 5.3.6 Italy
- 5.3.7 Russia
- 5.4 Asia Pacific
- 5.4.1 Asia Pacific Power Module Packaging Consumption by Application
- 5.4.2 Asia Pacific Power Module Packaging Consumption by Regions
- 5.4.3 China
- 5.4.4 Japan
- 5.4.5 South Korea
- 5.4.6 India
- 5.4.7 Australia
- 5.4.8 Taiwan
- 5.4.9 Indonesia
- 5.4.10 Thailand
- 5.4.11 Malaysia
- 5.4.12 Philippines
- 5.4.13 Vietnam
- 5.5 Central & South America
- 5.5.1 Central & South America Power Module Packaging Consumption by Application
- 5.5.2 Central & South America Power Module Packaging Consumption by Country
- 5.5.3 Mexico
- 5.5.3 Brazil
- 5.5.3 Argentina
- 5.6 Middle East and Africa
- 5.6.1 Middle East and Africa Power Module Packaging Consumption by Application
- 5.6.2 Middle East and Africa Power Module Packaging Consumption by Countries
- 5.6.3 Turkey
- 5.6.4 Saudi Arabia
- 5.6.5 U.A.E
6 Market Size by Type (2015-2026)
- 6.1 Global Power Module Packaging Market Size by Type (2015-2020)
- 6.1.1 Global Power Module Packaging Production by Type (2015-2020)
- 6.1.2 Global Power Module Packaging Revenue by Type (2015-2020)
- 6.1.3 Power Module Packaging Price by Type (2015-2020)
- 6.2 Global Power Module Packaging Market Forecast by Type (2021-2026)
- 6.2.1 Global Power Module Packaging Production Forecast by Type (2021-2026)
- 6.2.2 Global Power Module Packaging Revenue Forecast by Type (2021-2026)
- 6.2.3 Global Power Module Packaging Price Forecast by Type (2021-2026)
- 6.3 Global Power Module Packaging Market Share by Price Tier (2015-2020): Low-End, Mid-Range and High-End
7 Market Size by Application (2015-2026)
- 7.2.1 Global Power Module Packaging Consumption Historic Breakdown by Application (2015-2020)
- 7.2.2 Global Power Module Packaging Consumption Forecast by Application (2021-2026)
8 Corporate Profiles
- 8.1 Texas Instruments Incorporated
- 8.1.1 Texas Instruments Incorporated Corporation Information
- 8.1.2 Texas Instruments Incorporated Overview
- 8.1.3 Texas Instruments Incorporated Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.1.4 Texas Instruments Incorporated Product Description
- 8.1.5 Texas Instruments Incorporated Related Developments
- 8.2 Star Automations
- 8.2.1 Star Automations Corporation Information
- 8.2.2 Star Automations Overview
- 8.2.3 Star Automations Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.2.4 Star Automations Product Description
- 8.2.5 Star Automations Related Developments
- 8.3 DyDac Controls
- 8.3.1 DyDac Controls Corporation Information
- 8.3.2 DyDac Controls Overview
- 8.3.3 DyDac Controls Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.3.4 DyDac Controls Product Description
- 8.3.5 DyDac Controls Related Developments
- 8.4 SEMIKRON
- 8.4.1 SEMIKRON Corporation Information
- 8.4.2 SEMIKRON Overview
- 8.4.3 SEMIKRON Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.4.4 SEMIKRON Product Description
- 8.4.5 SEMIKRON Related Developments
- 8.5 IXYS Corporation
- 8.5.1 IXYS Corporation Corporation Information
- 8.5.2 IXYS Corporation Overview
- 8.5.3 IXYS Corporation Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.5.4 IXYS Corporation Product Description
- 8.5.5 IXYS Corporation Related Developments
- 8.6 Infineon Technologies AG
- 8.6.1 Infineon Technologies AG Corporation Information
- 8.6.2 Infineon Technologies AG Overview
- 8.6.3 Infineon Technologies AG Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.6.4 Infineon Technologies AG Product Description
- 8.6.5 Infineon Technologies AG Related Developments
- 8.7 Mitsubishi Electric Corporation
- 8.7.1 Mitsubishi Electric Corporation Corporation Information
- 8.7.2 Mitsubishi Electric Corporation Overview
- 8.7.3 Mitsubishi Electric Corporation Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.7.4 Mitsubishi Electric Corporation Product Description
- 8.7.5 Mitsubishi Electric Corporation Related Developments
- 8.8 Fuji Electric Co. Ltd.
- 8.8.1 Fuji Electric Co. Ltd. Corporation Information
- 8.8.2 Fuji Electric Co. Ltd. Overview
- 8.8.3 Fuji Electric Co. Ltd. Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.8.4 Fuji Electric Co. Ltd. Product Description
- 8.8.5 Fuji Electric Co. Ltd. Related Developments
- 8.9 Sanken Electric Co., Ltd.
- 8.9.1 Sanken Electric Co., Ltd. Corporation Information
- 8.9.2 Sanken Electric Co., Ltd. Overview
- 8.9.3 Sanken Electric Co., Ltd. Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.9.4 Sanken Electric Co., Ltd. Product Description
- 8.9.5 Sanken Electric Co., Ltd. Related Developments
- 8.10 SanRex Corporation
- 8.10.1 SanRex Corporation Corporation Information
- 8.10.2 SanRex Corporation Overview
- 8.10.3 SanRex Corporation Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.10.4 SanRex Corporation Product Description
- 8.10.5 SanRex Corporation Related Developments
- 8.11 ON Semiconductor
- 8.11.1 ON Semiconductor Corporation Information
- 8.11.2 ON Semiconductor Overview
- 8.11.3 ON Semiconductor Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.11.4 ON Semiconductor Product Description
- 8.11.5 ON Semiconductor Related Developments
- 8.12 STMicroelectronics
- 8.12.1 STMicroelectronics Corporation Information
- 8.12.2 STMicroelectronics Overview
- 8.12.3 STMicroelectronics Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.12.4 STMicroelectronics Product Description
- 8.12.5 STMicroelectronics Related Developments
- 8.13 Hitachi Power Semiconductor Device
- 8.13.1 Hitachi Power Semiconductor Device Corporation Information
- 8.13.2 Hitachi Power Semiconductor Device Overview
- 8.13.3 Hitachi Power Semiconductor Device Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.13.4 Hitachi Power Semiconductor Device Product Description
- 8.13.5 Hitachi Power Semiconductor Device Related Developments
- 8.14 ROHM
- 8.14.1 ROHM Corporation Information
- 8.14.2 ROHM Overview
- 8.14.3 ROHM Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.14.4 ROHM Product Description
- 8.14.5 ROHM Related Developments
- 8.15 Danfoss
- 8.15.1 Danfoss Corporation Information
- 8.15.2 Danfoss Overview
- 8.15.3 Danfoss Production Capacity and Supply, Price, Revenue and Gross Margin (2015-2020)
- 8.15.4 Danfoss Product Description
- 8.15.5 Danfoss Related Developments
9 Power Module Packaging Production Forecast by Regions
- 9.1 Global Top Power Module Packaging Regions Forecast by Revenue (2021-2026)
- 9.2 Global Top Power Module Packaging Regions Forecast by Production (2021-2026)
- 9.3 Key Power Module Packaging Production Regions Forecast
- 9.3.1 North America
- 9.3.2 Europe
- 9.3.3 China
- 9.3.4 Japan
- 9.3.5 South Korea
10 Power Module Packaging Consumption Forecast by Region
- 10.1 Global Power Module Packaging Consumption Forecast by Region (2021-2026)
- 10.2 North America Power Module Packaging Consumption Forecast by Region (2021-2026)
- 10.3 Europe Power Module Packaging Consumption Forecast by Region (2021-2026)
- 10.4 Asia Pacific Power Module Packaging Consumption Forecast by Region (2021-2026)
- 10.5 Latin America Power Module Packaging Consumption Forecast by Region (2021-2026)
- 10.6 Middle East and Africa Power Module Packaging Consumption Forecast by Region (2021-2026)
11 Value Chain and Sales Channels Analysis
- 11.1 Value Chain Analysis
- 11.2 Sales Channels Analysis
- 11.2.1 Power Module Packaging Sales Channels
- 11.2.2 Power Module Packaging Distributors
- 11.3 Power Module Packaging Customers
12 Market Opportunities & Challenges, Risks and Influences Factors Analysis
- 12.1 Power Module Packaging Industry
- 12.2 Market Trends
- 12.3 Market Opportunities and Drivers
- 12.4 Market Challenges
- 12.5 Power Module Packaging Market Risks/Restraints
- 12.6 Porter's Five Forces Analysis
13 Key Finding in The Global Power Module Packaging Study
14 Appendix
- 14.1 Research Methodology
- 14.1.1 Methodology/Research Approach
- 14.1.2 Data Source
- 14.2 Author Details
Summary:
Get latest Market Research Reports on Power Module Packaging. Industry analysis & Market Report on Power Module Packaging is a syndicated market report, published as Global Power Module Packaging Market Insights and Forecast to 2026. It is complete Research Study and Industry Analysis of Power Module Packaging market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.
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