According to our (Global Info Research) latest study, the global Photoresist for Packaging market size was valued at US$ 157 million in 2024 and is forecast to a readjusted size of USD 225 million by 2031 with a CAGR of 5.4% during review period.
According to the World Semiconductor Trade Statistics (WSTS), the industry experienced major ups and downs in 2022. While chip sales reached their highest annual total ever in 2022, a slowdown in the second half of the year significantly limited growth. In 2022, global semiconductor sales will reach US$574 billion, of which US semiconductor companies" sales total US$275 billion, accounting for 48% of the global market. Photoresist for packaging is a subdivision of the semiconductor field. Global photoresist companies for packaging mainly include JSR, TOK, Merck KGaA (AZ), DuPont, Shin-Etsu, Allresist and Futurrex, etc., mainly distributed in Japan, the United States and China (Including Taiwan), the market is highly concentrated, with CR5 approaching 80%.
This report is a detailed and comprehensive analysis for global Photoresist for Packaging market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Photoresist for Packaging market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global Photoresist for Packaging market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global Photoresist for Packaging market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2020-2031
Global Photoresist for Packaging market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/Ton), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Photoresist for Packaging
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Photoresist for Packaging market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include JSR, TOKYO OHKA KOGYO (TOK), Merck KGaA (AZ), DuPont, Shin-Etsu, Allresist, Futurrex, KemLab™ Inc, Youngchang Chemical, Everlight Chemical, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Photoresist for Packaging market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Positive Photoresist
Negative Photoresist
Market segment by Application
WLP
FC
2.5D/3D Package
Major players covered
JSR
TOKYO OHKA KOGYO (TOK)
Merck KGaA (AZ)
DuPont
Shin-Etsu
Allresist
Futurrex
KemLab™ Inc
Youngchang Chemical
Everlight Chemical
Crystal Clear Electronic Material
Kempur Microelectronics Inc
Xuzhou B & C Chemical
Jiangsu Aisen Semiconductor Material
AEMC
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Photoresist for Packaging product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Photoresist for Packaging, with price, sales quantity, revenue, and global market share of Photoresist for Packaging from 2020 to 2025.
Chapter 3, the Photoresist for Packaging competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Photoresist for Packaging breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Photoresist for Packaging market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Photoresist for Packaging.
Chapter 14 and 15, to describe Photoresist for Packaging sales channel, distributors, customers, research findings and conclusion.
Summary:
Get latest Market Research Reports on Photoresist for Packaging. Industry analysis & Market Report on Photoresist for Packaging is a syndicated market report, published as Global Photoresist for Packaging Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031. It is complete Research Study and Industry Analysis of Photoresist for Packaging market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.