According to our (Global Info Research) latest study, the global PCB for Data Center market size was valued at US$ 18624 million in 2025 and is forecast to a readjusted size of US$ 36022 million by 2032 with a CAGR of 6.3% during review period.
In 2025, the grobal PCB for data center pricing is roughly 620 usd/sqm. PCB for Data Center refers to high-performance printed circuit boards specifically designed for servers, AI computing systems, network switches, storage equipment, power systems, optical interconnect equipment, and other data center infrastructure. The research scope primarily covers server motherboards, CPU/GPU and accelerator boards, OAM/UBB boards, switch and network boards, backplanes, storage and SSD boards, power PCBs, and related high-speed interconnect boards. Typical products are rigid multilayer structures manufactured from copper foil, high-speed low-loss or ultra-low-loss laminates, prepregs, plated through-holes, blind/buried vias, solder mask, and surface finishes, with advanced products incorporating high-layer-count structures, HDI, POFV, sequential lamination, precision backdrilling, high-aspect-ratio plating, and heavy-copper designs. Key technical parameters include layer count, board thickness, Dk/Df, impedance tolerance, insertion loss, via aspect ratio, backdrill stub length, registration accuracy, CAF resistance, warpage, thermal reliability, and signal/power integrity. PCB for Data Center functions as the primary electrical and mechanical interconnection platform connecting processors, accelerators, memory, network ASICs, optical modules, storage devices, and power components within modern data center equipment.
Report Scope
This report is a detailed and comprehensive analysis for global PCB for Data Center market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by End Use and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global PCB for Data Center market size and forecasts, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sq m), 2021-2032
Global PCB for Data Center market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sq m), 2021-2032
Global PCB for Data Center market size and forecasts, by End Use and by Application, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sq m), 2021-2032
Global PCB for Data Center market shares of main players, shipments in revenue ($ Million), sales quantity (K Sqm), and ASP (US$/Sq m), 2021-2026
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for PCB for Data Center
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global PCB for Data Center market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include TTM Technologies, Zhen Ding Technology Holding, Unimicron Technology, Compeq Manufacturing, Gold Circuit Electronics(GCE), Dynamic Electronics, Global Brands Manufacture(GBM), Meiko Electronics, AT&S, ISU Petasys, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
PCB for Data Center market is split by End Use and by Application. For the period 2021-2032, the growth among segments provides accurate calculations and forecasts for consumption value by End Use, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market Segmentation
Market segment by End Use
Server Computing PCB
Networking and Switch PCB
Storage PCB
Data Center Power PCB
Others
Market segment by Layer
12 Layers and Below
14–20 Layers
22–30 Layers
32–40 Layers
Above 40 Layers
Market segment by Application
General-Purpose Servers
AI Servers
High Performance Computing Systems
Data Center Ethernet Switches
Others
Major players covered
TTM Technologies
Zhen Ding Technology Holding
Unimicron Technology
Compeq Manufacturing
Gold Circuit Electronics(GCE)
Dynamic Electronics
Global Brands Manufacture(GBM)
Meiko Electronics
AT&S
ISU Petasys
Simmtech
Daeduck Electronics
Korea Circuit
Sanmina
Summit Interconnect
SOMACIS Group
KSG
WUS Printed Circuit (Kunshan) Co., Ltd.
Shennan Circuits Co., Ltd.
Victory Giant Technology (Huizhou) Co., Ltd.
Shengyi Electronics Co., Ltd.
Guangzhou GOLDEMAX Technologies Co., Ltd.
Shenzhen Kinwong Electronic Co., Ltd.
Aoshikang Technology Co., Ltd.
Shenzhen Suntak Circuit Technology Co., Ltd.
Bomin Electronics Co., Ltd.
Founder Technology Group Corp.
Guangdong Ellington Electronics Technology Co., Ltd.
Shenzhen Jove Enterprise Limited
Huizhou China Eagle Electronic Technology Co., Ltd.
Suzhou Dongshan Precision Manufacturing Co., Ltd.
Jiangxi Welgao Electronics Co., Ltd.
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
Chapter Outline
Chapter 1, to describe PCB for Data Center product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of PCB for Data Center, with price, sales quantity, revenue, and global market share of PCB for Data Center from 2021 to 2026.
Chapter 3, the PCB for Data Center competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the PCB for Data Center breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2021 to 2032.
Chapter 5 and 6, to segment the sales by End Use and by Application, with sales market share and growth rate by End Use, by Application, from 2021 to 2032.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2021 to 2026.and PCB for Data Center market forecast, by regions, by End Use, and by Application, with sales and revenue, from 2027 to 2032.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of PCB for Data Center.
Chapter 14 and 15, to describe PCB for Data Center sales channel, distributors, customers, research findings and conclusion.
Summary:
Get latest Market Research Reports on PCB for Data Center. Industry analysis & Market Report on PCB for Data Center is a syndicated market report, published as Global PCB for Data Center Market 2026 by Manufacturers, Regions, Type and Application, Forecast to 2032. It is complete Research Study and Industry Analysis of PCB for Data Center market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.