According to our (Global Info Research) latest study, the global PCB Cooling Buffer market size was valued at US$ 105 million in 2024 and is forecast to a readjusted size of USD 147 million by 2031 with a CAGR of 5.0% during review period.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
The PCB cooling buffer machine is used for SMT or coating production lines and has two main functions. 1. Relieve the production speed issue of front-end and back-end devices. If the front-end devices are too fast or the back-end devices have abnormalities, resulting in product PCBA or PCB accumulation, the temporary storage machine can automatically store the products produced by the front-end devices, balance the speed of the front-end and back-end machines, and play a buffering role in the production speed of the front-end and back-end devices. 2. Temporary storage function: In the dispensing/coating production line, after dispensing or applying glue to PCBA, set the buffer time of the temporary storage machine and implement a first in first out mode for PCBA. The product is naturally dried (cured) through the temporary storage machine
This report is a detailed and comprehensive analysis for global PCB Cooling Buffer market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global PCB Cooling Buffer market size and forecasts, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2020-2031
Global PCB Cooling Buffer market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2020-2031
Global PCB Cooling Buffer market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2020-2031
Global PCB Cooling Buffer market shares of main players, shipments in revenue ($ Million), sales quantity (K Units), and ASP (US$/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for PCB Cooling Buffer
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global PCB Cooling Buffer market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include INTEON Corporation, Famecs, KIHEUNG FA, I.C.T, Vanstron, Shenzhen Yongxinda Technology, Shenzhen WIT Intelligent Manufacturing Equipment, Shenzhen TOPSMT, Hayawin, Shenzhen WHC Electronic Technology, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
PCB Cooling Buffer market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Power: Less Than 2 KW
Power: 2-5 KW
Power: Above 5 KW
Market segment by Application
PCB Board
LED Light Bar
Other
Major players covered
INTEON Corporation
Famecs
KIHEUNG FA
I.C.T
Vanstron
Shenzhen Yongxinda Technology
Shenzhen WIT Intelligent Manufacturing Equipment
Shenzhen TOPSMT
Hayawin
Shenzhen WHC Electronic Technology
Shenzhen NLT
Shenzhen QIQI
WEC
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe PCB Cooling Buffer product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of PCB Cooling Buffer, with price, sales quantity, revenue, and global market share of PCB Cooling Buffer from 2020 to 2025.
Chapter 3, the PCB Cooling Buffer competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the PCB Cooling Buffer breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and PCB Cooling Buffer market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of PCB Cooling Buffer.
Chapter 14 and 15, to describe PCB Cooling Buffer sales channel, distributors, customers, research findings and conclusion.
Summary:
Get latest Market Research Reports on PCB Cooling Buffer. Industry analysis & Market Report on PCB Cooling Buffer is a syndicated market report, published as Global PCB Cooling Buffer Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031. It is complete Research Study and Industry Analysis of PCB Cooling Buffer market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.