Report Detail
Global (United States, European Union and China) Package on package (PoP) Market Research Report 2019-2025
- RnM3666114 |
- 13 August, 2019 |
- Global |
- 117 Pages |
- QYResearch |
- Electronics & Semiconductor
Package on package (PoP) is an integrated circuit packaging method to combine vertically discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them. This allows higher component density in devices, such as mobile phones, personal digital assistants (PDA), and digital cameras.
In 2019, the market size of Package on package (PoP) is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Package on package (PoP).
This report studies the global market size of Package on package (PoP), especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
This study presents the Package on package (PoP) production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.
For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.
In global market, the following companies are covered:
Eesemi
Surface Mount Technology Association
PCBCart
Amkor Technology
Micron Technoloty
Semicon
Finetech
Circuitnet
Market Segment by Product Type
PoPb
PoPt
Market Segment by Application
Mobile Phones
Personal Digital Assistants (PDA)
Digital Cameras
Others
Key Regions split in this report: breakdown data for each region.
United States
China
European Union
Rest of World (Japan, Korea, India and Southeast Asia)
The study objectives are:
To analyze and research the Package on package (PoP) status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
To present the key Package on package (PoP) manufacturers, presenting the sales, revenue, market share, and recent development for key players.
To split the breakdown data by regions, type, companies and applications
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market
In this study, the years considered to estimate the market size of Package on package (PoP) are as follows:
History Year: 2014-2018
Base Year: 2018
Estimated Year: 2019
Forecast Year 2019 to 2025
Table of Contents
1 Report Overview
- 1.1 Research Scope
- 1.2 Major Manufacturers Covered in This Report
- 1.3 Market Segment by Type
- 1.3.1 Global Package on package (PoP) Market Size Growth Rate by Type (2019-2025)
- 1.3.2 PoPb
- 1.3.3 PoPt
- 1.4 Market Segment by Application
- 1.4.1 Global Package on package (PoP) Market Share by Application (2019-2025)
- 1.4.2 Mobile Phones
- 1.4.3 Personal Digital Assistants (PDA)
- 1.4.4 Digital Cameras
- 1.4.5 Others
- 1.5 Study Objectives
- 1.6 Years Considered
2 Global Growth Trends
- 2.1 Production and Capacity Analysis
- 2.1.1 Global Package on package (PoP) Production Value 2014-2025
- 2.1.2 Global Package on package (PoP) Production 2014-2025
- 2.1.3 Global Package on package (PoP) Capacity 2014-2025
- 2.1.4 Global Package on package (PoP) Marketing Pricing and Trends
- 2.2 Key Producers Growth Rate (CAGR) 2019-2025
- 2.2.1 Global Package on package (PoP) Market Size CAGR of Key Regions
- 2.2.2 Global Package on package (PoP) Market Share of Key Regions
- 2.3 Industry Trends
- 2.3.1 Market Top Trends
- 2.3.2 Market Drivers
3 Market Share by Manufacturers
- 3.1 Capacity and Production by Manufacturers
- 3.1.1 Global Package on package (PoP) Capacity by Manufacturers
- 3.1.2 Global Package on package (PoP) Production by Manufacturers
- 3.2 Revenue by Manufacturers
- 3.2.1 Package on package (PoP) Revenue by Manufacturers (2014-2019)
- 3.2.2 Package on package (PoP) Revenue Share by Manufacturers (2014-2019)
- 3.2.3 Global Package on package (PoP) Market Concentration Ratio (CR5 and HHI)
- 3.3 Package on package (PoP) Price by Manufacturers
- 3.4 Key Manufacturers Package on package (PoP) Plants/Factories Distribution and Area Served
- 3.5 Date of Key Manufacturers Enter into Package on package (PoP) Market
- 3.6 Key Manufacturers Package on package (PoP) Product Offered
- 3.7 Mergers & Acquisitions, Expansion Plans
4 Market Size by Type
- 4.1 Production and Production Value for Each Type
- 4.1.1 PoPb Production and Production Value (2014-2019)
- 4.1.2 PoPt Production and Production Value (2014-2019)
- 4.2 Global Package on package (PoP) Production Market Share by Type
- 4.3 Global Package on package (PoP) Production Value Market Share by Type
- 4.4 Package on package (PoP) Ex-factory Price by Type
5 Market Size by Application
- 5.1 Overview
- 5.2 Global Package on package (PoP) Consumption by Application
6 Production by Regions
- 6.1 Global Package on package (PoP) Production (History Data) by Regions 2014-2019
- 6.2 Global Package on package (PoP) Production Value (History Data) by Regions
- 6.3 United States
- 6.3.1 United States Package on package (PoP) Production Growth Rate 2014-2019
- 6.3.2 United States Package on package (PoP) Production Value Growth Rate 2014-2019
- 6.3.3 Key Players in United States
- 6.3.4 United States Package on package (PoP) Import & Export
- 6.4 European Union
- 6.4.1 European Union Package on package (PoP) Production Growth Rate 2014-2019
- 6.4.2 European Union Package on package (PoP) Production Value Growth Rate 2014-2019
- 6.4.3 Key Players in European Union
- 6.4.4 European Union Package on package (PoP) Import & Export
- 6.5 China
- 6.5.1 China Package on package (PoP) Production Growth Rate 2014-2019
- 6.5.2 China Package on package (PoP) Production Value Growth Rate 2014-2019
- 6.5.3 Key Players in China
- 6.5.4 China Package on package (PoP) Import & Export
- 6.6 Rest of World
- 6.6.1 Japan
- 6.6.2 Korea
- 6.6.3 India
- 6.6.4 Southeast Asia
7 Package on package (PoP) Consumption by Regions
- 7.1 Global Package on package (PoP) Consumption (History Data) by Regions
- 7.2 United States
- 7.2.1 United States Package on package (PoP) Consumption by Type
- 7.2.2 United States Package on package (PoP) Consumption by Application
- 7.3 European Union
- 7.3.1 European Union Package on package (PoP) Consumption by Type
- 7.3.2 European Union Package on package (PoP) Consumption by Application
- 7.4 China
- 7.4.1 China Package on package (PoP) Consumption by Type
- 7.4.2 China Package on package (PoP) Consumption by Application
- 7.5 Rest of World
- 7.5.1 Rest of World Package on package (PoP) Consumption by Type
- 7.5.2 Rest of World Package on package (PoP) Consumption by Application
- 7.5.1 Japan
- 7.5.2 Korea
- 7.5.3 India
- 7.5.4 Southeast Asia
8 Company Profiles
- 8.1 Eesemi
- 8.1.1 Eesemi Company Details
- 8.1.2 Company Description and Business Overview
- 8.1.3 Production and Revenue of Package on package (PoP)
- 8.1.4 Package on package (PoP) Product Introduction
- 8.1.5 Eesemi Recent Development
- 8.2 Surface Mount Technology Association
- 8.2.1 Surface Mount Technology Association Company Details
- 8.2.2 Company Description and Business Overview
- 8.2.3 Production and Revenue of Package on package (PoP)
- 8.2.4 Package on package (PoP) Product Introduction
- 8.2.5 Surface Mount Technology Association Recent Development
- 8.3 PCBCart
- 8.3.1 PCBCart Company Details
- 8.3.2 Company Description and Business Overview
- 8.3.3 Production and Revenue of Package on package (PoP)
- 8.3.4 Package on package (PoP) Product Introduction
- 8.3.5 PCBCart Recent Development
- 8.4 Amkor Technology
- 8.4.1 Amkor Technology Company Details
- 8.4.2 Company Description and Business Overview
- 8.4.3 Production and Revenue of Package on package (PoP)
- 8.4.4 Package on package (PoP) Product Introduction
- 8.4.5 Amkor Technology Recent Development
- 8.5 Micron Technoloty
- 8.5.1 Micron Technoloty Company Details
- 8.5.2 Company Description and Business Overview
- 8.5.3 Production and Revenue of Package on package (PoP)
- 8.5.4 Package on package (PoP) Product Introduction
- 8.5.5 Micron Technoloty Recent Development
- 8.6 Semicon
- 8.6.1 Semicon Company Details
- 8.6.2 Company Description and Business Overview
- 8.6.3 Production and Revenue of Package on package (PoP)
- 8.6.4 Package on package (PoP) Product Introduction
- 8.6.5 Semicon Recent Development
- 8.7 Finetech
- 8.7.1 Finetech Company Details
- 8.7.2 Company Description and Business Overview
- 8.7.3 Production and Revenue of Package on package (PoP)
- 8.7.4 Package on package (PoP) Product Introduction
- 8.7.5 Finetech Recent Development
- 8.8 Circuitnet
- 8.8.1 Circuitnet Company Details
- 8.8.2 Company Description and Business Overview
- 8.8.3 Production and Revenue of Package on package (PoP)
- 8.8.4 Package on package (PoP) Product Introduction
- 8.8.5 Circuitnet Recent Development
9 Market Forecast
- 9.1 Global Market Size Forecast
- 9.1.1 Global Package on package (PoP) Capacity, Production Forecast 2019-2025
- 9.1.2 Global Package on package (PoP) Production Value Forecast 2019-2025
- 9.2 Market Forecast by Regions
- 9.2.1 Global Package on package (PoP) Production and Value Forecast by Regions 2019-2025
- 9.2.2 Global Package on package (PoP) Consumption Forecast by Regions 2019-2025
- 9.3 United States
- 9.3.1 Production and Value Forecast in United States
- 9.3.2 Consumption Forecast in United States
- 9.4 European Union
- 9.4.1 Production and Value Forecast in European Union
- 9.4.2 Consumption Forecast in European Union
- 9.5 China
- 9.5.1 Production and Value Forecast in China
- 9.5.2 Consumption Forecast in China
- 9.6 Rest of World
- 9.6.1 Japan
- 9.6.2 Korea
- 9.6.3 India
- 9.6.4 Southeast Asia
- 9.7 Forecast by Type
- 9.7.1 Global Package on package (PoP) Production Forecast by Type
- 9.7.2 Global Package on package (PoP) Production Value Forecast by Type
- 9.8 Consumption Forecast by Application
10 Value Chain and Sales Channels Analysis
- 10.1 Value Chain Analysis
- 10.2 Sales Channels Analysis
- 10.2.1 Package on package (PoP) Sales Channels
- 10.2.2 Package on package (PoP) Distributors
- 10.3 Package on package (PoP) Customers
11 Opportunities & Challenges, Threat and Affecting Factors
- 11.1 Market Opportunities
- 11.2 Market Challenges
- 11.3 Porter's Five Forces Analysis
12 Key Findings
13 Appendix
- 13.1 Research Methodology
- 13.1.1 Methodology/Research Approach
- 13.1.1.1 Research Programs/Design
- 13.1.1.2 Market Size Estimation
- 13.1.1.3 Market Breakdown and Data Triangulation
- 13.1.2 Data Source
- 13.1.2.1 Secondary Sources
- 13.1.2.2 Primary Sources
- 13.1.1 Methodology/Research Approach
- 13.2 Author Details
Summary:
Get latest Market Research Reports on Packageonpackage(PoP). Industry analysis & Market Report on Packageonpackage(PoP) is a syndicated market report, published as Global (United States, European Union and China) Package on package (PoP) Market Research Report 2019-2025. It is complete Research Study and Industry Analysis of Packageonpackage(PoP) market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.
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