Report Detail
Global Package Substrates in Mobile Devices Market Growth 2019-2024
- RnM3197549 |
- 27 March, 2019 |
- Global |
- 165 Pages |
- LPI(LP Information) |
- Electronics & Semiconductor
Package substrate transmits electric signals between semiconductors and the main board, and it is mainly used for the core semiconductors of mobile devices and PCs.
According to this study, over the next five years the Package Substrates in Mobile Devices market will register a xx% CAGR in terms of revenue, the global market size will reach US$ xx million by 2024, from US$ xx million in 2019. In particular, this report presents the global market share (sales and revenue) of key companies in Package Substrates in Mobile Devices business, shared in Chapter 3.
This report presents a comprehensive overview, market shares, and growth opportunities of Package Substrates in Mobile Devices market by product type, application, key manufacturers and key regions and countries.
This study considers the Package Substrates in Mobile Devices value and volume generated from the sales of the following segments:
Segmentation by product type: breakdown data from 2014 to 2019, in Section 2.3; and forecast to 2024 in section 11.7.
FCCSP
WBCSP
SiP
BOC
FCBGA
Segmentation by application: breakdown data from 2014 to 2019, in Section 2.4; and forecast to 2024 in section 11.8.
Smartphones
Tablets
Notebook PCs
Others
This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Spain
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report: Breakdown data in in Chapter 3.
Ibiden
Shinko Electric Industries
Kyocera
Samsung Electro-Mechanics
Fujitsu
Hitachi
Eastern
LG Innotek
Simmtech
Daeduck
AT&S
Unimicron
Kinsus
Nan Ya PCB
ASE Group
TTM Technologies
Zhen Ding Technology
Shenzhen Fastprint Circuit Tech
In addition, this report discusses the key drivers influencing market growth, opportunities, the challenges and the risks faced by key manufacturers and the market as a whole. It also analyzes key emerging trends and their impact on present and future development.
Research objectives
To study and analyze the global Package Substrates in Mobile Devices consumption (value & volume) by key regions/countries, product type and application, history data from 2014 to 2018, and forecast to 2024.
To understand the structure of Package Substrates in Mobile Devices market by identifying its various subsegments.
Focuses on the key global Package Substrates in Mobile Devices manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.
To analyze the Package Substrates in Mobile Devices with respect to individual growth trends, future prospects, and their contribution to the total market.
To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
To project the consumption of Package Substrates in Mobile Devices submarkets, with respect to key regions (along with their respective key countries).
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.
Table of Contents
2019-2024 Global Package Substrates in Mobile Devices Consumption Market Report
1 Scope of the Report
- 1.1 Market Introduction
- 1.2 Research Objectives
- 1.3 Years Considered
- 1.4 Market Research Methodology
- 1.5 Economic Indicators
- 1.6 Currency Considered
2 Executive Summary
- 2.1 World Market Overview
- 2.1.1 Global Package Substrates in Mobile Devices Consumption 2014-2024
- 2.1.2 Package Substrates in Mobile Devices Consumption CAGR by Region
- 2.2 Package Substrates in Mobile Devices Segment by Type
- 2.2.1 FCCSP
- 2.2.2 WBCSP
- 2.2.3 SiP
- 2.2.4 BOC
- 2.2.5 FCBGA
- 2.3 Package Substrates in Mobile Devices Consumption by Type
- 2.3.1 Global Package Substrates in Mobile Devices Consumption Market Share by Type (2014-2019)
- 2.3.2 Global Package Substrates in Mobile Devices Revenue and Market Share by Type (2014-2019)
- 2.3.3 Global Package Substrates in Mobile Devices Sale Price by Type (2014-2019)
- 2.4 Package Substrates in Mobile Devices Segment by Application
- 2.4.1 Smartphones
- 2.4.2 Tablets
- 2.4.3 Notebook PCs
- 2.4.4 Others
- 2.5 Package Substrates in Mobile Devices Consumption by Application
- 2.5.1 Global Package Substrates in Mobile Devices Consumption Market Share by Application (2014-2019)
- 2.5.2 Global Package Substrates in Mobile Devices Value and Market Share by Application (2014-2019)
- 2.5.3 Global Package Substrates in Mobile Devices Sale Price by Application (2014-2019)
3 Global Package Substrates in Mobile Devices by Players
- 3.1 Global Package Substrates in Mobile Devices Sales Market Share by Players
- 3.1.1 Global Package Substrates in Mobile Devices Sales by Players (2017-2019)
- 3.1.2 Global Package Substrates in Mobile Devices Sales Market Share by Players (2017-2019)
- 3.2 Global Package Substrates in Mobile Devices Revenue Market Share by Players
- 3.2.1 Global Package Substrates in Mobile Devices Revenue by Players (2017-2019)
- 3.2.2 Global Package Substrates in Mobile Devices Revenue Market Share by Players (2017-2019)
- 3.3 Global Package Substrates in Mobile Devices Sale Price by Players
- 3.4 Global Package Substrates in Mobile Devices Manufacturing Base Distribution, Sales Area, Product Types by Players
- 3.4.1 Global Package Substrates in Mobile Devices Manufacturing Base Distribution and Sales Area by Players
- 3.4.2 Players Package Substrates in Mobile Devices Products Offered
- 3.5 Market Concentration Rate Analysis
- 3.5.1 Competition Landscape Analysis
- 3.5.2 Concentration Ratio (CR3, CR5 and CR10) (2017-2019)
- 3.6 New Products and Potential Entrants
- 3.7 Mergers & Acquisitions, Expansion
4 Package Substrates in Mobile Devices by Regions
- 4.1 Package Substrates in Mobile Devices by Regions
- 4.1.1 Global Package Substrates in Mobile Devices Consumption by Regions
- 4.1.2 Global Package Substrates in Mobile Devices Value by Regions
- 4.2 Americas Package Substrates in Mobile Devices Consumption Growth
- 4.3 APAC Package Substrates in Mobile Devices Consumption Growth
- 4.4 Europe Package Substrates in Mobile Devices Consumption Growth
- 4.5 Middle East & Africa Package Substrates in Mobile Devices Consumption Growth
5 Americas
- 5.1 Americas Package Substrates in Mobile Devices Consumption by Countries
- 5.1.1 Americas Package Substrates in Mobile Devices Consumption by Countries (2014-2019)
- 5.1.2 Americas Package Substrates in Mobile Devices Value by Countries (2014-2019)
- 5.2 Americas Package Substrates in Mobile Devices Consumption by Type
- 5.3 Americas Package Substrates in Mobile Devices Consumption by Application
- 5.4 United States
- 5.5 Canada
- 5.6 Mexico
- 5.7 Key Economic Indicators of Few Americas Countries
6 APAC
- 6.1 APAC Package Substrates in Mobile Devices Consumption by Countries
- 6.1.1 APAC Package Substrates in Mobile Devices Consumption by Countries (2014-2019)
- 6.1.2 APAC Package Substrates in Mobile Devices Value by Countries (2014-2019)
- 6.2 APAC Package Substrates in Mobile Devices Consumption by Type
- 6.3 APAC Package Substrates in Mobile Devices Consumption by Application
- 6.4 China
- 6.5 Japan
- 6.6 Korea
- 6.7 Southeast Asia
- 6.8 India
- 6.9 Australia
- 6.10 Key Economic Indicators of Few APAC Countries
7 Europe
- 7.1 Europe Package Substrates in Mobile Devices by Countries
- 7.1.1 Europe Package Substrates in Mobile Devices Consumption by Countries (2014-2019)
- 7.1.2 Europe Package Substrates in Mobile Devices Value by Countries (2014-2019)
- 7.2 Europe Package Substrates in Mobile Devices Consumption by Type
- 7.3 Europe Package Substrates in Mobile Devices Consumption by Application
- 7.4 Germany
- 7.5 France
- 7.6 UK
- 7.7 Italy
- 7.8 Russia
- 7.9 Spain
- 7.10 Key Economic Indicators of Few Europe Countries
8 Middle East & Africa
- 8.1 Middle East & Africa Package Substrates in Mobile Devices by Countries
- 8.1.1 Middle East & Africa Package Substrates in Mobile Devices Consumption by Countries (2014-2019)
- 8.1.2 Middle East & Africa Package Substrates in Mobile Devices Value by Countries (2014-2019)
- 8.2 Middle East & Africa Package Substrates in Mobile Devices Consumption by Type
- 8.3 Middle East & Africa Package Substrates in Mobile Devices Consumption by Application
- 8.4 Egypt
- 8.5 South Africa
- 8.6 Israel
- 8.7 Turkey
- 8.8 GCC Countries
9 Market Drivers, Challenges and Trends
- 9.1 Market Drivers and Impact
- 9.1.1 Growing Demand from Key Regions
- 9.1.2 Growing Demand from Key Applications and Potential Industries
- 9.2 Market Challenges and Impact
- 9.3 Market Trends
10 Marketing, Distributors and Customer
- 10.1 Sales Channel
- 10.1.1 Direct Channels
- 10.1.2 Indirect Channels
- 10.2 Package Substrates in Mobile Devices Distributors
- 10.3 Package Substrates in Mobile Devices Customer
11 Global Package Substrates in Mobile Devices Market Forecast
- 11.1 Global Package Substrates in Mobile Devices Consumption Forecast (2019-2024)
- 11.2 Global Package Substrates in Mobile Devices Forecast by Regions
- 11.2.1 Global Package Substrates in Mobile Devices Forecast by Regions (2019-2024)
- 11.2.2 Global Package Substrates in Mobile Devices Value Forecast by Regions (2019-2024)
- 11.2.3 Americas Consumption Forecast
- 11.2.4 APAC Consumption Forecast
- 11.2.5 Europe Consumption Forecast
- 11.2.6 Middle East & Africa Consumption Forecast
- 11.3 Americas Forecast by Countries
- 11.3.1 United States Market Forecast
- 11.3.2 Canada Market Forecast
- 11.3.3 Mexico Market Forecast
- 11.3.4 Brazil Market Forecast
- 11.4 APAC Forecast by Countries
- 11.4.1 China Market Forecast
- 11.4.2 Japan Market Forecast
- 11.4.3 Korea Market Forecast
- 11.4.4 Southeast Asia Market Forecast
- 11.4.5 India Market Forecast
- 11.4.6 Australia Market Forecast
- 11.5 Europe Forecast by Countries
- 11.5.1 Germany Market Forecast
- 11.5.2 France Market Forecast
- 11.5.3 UK Market Forecast
- 11.5.4 Italy Market Forecast
- 11.5.5 Russia Market Forecast
- 11.5.6 Spain Market Forecast
- 11.6 Middle East & Africa Forecast by Countries
- 11.6.1 Egypt Market Forecast
- 11.6.2 South Africa Market Forecast
- 11.6.3 Israel Market Forecast
- 11.6.4 Turkey Market Forecast
- 11.6.5 GCC Countries Market Forecast
- 11.7 Global Package Substrates in Mobile Devices Forecast by Type
- 11.8 Global Package Substrates in Mobile Devices Forecast by Application
12 Key Players Analysis
- 12.1 Ibiden
- 12.1.1 Company Details
- 12.1.2 Package Substrates in Mobile Devices Product Offered
- 12.1.3 Ibiden Package Substrates in Mobile Devices Sales, Revenue, Price and Gross Margin (2017-2019)
- 12.1.4 Main Business Overview
- 12.1.5 Ibiden News
- 12.2 Shinko Electric Industries
- 12.2.1 Company Details
- 12.2.2 Package Substrates in Mobile Devices Product Offered
- 12.2.3 Shinko Electric Industries Package Substrates in Mobile Devices Sales, Revenue, Price and Gross Margin (2017-2019)
- 12.2.4 Main Business Overview
- 12.2.5 Shinko Electric Industries News
- 12.3 Kyocera
- 12.3.1 Company Details
- 12.3.2 Package Substrates in Mobile Devices Product Offered
- 12.3.3 Kyocera Package Substrates in Mobile Devices Sales, Revenue, Price and Gross Margin (2017-2019)
- 12.3.4 Main Business Overview
- 12.3.5 Kyocera News
- 12.4 Samsung Electro-Mechanics
- 12.4.1 Company Details
- 12.4.2 Package Substrates in Mobile Devices Product Offered
- 12.4.3 Samsung Electro-Mechanics Package Substrates in Mobile Devices Sales, Revenue, Price and Gross Margin (2017-2019)
- 12.4.4 Main Business Overview
- 12.4.5 Samsung Electro-Mechanics News
- 12.5 Fujitsu
- 12.5.1 Company Details
- 12.5.2 Package Substrates in Mobile Devices Product Offered
- 12.5.3 Fujitsu Package Substrates in Mobile Devices Sales, Revenue, Price and Gross Margin (2017-2019)
- 12.5.4 Main Business Overview
- 12.5.5 Fujitsu News
- 12.6 Hitachi
- 12.6.1 Company Details
- 12.6.2 Package Substrates in Mobile Devices Product Offered
- 12.6.3 Hitachi Package Substrates in Mobile Devices Sales, Revenue, Price and Gross Margin (2017-2019)
- 12.6.4 Main Business Overview
- 12.6.5 Hitachi News
- 12.7 Eastern
- 12.7.1 Company Details
- 12.7.2 Package Substrates in Mobile Devices Product Offered
- 12.7.3 Eastern Package Substrates in Mobile Devices Sales, Revenue, Price and Gross Margin (2017-2019)
- 12.7.4 Main Business Overview
- 12.7.5 Eastern News
- 12.8 LG Innotek
- 12.8.1 Company Details
- 12.8.2 Package Substrates in Mobile Devices Product Offered
- 12.8.3 LG Innotek Package Substrates in Mobile Devices Sales, Revenue, Price and Gross Margin (2017-2019)
- 12.8.4 Main Business Overview
- 12.8.5 LG Innotek News
- 12.9 Simmtech
- 12.9.1 Company Details
- 12.9.2 Package Substrates in Mobile Devices Product Offered
- 12.9.3 Simmtech Package Substrates in Mobile Devices Sales, Revenue, Price and Gross Margin (2017-2019)
- 12.9.4 Main Business Overview
- 12.9.5 Simmtech News
- 12.10 Daeduck
- 12.10.1 Company Details
- 12.10.2 Package Substrates in Mobile Devices Product Offered
- 12.10.3 Daeduck Package Substrates in Mobile Devices Sales, Revenue, Price and Gross Margin (2017-2019)
- 12.10.4 Main Business Overview
- 12.10.5 Daeduck News
- 12.11 AT&S
- 12.12 Unimicron
- 12.13 Kinsus
- 12.14 Nan Ya PCB
- 12.15 ASE Group
- 12.16 TTM Technologies
- 12.17 Zhen Ding Technology
- 12.18 Shenzhen Fastprint Circuit Tech
13 Research Findings and Conclusion
Summary:
Get latest Market Research Reports on Package Substrates in Mobile Devices . Industry analysis & Market Report on Package Substrates in Mobile Devices is a syndicated market report, published as Global Package Substrates in Mobile Devices Market Growth 2019-2024. It is complete Research Study and Industry Analysis of Package Substrates in Mobile Devices market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.
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