Global Multilayer Printed Circuit Board Market Research Report 2012-2024

Table of Contents

1 Market Overview

• 1.1 Objectives of Research
  • 1.1.1 Definition
  • 1.1.2 Specifications
• 1.2 Market Segment
  • 1.2.1 by Type
    • 1.2.1.1 Layer 4-6
    • 1.2.1.2 Layer 8-10
    • 1.2.1.3 Layer 10+
  • 1.2.2 by Application
    • 1.2.2.1 Smart Packaging
    • 1.2.2.2 Smart Cards
    • 1.2.2.3 Consumer Electronics
    • 1.2.2.4 Medical Devices
    • 1.2.2.5 Wearable Devices
    • 1.2.2.6 Entertainment
    • 1.2.2.7 Wireless Communication
    • 1.2.2.8 Others
  • 1.2.3 by Regions

2 Industry Chain

• 2.1 Industry Chain Structure
• 2.2 Upstream
• 2.3 Market
  • 2.3.1 SWOT
  • 2.3.2 Dynamics

3 Environmental Analysis

• 3.1 Policy
• 3.2 Economic
• 3.3 Technology
• 3.4 Market Entry

4 Market Segmentation by Type

• 4.1 Market Size
  • 4.1.1 Layer 4-6 Market, 2013-2018
  • 4.1.2 Layer 8-10 Market, 2013-2018
  • 4.1.3 Layer 10+ Market, 2013-2018
• 4.2 Market Forecast
  • 4.2.1 Layer 4-6 Market Forecast, 2019-2024
  • 4.2.2 Layer 8-10 Market Forecast, 2019-2024
  • 4.2.3 Layer 10+ Market Forecast, 2019-2024

5 Market Segmentation by Application

• 5.1 Market Size
  • 5.1.1 Smart Packaging Market, 2013-2018
  • 5.1.2 Smart Cards Market, 2013-2018
  • 5.1.3 Consumer Electronics Market, 2013-2018
  • 5.1.4 Medical Devices Market, 2013-2018
  • 5.1.5 Wearable Devices Market, 2013-2018
  • 5.1.6 Entertainment Market, 2013-2018
  • 5.1.7 Wireless Communication Market, 2013-2018
  • 5.1.8 Others Market, 2013-2018
• 5.2 Market Forecast
  • 5.2.1 Smart Packaging Market Forecast, 2019-2024
  • 5.2.2 Smart Cards Market Forecast, 2019-2024
  • 5.2.3 Consumer Electronics Market Forecast, 2019-2024
  • 5.2.4 Medical Devices Market Forecast, 2019-2024
  • 5.2.5 Wearable Devices Market Forecast, 2019-2024
  • 5.2.6 Entertainment Market Forecast, 2019-2024
  • 5.2.7 Wireless Communication Market Forecast, 2019-2024
  • 5.2.8 Others Market Forecast, 2019-2024

6 Market Segmentation by Region

• 6.1 Market Size
  • 6.1.1 Asia-Pacific
    • 6.1.1.1 Asia-Pacific Market, 2012-2018
    • 6.1.1.2 Asia-Pacific Market by Type
    • 6.1.1.3 Asia-Pacific Market by Application
  • 6.1.2 North America
    • 6.1.2.1 North America Market, 2012-2018
    • 6.1.2.2 North America Market by Type
    • 6.1.2.3 North America Market by Application
  • 6.1.3 Europe
    • 6.1.3.1 Europe Market, 2012-2018
    • 6.1.3.2 Europe Market by Type
    • 6.1.3.3 Europe Market by Application
  • 6.1.4 South America
    • 6.1.4.1 South America Market, 2012-2018
    • 6.1.4.2 South America Market by Type
    • 6.1.4.3 South America Market by Application
  • 6.1.5 Middle East & Africa
    • 6.1.5.1 Middle East & Africa Market, 2012-2018
    • 6.1.5.2 Middle East & Africa Market by Type
    • 6.1.5.3 Middle East & Africa Market by Application
• 6.2 Market Forecast
  • 6.2.1 Asia-Pacific Market Forecast, 2019-2024
  • 6.2.2 North America Market Forecast, 2019-2024
  • 6.2.3 Europe Market Forecast, 2019-2024
  • 6.2.4 South America Market Forecast, 2019-2024
  • 6.2.5 Middle East & Africa Market Forecast, 2019-2024

7 Market Competitive

• 7.1 Global Market by Vendors
• 7.2 Market Concentration
• 7.3 Price & Factors
• 7.4 Marketing Channel

8 Major Vendors

• 8.1 Nippon Mektron
• 8.2 ZD Tech
• 8.3 TTM Technologies
• 8.4 Unimicron
• 8.5 Sumitomo Denko
• 8.6 Compeq
• 8.7 Tripod
• 8.8 Samsung E-M
• 8.9 Young Poong Group
• 8.10 HannStar
• 8.11 Ibiden
• 8.12 Nanya PCB
• 8.13 KBC PCB Group
• 8.14 Daeduck Group
• 8.15 AT&S
• 8.16 Fujikura
• 8.17 Meiko
• 8.18 Multek
• 8.19 Kinsus
• 8.20 Chin Poon
• 8.21 T.P.T.
• 8.22 Shinko Denski
• 8.23 Wus Group
• 8.24 Simmtech
• 8.25 Mflex
• 8.26 LG Innotek
• 8.27 Gold Circuit
• 8.28 Shennan Circuit
• 8.29 Kinwong
• 8.30 Founder Tech

9 Conclusion