According to our (Global Info Research) latest study, the global Multilayer HDI PCBs market size was valued at US$ 9574 million in 2024 and is forecast to a readjusted size of USD 13540 million by 2031 with a CAGR of 5.2% during review period.
Printed circuit boards (PCBs), also known as electronic circuit boards, are essential components found in various electronic devices that support our daily lives. The role of a printed circuit board is to serve as a foundation for mounting components and to establish electrical connections between them, allowing the transmission of electrical signals.
To draw an analogy, a printed circuit board functions as the skeletal and nervous system of the human body, playing a crucial role as the core device in electrical products.
Printed circuit boards play a vital role in various applications, bridging our lives and shaping the future.
This report studies the Multilayer HDI PCBs, include HDI PCB (1+N+1), HDI PCB (2+N+2), HDI PCB (3+N+3) and Anylayer HDI.
High-Density Interconnect (HDI) PCBs are advanced printed circuit boards characterized by high wiring density per unit area, achieved through the use of microvias, blind and buried vias, and build-up laminations. This design enables more compact and efficient electronic devices.
The global PCB market was valued at US$ 78.9billion in 2024 and is anticipated to reach US$ 101.6 billion by 2031, witnessing a CAGR of 4.86% during the forecast period 2025-2031. Asia-Pacific dominates the market, accounting for over 85% of global PCB production, led by China Mainland, China Taiwan, and South Korea.
The major global manufacturers of PCB include Unimicron, DSBJ (Dongshan Precision), Zhen Ding Technology, Kinwong, Shennan Circuit, Tripod Technology, Suntak Technology, Shenzhen Fastprint Circuit Tech, and Gul Technologies Group, etc. In 2024, the world's top 20 manufacturers accounted for approximately 54.12 % of the revenue.
This report is a detailed and comprehensive analysis for global Multilayer HDI PCBs market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Multilayer HDI PCBs market size and forecasts, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sq m), 2020-2031
Global Multilayer HDI PCBs market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sq m), 2020-2031
Global Multilayer HDI PCBs market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sq m), 2020-2031
Global Multilayer HDI PCBs market shares of main players, shipments in revenue ($ Million), sales quantity (K Sqm), and ASP (US$/Sq m), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Multilayer HDI PCBs
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Multilayer HDI PCBs market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Zhen Ding Technology, Kinwong, Shennan Circuit, Suntak Technology, Shenzhen Fastprint Circuit Tech, Gul Technologies Group, Compeq Manufacturing, TTM Technologies, Inc, Ibiden, HannStar Board Corporation, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Multilayer HDI PCBs market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
HDI PCB (1+N+1)
HDI PCB (2+N+2)
HDI PCB (3+N+3)
Anylayer HDI
Market segment by Application
Consumer Electronics
Automotive Electronics
Server & Data Center
Telecommunications
Industrial & Medical
Others
Major players covered
Zhen Ding Technology
Kinwong
Shennan Circuit
Suntak Technology
Shenzhen Fastprint Circuit Tech
Gul Technologies Group
Compeq Manufacturing
TTM Technologies, Inc
Ibiden
HannStar Board Corporation
Nan Ya PCB
Meiko Electronics
Daeduck Electronics
Simmtech
Victory Giant Technology
AKM Meadville
CMK Corporation
Aoshikang Technology
CHIN POON Industrial
Olympic Circuit
Dongguan Shengyi Electronics
Dynamic Electronics
Bomin Electronics
Founder PCB
TPT
KCE GROUP
Shenzhen Sun & Lynn Circuits
CCTC
Guangdong Kingshine Electronics
Sunshine Global Circuits
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Multilayer HDI PCBs product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Multilayer HDI PCBs, with price, sales quantity, revenue, and global market share of Multilayer HDI PCBs from 2020 to 2025.
Chapter 3, the Multilayer HDI PCBs competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Multilayer HDI PCBs breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Multilayer HDI PCBs market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Multilayer HDI PCBs.
Chapter 14 and 15, to describe Multilayer HDI PCBs sales channel, distributors, customers, research findings and conclusion.
Summary:
Get latest Market Research Reports on Multilayer HDI PCBs. Industry analysis & Market Report on Multilayer HDI PCBs is a syndicated market report, published as Global Multilayer HDI PCBs Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031. It is complete Research Study and Industry Analysis of Multilayer HDI PCBs market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.