According to our (Global Info Research) latest study, the global Liquid-Cooled DC Busbar Assemblies for AI Data Centers market size was valued at US$ 206 million in 2025 and is forecast to a readjusted size of US$ 642 million by 2032 with a CAGR of 18.2% during review period.
In 2025, the global sales volume of liquid-cooled DC busbar assemblies for AI data centers is projected to reach approximately 400,000 sets, with an average price of around $500 per set.
Liquid-cooled DC busbar assemblies for AI data centers are power distribution components designed for high-power GPU cabinets and centralized DC power supply architectures. By integrating copper or aluminum conductors, insulation layers, cooling channels, and connection terminals, these assemblies enable high-current, low-loss power transmission while utilizing liquid cooling to dissipate heat generated by the conductors. They are ideally suited for the power delivery pathways of high-density AI servers. The upstream supply chain primarily comprises copper/aluminum conductors, insulating resins, cooling plates, sealing components, and high-current connectors; the downstream market consists mainly of AI data centers, complete server manufacturers, cabinet power system providers, and liquid cooling infrastructure integrators.
This report is a detailed and comprehensive analysis for global Liquid-Cooled DC Busbar Assemblies for AI Data Centers market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Liquid-Cooled DC Busbar Assemblies for AI Data Centers market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2021-2032
Global Liquid-Cooled DC Busbar Assemblies for AI Data Centers market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2021-2032
Global Liquid-Cooled DC Busbar Assemblies for AI Data Centers market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2021-2032
Global Liquid-Cooled DC Busbar Assemblies for AI Data Centers market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (US$/Unit), 2021-2026
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Liquid-Cooled DC Busbar Assemblies for AI Data Centers
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Liquid-Cooled DC Busbar Assemblies for AI Data Centers market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include TE Connectivity (CH), Schneider Electric (FR), Vertiv (US), Eaton (US), Legrand (FR), Mersen (FR), Rittal (DE), Amphenol (US), Rogers Corporation (US), Mitsubishi Electric (JP), etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Liquid-Cooled DC Busbar Assemblies for AI Data Centers market is split by Type and by Application. For the period 2021-2032, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Vertical Liquid-Cooled Busbar
Rack-level DC Busbar
Server-shelf Busbar Assembly
Blind-mate Power Busbar
Market segment by Rated Current
Rated Current 500-1000 A
Rated Current 1000-3000 A
Market segment by Functional Category
Cold-plate Integrated Grade
Low Voltage Drop Grade
High Insulation Grade
Others
Market segment by Application
AI GPU Racks
High-density Data Centers
48V/400V DC Power Distribution
Liquid Cooling Infrastructure
Major players covered
TE Connectivity (CH)
Schneider Electric (FR)
Vertiv (US)
Eaton (US)
Legrand (FR)
Mersen (FR)
Rittal (DE)
Amphenol (US)
Rogers Corporation (US)
Mitsubishi Electric (JP)
Methode Electronics (US)
Sun.King Technology (CN)
Shenzhen Busbar Sci-Tech (CN)
Suzhou West Deane Machinery (CN)
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Liquid-Cooled DC Busbar Assemblies for AI Data Centers product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Liquid-Cooled DC Busbar Assemblies for AI Data Centers, with price, sales quantity, revenue, and global market share of Liquid-Cooled DC Busbar Assemblies for AI Data Centers from 2021 to 2026.
Chapter 3, the Liquid-Cooled DC Busbar Assemblies for AI Data Centers competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Liquid-Cooled DC Busbar Assemblies for AI Data Centers breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2021 to 2032.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2021 to 2032.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2021 to 2026.and Liquid-Cooled DC Busbar Assemblies for AI Data Centers market forecast, by regions, by Type, and by Application, with sales and revenue, from 2027 to 2032.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Liquid-Cooled DC Busbar Assemblies for AI Data Centers.
Chapter 14 and 15, to describe Liquid-Cooled DC Busbar Assemblies for AI Data Centers sales channel, distributors, customers, research findings and conclusion.
Summary:
Get latest Market Research Reports on Liquid-Cooled DC Busbar Assemblies for AI Data Centers. Industry analysis & Market Report on Liquid-Cooled DC Busbar Assemblies for AI Data Centers is a syndicated market report, published as Global Liquid-Cooled DC Busbar Assemblies for AI Data Centers Market 2026 by Manufacturers, Regions, Type and Application, Forecast to 2032. It is complete Research Study and Industry Analysis of Liquid-Cooled DC Busbar Assemblies for AI Data Centers market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.