According to our (Global Info Research) latest study, the global Laser Debonding Equipment market size was valued at US$ 187 million in 2024 and is forecast to a readjusted size of USD 315 million by 2031 with a CAGR of 7.8% during review period.
Laser debonding is to quickly irradiate laser energy on the adhesive material to partially dissociate the adhesive material, thereby separating the temporary substrate from the wafer. Using the laser debonding process, a layer of laser release layer (Laser Release Layer) is first coated or bonded on a temporary substrate, and the subsequent processes are all carried out on this substrate. After the packaging process is completed, the laser is applied to the adhesive material to separate the wafer from the temporary substrate. In this process, the laser will pass through the transparent glass sheet and reach the surface of the adhesive material, and evenly apply the laser energy to the adhesive material in a scanning manner, quickly separating the adhesive material and the glass.
In recent years, with the rapid development of the semiconductor industry and electronic technology, laser debonding technology has gradually become an efficient and precise choice, and its market demand has also been growing steadily.
The market for laser debonding equipment has expanded rapidly in the past few years. With the miniaturization and high performance of integrated circuits, traditional mechanical bonding methods have gradually faced challenges in accuracy and efficiency, while laser debonding equipment has gradually become a mainstream solution with its high precision, contactless and damage-free characteristics.
In the semiconductor industry, laser debonding equipment is mainly used in the debonding process of chip packaging, especially in the production of miniaturized devices such as flip chips, optoelectronic chips, and MEMS sensors. With the continuous advancement of packaging technology, the demand for laser debonding equipment continues to grow.
In addition, the technology of laser debonding equipment is also developing in the direction of environmental protection and low energy consumption, which meets the current demand for green manufacturing. For example, some advanced laser equipment can minimize the impact on the environment by finely adjusting the laser wavelength and power, and meet the increasingly stringent environmental protection standards of various countries.
This report is a detailed and comprehensive analysis for global Laser Debonding Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Laser Debonding Equipment market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global Laser Debonding Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global Laser Debonding Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031
Global Laser Debonding Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K US$/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Laser Debonding Equipment
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Laser Debonding Equipment market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include SUSS, Han's Laser Technology Industry Group Co., Ltd., TAZMO, Shin-Etsu Chemical Co., Ltd., EV Group, Chengdu Laipu Technology, Honghao Semiconductor, Suzhou Wisee Tec, Tokyo Electron, Bio-Nano Micro Electronic Equipment, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Laser Debonding Equipment market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Fully Automatic
Semi-automatic
Market segment by Application
200mm Wafer
300mm Wafer
Others
Major players covered
SUSS
Han's Laser Technology Industry Group Co., Ltd.
TAZMO
Shin-Etsu Chemical Co., Ltd.
EV Group
Chengdu Laipu Technology
Honghao Semiconductor
Suzhou Wisee Tec
Tokyo Electron
Bio-Nano Micro Electronic Equipment
Wushi Microelectronics
Shanghai Micro Electronics Equipment
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Laser Debonding Equipment product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Laser Debonding Equipment, with price, sales quantity, revenue, and global market share of Laser Debonding Equipment from 2020 to 2025.
Chapter 3, the Laser Debonding Equipment competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Laser Debonding Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Laser Debonding Equipment market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Laser Debonding Equipment.
Chapter 14 and 15, to describe Laser Debonding Equipment sales channel, distributors, customers, research findings and conclusion.
Summary:
Get latest Market Research Reports on Laser Debonding Equipment. Industry analysis & Market Report on Laser Debonding Equipment is a syndicated market report, published as Global Laser Debonding Equipment Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031. It is complete Research Study and Industry Analysis of Laser Debonding Equipment market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.