Report Detail
Global IC Packaging Market Growth 2019-2024
- RnM2946682 |
- 15 February, 2019 |
- Global |
- 139 Pages |
- LPI(LP Information) |
- Electronics & Semiconductor
IC packaging (a.k.a. IC assembly) is one of the essential processes and technologies in IC manufacture, connecting the bare die to the PCB. In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encased in a supporting case that prevents physical damage and corrosion.
This industry is affected by the economy and policy, so it’s important to put an eye to economic indexes and leaders’ prefer. With the global economic recovery, more and more people pay attention to rising environment standards, especially in underdevelopment regions that have a large population and fast economic growth, the need will increase.
The industry is a high-technology and high-profit industry, the research team maintain a very optimistic attitude. It is suggested that the new enterprises to enter the field.
We tend to believe this industry now is close to mature, and the consumption increasing degree will show a smooth curve. On product prices, the slow downward trend in recent years will maintain in the future, as competition intensifies, prices gap between different brands will go narrowing. Similarly, there will be fluctuation in gross margin.
According to this study, over the next five years the IC Packaging market will register a xx% CAGR in terms of revenue, the global market size will reach US$ xx million by 2024, from US$ xx million in 2019. In particular, this report presents the global market share (sales and revenue) of key companies in IC Packaging business, shared in Chapter 3.
This report presents a comprehensive overview, market shares, and growth opportunities of IC Packaging market by product type, application, key manufacturers and key regions and countries.
This study considers the IC Packaging value and volume generated from the sales of the following segments:
Segmentation by product type: breakdown data from 2014 to 2019, in Section 2.3; and forecast to 2024 in section 11.7.
DIP
SOP
QFP
QFN
BGA
CSP
LGA
WLP
FC
Segmentation by application: breakdown data from 2014 to 2019, in Section 2.4; and forecast to 2024 in section 11.8.
CIS
MEMS
Others
This report also splits the market by region: Breakdown data in Chapter 4, 5, 6, 7 and 8.
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Spain
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report: Breakdown data in in Chapter 3.
ASE
Amkor
SPIL
STATS ChipPac
Powertech Technology
J-devices
UTAC
JECT
ChipMOS
Chipbond
In addition, this report discusses the key drivers influencing market growth, opportunities, the challenges and the risks faced by key manufacturers and the market as a whole. It also analyzes key emerging trends and their impact on present and future development.
Research objectives
To study and analyze the global IC Packaging consumption (value & volume) by key regions/countries, product type and application, history data from 2014 to 2018, and forecast to 2024.
To understand the structure of IC Packaging market by identifying its various subsegments.
Focuses on the key global IC Packaging manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.
To analyze the IC Packaging with respect to individual growth trends, future prospects, and their contribution to the total market.
To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
To project the consumption of IC Packaging submarkets, with respect to key regions (along with their respective key countries).
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.
Table of Contents
2019-2024 Global IC Packaging Consumption Market Report
1 Scope of the Report
- 1.1 Market Introduction
- 1.2 Research Objectives
- 1.3 Years Considered
- 1.4 Market Research Methodology
- 1.5 Economic Indicators
- 1.6 Currency Considered
2 Executive Summary
- 2.1 World Market Overview
- 2.1.1 Global IC Packaging Consumption 2014-2024
- 2.1.2 IC Packaging Consumption CAGR by Region
- 2.2 IC Packaging Segment by Type
- 2.2.1 DIP
- 2.2.2 SOP
- 2.2.3 QFP
- 2.2.4 QFN
- 2.2.5 BGA
- 2.2.6 CSP
- 2.2.7 LGA
- 2.2.8 WLP
- 2.2.9 FC
- 2.2.10 Others
- 2.3 IC Packaging Consumption by Type
- 2.3.1 Global IC Packaging Consumption Market Share by Type (2014-2019)
- 2.3.2 Global IC Packaging Revenue and Market Share by Type (2014-2019)
- 2.3.3 Global IC Packaging Sale Price by Type (2014-2019)
- 2.4 IC Packaging Segment by Application
- 2.4.1 CIS
- 2.4.2 MEMS
- 2.4.3 Others
- 2.5 IC Packaging Consumption by Application
- 2.5.1 Global IC Packaging Consumption Market Share by Application (2014-2019)
- 2.5.2 Global IC Packaging Value and Market Share by Application (2014-2019)
- 2.5.3 Global IC Packaging Sale Price by Application (2014-2019)
3 Global IC Packaging by Players
- 3.1 Global IC Packaging Sales Market Share by Players
- 3.1.1 Global IC Packaging Sales by Players (2017-2019)
- 3.1.2 Global IC Packaging Sales Market Share by Players (2017-2019)
- 3.2 Global IC Packaging Revenue Market Share by Players
- 3.2.1 Global IC Packaging Revenue by Players (2017-2019)
- 3.2.2 Global IC Packaging Revenue Market Share by Players (2017-2019)
- 3.3 Global IC Packaging Sale Price by Players
- 3.4 Global IC Packaging Manufacturing Base Distribution, Sales Area, Product Types by Players
- 3.4.1 Global IC Packaging Manufacturing Base Distribution and Sales Area by Players
- 3.4.2 Players IC Packaging Products Offered
- 3.5 Market Concentration Rate Analysis
- 3.5.1 Competition Landscape Analysis
- 3.5.2 Concentration Ratio (CR3, CR5 and CR10) (2017-2019)
- 3.6 New Products and Potential Entrants
- 3.7 Mergers & Acquisitions, Expansion
4 IC Packaging by Regions
- 4.1 IC Packaging by Regions
- 4.1.1 Global IC Packaging Consumption by Regions
- 4.1.2 Global IC Packaging Value by Regions
- 4.2 Americas IC Packaging Consumption Growth
- 4.3 APAC IC Packaging Consumption Growth
- 4.4 Europe IC Packaging Consumption Growth
- 4.5 Middle East & Africa IC Packaging Consumption Growth
5 Americas
- 5.1 Americas IC Packaging Consumption by Countries
- 5.1.1 Americas IC Packaging Consumption by Countries (2014-2019)
- 5.1.2 Americas IC Packaging Value by Countries (2014-2019)
- 5.2 Americas IC Packaging Consumption by Type
- 5.3 Americas IC Packaging Consumption by Application
- 5.4 United States
- 5.5 Canada
- 5.6 Mexico
- 5.7 Key Economic Indicators of Few Americas Countries
6 APAC
- 6.1 APAC IC Packaging Consumption by Countries
- 6.1.1 APAC IC Packaging Consumption by Countries (2014-2019)
- 6.1.2 APAC IC Packaging Value by Countries (2014-2019)
- 6.2 APAC IC Packaging Consumption by Type
- 6.3 APAC IC Packaging Consumption by Application
- 6.4 China
- 6.5 Japan
- 6.6 Korea
- 6.7 Southeast Asia
- 6.8 India
- 6.9 Australia
- 6.10 Key Economic Indicators of Few APAC Countries
7 Europe
- 7.1 Europe IC Packaging by Countries
- 7.1.1 Europe IC Packaging Consumption by Countries (2014-2019)
- 7.1.2 Europe IC Packaging Value by Countries (2014-2019)
- 7.2 Europe IC Packaging Consumption by Type
- 7.3 Europe IC Packaging Consumption by Application
- 7.4 Germany
- 7.5 France
- 7.6 UK
- 7.7 Italy
- 7.8 Russia
- 7.9 Spain
- 7.10 Key Economic Indicators of Few Europe Countries
8 Middle East & Africa
- 8.1 Middle East & Africa IC Packaging by Countries
- 8.1.1 Middle East & Africa IC Packaging Consumption by Countries (2014-2019)
- 8.1.2 Middle East & Africa IC Packaging Value by Countries (2014-2019)
- 8.2 Middle East & Africa IC Packaging Consumption by Type
- 8.3 Middle East & Africa IC Packaging Consumption by Application
- 8.4 Egypt
- 8.5 South Africa
- 8.6 Israel
- 8.7 Turkey
- 8.8 GCC Countries
9 Market Drivers, Challenges and Trends
- 9.1 Market Drivers and Impact
- 9.1.1 Growing Demand from Key Regions
- 9.1.2 Growing Demand from Key Applications and Potential Industries
- 9.2 Market Challenges and Impact
- 9.3 Market Trends
10 Marketing, Distributors and Customer
- 10.1 Sales Channel
- 10.1.1 Direct Channels
- 10.1.2 Indirect Channels
- 10.2 IC Packaging Distributors
- 10.3 IC Packaging Customer
11 Global IC Packaging Market Forecast
- 11.1 Global IC Packaging Consumption Forecast (2019-2024)
- 11.2 Global IC Packaging Forecast by Regions
- 11.2.1 Global IC Packaging Forecast by Regions (2019-2024)
- 11.2.2 Global IC Packaging Value Forecast by Regions (2019-2024)
- 11.2.3 Americas Consumption Forecast
- 11.2.4 APAC Consumption Forecast
- 11.2.5 Europe Consumption Forecast
- 11.2.6 Middle East & Africa Consumption Forecast
- 11.3 Americas Forecast by Countries
- 11.3.1 United States Market Forecast
- 11.3.2 Canada Market Forecast
- 11.3.3 Mexico Market Forecast
- 11.3.4 Brazil Market Forecast
- 11.4 APAC Forecast by Countries
- 11.4.1 China Market Forecast
- 11.4.2 Japan Market Forecast
- 11.4.3 Korea Market Forecast
- 11.4.4 Southeast Asia Market Forecast
- 11.4.5 India Market Forecast
- 11.4.6 Australia Market Forecast
- 11.5 Europe Forecast by Countries
- 11.5.1 Germany Market Forecast
- 11.5.2 France Market Forecast
- 11.5.3 UK Market Forecast
- 11.5.4 Italy Market Forecast
- 11.5.5 Russia Market Forecast
- 11.5.6 Spain Market Forecast
- 11.6 Middle East & Africa Forecast by Countries
- 11.6.1 Egypt Market Forecast
- 11.6.2 South Africa Market Forecast
- 11.6.3 Israel Market Forecast
- 11.6.4 Turkey Market Forecast
- 11.6.5 GCC Countries Market Forecast
- 11.7 Global IC Packaging Forecast by Type
- 11.8 Global IC Packaging Forecast by Application
12 Key Players Analysis
- 12.1 ASE
- 12.1.1 Company Details
- 12.1.2 IC Packaging Product Offered
- 12.1.3 ASE IC Packaging Sales, Revenue, Price and Gross Margin (2017-2019)
- 12.1.4 Main Business Overview
- 12.1.5 ASE News
- 12.2 Amkor
- 12.2.1 Company Details
- 12.2.2 IC Packaging Product Offered
- 12.2.3 Amkor IC Packaging Sales, Revenue, Price and Gross Margin (2017-2019)
- 12.2.4 Main Business Overview
- 12.2.5 Amkor News
- 12.3 SPIL
- 12.3.1 Company Details
- 12.3.2 IC Packaging Product Offered
- 12.3.3 SPIL IC Packaging Sales, Revenue, Price and Gross Margin (2017-2019)
- 12.3.4 Main Business Overview
- 12.3.5 SPIL News
- 12.4 STATS ChipPac
- 12.4.1 Company Details
- 12.4.2 IC Packaging Product Offered
- 12.4.3 STATS ChipPac IC Packaging Sales, Revenue, Price and Gross Margin (2017-2019)
- 12.4.4 Main Business Overview
- 12.4.5 STATS ChipPac News
- 12.5 Powertech Technology
- 12.5.1 Company Details
- 12.5.2 IC Packaging Product Offered
- 12.5.3 Powertech Technology IC Packaging Sales, Revenue, Price and Gross Margin (2017-2019)
- 12.5.4 Main Business Overview
- 12.5.5 Powertech Technology News
- 12.6 J-devices
- 12.6.1 Company Details
- 12.6.2 IC Packaging Product Offered
- 12.6.3 J-devices IC Packaging Sales, Revenue, Price and Gross Margin (2017-2019)
- 12.6.4 Main Business Overview
- 12.6.5 J-devices News
- 12.7 UTAC
- 12.7.1 Company Details
- 12.7.2 IC Packaging Product Offered
- 12.7.3 UTAC IC Packaging Sales, Revenue, Price and Gross Margin (2017-2019)
- 12.7.4 Main Business Overview
- 12.7.5 UTAC News
- 12.8 JECT
- 12.8.1 Company Details
- 12.8.2 IC Packaging Product Offered
- 12.8.3 JECT IC Packaging Sales, Revenue, Price and Gross Margin (2017-2019)
- 12.8.4 Main Business Overview
- 12.8.5 JECT News
- 12.9 ChipMOS
- 12.9.1 Company Details
- 12.9.2 IC Packaging Product Offered
- 12.9.3 ChipMOS IC Packaging Sales, Revenue, Price and Gross Margin (2017-2019)
- 12.9.4 Main Business Overview
- 12.9.5 ChipMOS News
- 12.10 Chipbond
- 12.10.1 Company Details
- 12.10.2 IC Packaging Product Offered
- 12.10.3 Chipbond IC Packaging Sales, Revenue, Price and Gross Margin (2017-2019)
- 12.10.4 Main Business Overview
- 12.10.5 Chipbond News
13 Research Findings and Conclusion
Summary:
Get latest Market Research Reports on IC Packaging . Industry analysis & Market Report on IC Packaging is a syndicated market report, published as Global IC Packaging Market Growth 2019-2024. It is complete Research Study and Industry Analysis of IC Packaging market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.
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