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Machinery & Equipment Global IC Advanced Packaging Equipment Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029

  • RnM4529089
    • |
  • 13 April, 2023
    • |
  • Global
    • |
  • 117 Pages
    • |
  • GIR (Global Info Research)
    • |
  • Machinery & Equipment

The semiconductor chip is not an island, it needs to form a more complex system through interconnected input and output (I/O) systems and peripheral systems or circuits. Since the IC chip and its internal circuits are very fragile, they need to be packaged for support and protection. The main functions of the package include: providing electrical connections between the chip and external systems, including power and signals; providing a stable and reliable working environment for the chip, which has a mechanical and environmental protection effect on the integrated circuit chip; and providing a thermal path to ensure the normal heat dissipation of the chip.
In order to increase circuit density and continue or surpass "Moore's Law", advanced packaging technology has become inevitable.
According to our (Global Info Research) latest study, the global IC Advanced Packaging Equipment market size was valued at USD 6848 million in 2022 and is forecast to a readjusted size of USD 12210 million by 2029 with a CAGR of 8.6% during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Global IC Advanced Packaging Equipment key players include ASM Pacific, Applied Material, Advantest, Kulicke&Soffa, DISCO, etc. Global top five manufacturers hold a share about 45%.
China is the largest market, with a share about 30%, followed by United States, and Southeast Asia, both have a share over 30 percent.
In terms of product, Cutting Equipment is the largest segment, with a share over 25%. And in terms of application, the largest application is Consumer Electronics, followed by Automotive Electronics, etc.
This report is a detailed and comprehensive analysis for global IC Advanced Packaging Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2023, are provided.
Key Features:
Global IC Advanced Packaging Equipment market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2018-2029
Global IC Advanced Packaging Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2018-2029
Global IC Advanced Packaging Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2018-2029
Global IC Advanced Packaging Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K USD/Unit), 2018-2023
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for IC Advanced Packaging Equipment
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global IC Advanced Packaging Equipment market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include ASM Pacific, Applied Material, Advantest, Kulicke&Soffa and DISCO, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.
Market Segmentation
IC Advanced Packaging Equipment market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Cutting Equipment
Solid Crystal Devices
Welding Equipment
Testing Equipment
Other
Market segment by Application
Automotive Electronics
Consumer Electronics
Other
Major players covered
ASM Pacific
Applied Material
Advantest
Kulicke&Soffa
DISCO
Tokyo Seimitsu
BESI
Hitachi
Teradyne
Hanmi
Toray Engineering
Shinkawa
COHU Semiconductor
TOWA
SUSS Microtec
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe IC Advanced Packaging Equipment product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of IC Advanced Packaging Equipment, with price, sales, revenue and global market share of IC Advanced Packaging Equipment from 2018 to 2023.
Chapter 3, the IC Advanced Packaging Equipment competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the IC Advanced Packaging Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2018 to 2029.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2018 to 2029.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2022.and IC Advanced Packaging Equipment market forecast, by regions, type and application, with sales and revenue, from 2024 to 2029.
Chapter 12, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War.
Chapter 13, the key raw materials and key suppliers, and industry chain of IC Advanced Packaging Equipment.
Chapter 14 and 15, to describe IC Advanced Packaging Equipment sales channel, distributors, customers, research findings and conclusion.


1 Market Overview

  • 1.1 Product Overview and Scope of IC Advanced Packaging Equipment
  • 1.2 Market Estimation Caveats and Base Year
  • 1.3 Market Analysis by Type
    • 1.3.1 Overview: Global IC Advanced Packaging Equipment Consumption Value by Type: 2018 Versus 2022 Versus 2029
    • 1.3.2 Cutting Equipment
    • 1.3.3 Solid Crystal Devices
    • 1.3.4 Welding Equipment
    • 1.3.5 Testing Equipment
    • 1.3.6 Other
  • 1.4 Market Analysis by Application
    • 1.4.1 Overview: Global IC Advanced Packaging Equipment Consumption Value by Application: 2018 Versus 2022 Versus 2029
    • 1.4.2 Automotive Electronics
    • 1.4.3 Consumer Electronics
    • 1.4.4 Other
  • 1.5 Global IC Advanced Packaging Equipment Market Size & Forecast
    • 1.5.1 Global IC Advanced Packaging Equipment Consumption Value (2018 & 2022 & 2029)
    • 1.5.2 Global IC Advanced Packaging Equipment Sales Quantity (2018-2029)
    • 1.5.3 Global IC Advanced Packaging Equipment Average Price (2018-2029)

2 Manufacturers Profiles

  • 2.1 ASM Pacific
    • 2.1.1 ASM Pacific Details
    • 2.1.2 ASM Pacific Major Business
    • 2.1.3 ASM Pacific IC Advanced Packaging Equipment Product and Services
    • 2.1.4 ASM Pacific IC Advanced Packaging Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.1.5 ASM Pacific Recent Developments/Updates
  • 2.2 Applied Material
    • 2.2.1 Applied Material Details
    • 2.2.2 Applied Material Major Business
    • 2.2.3 Applied Material IC Advanced Packaging Equipment Product and Services
    • 2.2.4 Applied Material IC Advanced Packaging Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.2.5 Applied Material Recent Developments/Updates
  • 2.3 Advantest
    • 2.3.1 Advantest Details
    • 2.3.2 Advantest Major Business
    • 2.3.3 Advantest IC Advanced Packaging Equipment Product and Services
    • 2.3.4 Advantest IC Advanced Packaging Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.3.5 Advantest Recent Developments/Updates
  • 2.4 Kulicke&Soffa
    • 2.4.1 Kulicke&Soffa Details
    • 2.4.2 Kulicke&Soffa Major Business
    • 2.4.3 Kulicke&Soffa IC Advanced Packaging Equipment Product and Services
    • 2.4.4 Kulicke&Soffa IC Advanced Packaging Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.4.5 Kulicke&Soffa Recent Developments/Updates
  • 2.5 DISCO
    • 2.5.1 DISCO Details
    • 2.5.2 DISCO Major Business
    • 2.5.3 DISCO IC Advanced Packaging Equipment Product and Services
    • 2.5.4 DISCO IC Advanced Packaging Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.5.5 DISCO Recent Developments/Updates
  • 2.6 Tokyo Seimitsu
    • 2.6.1 Tokyo Seimitsu Details
    • 2.6.2 Tokyo Seimitsu Major Business
    • 2.6.3 Tokyo Seimitsu IC Advanced Packaging Equipment Product and Services
    • 2.6.4 Tokyo Seimitsu IC Advanced Packaging Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.6.5 Tokyo Seimitsu Recent Developments/Updates
  • 2.7 BESI
    • 2.7.1 BESI Details
    • 2.7.2 BESI Major Business
    • 2.7.3 BESI IC Advanced Packaging Equipment Product and Services
    • 2.7.4 BESI IC Advanced Packaging Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.7.5 BESI Recent Developments/Updates
  • 2.8 Hitachi
    • 2.8.1 Hitachi Details
    • 2.8.2 Hitachi Major Business
    • 2.8.3 Hitachi IC Advanced Packaging Equipment Product and Services
    • 2.8.4 Hitachi IC Advanced Packaging Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.8.5 Hitachi Recent Developments/Updates
  • 2.9 Teradyne
    • 2.9.1 Teradyne Details
    • 2.9.2 Teradyne Major Business
    • 2.9.3 Teradyne IC Advanced Packaging Equipment Product and Services
    • 2.9.4 Teradyne IC Advanced Packaging Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.9.5 Teradyne Recent Developments/Updates
  • 2.10 Hanmi
    • 2.10.1 Hanmi Details
    • 2.10.2 Hanmi Major Business
    • 2.10.3 Hanmi IC Advanced Packaging Equipment Product and Services
    • 2.10.4 Hanmi IC Advanced Packaging Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.10.5 Hanmi Recent Developments/Updates
  • 2.11 Toray Engineering
    • 2.11.1 Toray Engineering Details
    • 2.11.2 Toray Engineering Major Business
    • 2.11.3 Toray Engineering IC Advanced Packaging Equipment Product and Services
    • 2.11.4 Toray Engineering IC Advanced Packaging Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.11.5 Toray Engineering Recent Developments/Updates
  • 2.12 Shinkawa
    • 2.12.1 Shinkawa Details
    • 2.12.2 Shinkawa Major Business
    • 2.12.3 Shinkawa IC Advanced Packaging Equipment Product and Services
    • 2.12.4 Shinkawa IC Advanced Packaging Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.12.5 Shinkawa Recent Developments/Updates
  • 2.13 COHU Semiconductor
    • 2.13.1 COHU Semiconductor Details
    • 2.13.2 COHU Semiconductor Major Business
    • 2.13.3 COHU Semiconductor IC Advanced Packaging Equipment Product and Services
    • 2.13.4 COHU Semiconductor IC Advanced Packaging Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.13.5 COHU Semiconductor Recent Developments/Updates
  • 2.14 TOWA
    • 2.14.1 TOWA Details
    • 2.14.2 TOWA Major Business
    • 2.14.3 TOWA IC Advanced Packaging Equipment Product and Services
    • 2.14.4 TOWA IC Advanced Packaging Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.14.5 TOWA Recent Developments/Updates
  • 2.15 SUSS Microtec
    • 2.15.1 SUSS Microtec Details
    • 2.15.2 SUSS Microtec Major Business
    • 2.15.3 SUSS Microtec IC Advanced Packaging Equipment Product and Services
    • 2.15.4 SUSS Microtec IC Advanced Packaging Equipment Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
    • 2.15.5 SUSS Microtec Recent Developments/Updates

3 Competitive Environment: IC Advanced Packaging Equipment by Manufacturer

  • 3.1 Global IC Advanced Packaging Equipment Sales Quantity by Manufacturer (2018-2023)
  • 3.2 Global IC Advanced Packaging Equipment Revenue by Manufacturer (2018-2023)
  • 3.3 Global IC Advanced Packaging Equipment Average Price by Manufacturer (2018-2023)
  • 3.4 Market Share Analysis (2022)
    • 3.4.1 Producer Shipments of IC Advanced Packaging Equipment by Manufacturer Revenue ($MM) and Market Share (%): 2022
    • 3.4.2 Top 3 IC Advanced Packaging Equipment Manufacturer Market Share in 2022
    • 3.4.2 Top 6 IC Advanced Packaging Equipment Manufacturer Market Share in 2022
  • 3.5 IC Advanced Packaging Equipment Market: Overall Company Footprint Analysis
    • 3.5.1 IC Advanced Packaging Equipment Market: Region Footprint
    • 3.5.2 IC Advanced Packaging Equipment Market: Company Product Type Footprint
    • 3.5.3 IC Advanced Packaging Equipment Market: Company Product Application Footprint
  • 3.6 New Market Entrants and Barriers to Market Entry
  • 3.7 Mergers, Acquisition, Agreements, and Collaborations

4 Consumption Analysis by Region

  • 4.1 Global IC Advanced Packaging Equipment Market Size by Region
    • 4.1.1 Global IC Advanced Packaging Equipment Sales Quantity by Region (2018-2029)
    • 4.1.2 Global IC Advanced Packaging Equipment Consumption Value by Region (2018-2029)
    • 4.1.3 Global IC Advanced Packaging Equipment Average Price by Region (2018-2029)
  • 4.2 North America IC Advanced Packaging Equipment Consumption Value (2018-2029)
  • 4.3 Europe IC Advanced Packaging Equipment Consumption Value (2018-2029)
  • 4.4 Asia-Pacific IC Advanced Packaging Equipment Consumption Value (2018-2029)
  • 4.5 South America IC Advanced Packaging Equipment Consumption Value (2018-2029)
  • 4.6 Middle East and Africa IC Advanced Packaging Equipment Consumption Value (2018-2029)

5 Market Segment by Type

  • 5.1 Global IC Advanced Packaging Equipment Sales Quantity by Type (2018-2029)
  • 5.2 Global IC Advanced Packaging Equipment Consumption Value by Type (2018-2029)
  • 5.3 Global IC Advanced Packaging Equipment Average Price by Type (2018-2029)

6 Market Segment by Application

  • 6.1 Global IC Advanced Packaging Equipment Sales Quantity by Application (2018-2029)
  • 6.2 Global IC Advanced Packaging Equipment Consumption Value by Application (2018-2029)
  • 6.3 Global IC Advanced Packaging Equipment Average Price by Application (2018-2029)

7 North America

  • 7.1 North America IC Advanced Packaging Equipment Sales Quantity by Type (2018-2029)
  • 7.2 North America IC Advanced Packaging Equipment Sales Quantity by Application (2018-2029)
  • 7.3 North America IC Advanced Packaging Equipment Market Size by Country
    • 7.3.1 North America IC Advanced Packaging Equipment Sales Quantity by Country (2018-2029)
    • 7.3.2 North America IC Advanced Packaging Equipment Consumption Value by Country (2018-2029)
    • 7.3.3 United States Market Size and Forecast (2018-2029)
    • 7.3.4 Canada Market Size and Forecast (2018-2029)
    • 7.3.5 Mexico Market Size and Forecast (2018-2029)

8 Europe

  • 8.1 Europe IC Advanced Packaging Equipment Sales Quantity by Type (2018-2029)
  • 8.2 Europe IC Advanced Packaging Equipment Sales Quantity by Application (2018-2029)
  • 8.3 Europe IC Advanced Packaging Equipment Market Size by Country
    • 8.3.1 Europe IC Advanced Packaging Equipment Sales Quantity by Country (2018-2029)
    • 8.3.2 Europe IC Advanced Packaging Equipment Consumption Value by Country (2018-2029)
    • 8.3.3 Germany Market Size and Forecast (2018-2029)
    • 8.3.4 France Market Size and Forecast (2018-2029)
    • 8.3.5 United Kingdom Market Size and Forecast (2018-2029)
    • 8.3.6 Russia Market Size and Forecast (2018-2029)
    • 8.3.7 Italy Market Size and Forecast (2018-2029)

9 Asia-Pacific

  • 9.1 Asia-Pacific IC Advanced Packaging Equipment Sales Quantity by Type (2018-2029)
  • 9.2 Asia-Pacific IC Advanced Packaging Equipment Sales Quantity by Application (2018-2029)
  • 9.3 Asia-Pacific IC Advanced Packaging Equipment Market Size by Region
    • 9.3.1 Asia-Pacific IC Advanced Packaging Equipment Sales Quantity by Region (2018-2029)
    • 9.3.2 Asia-Pacific IC Advanced Packaging Equipment Consumption Value by Region (2018-2029)
    • 9.3.3 China Market Size and Forecast (2018-2029)
    • 9.3.4 Japan Market Size and Forecast (2018-2029)
    • 9.3.5 Korea Market Size and Forecast (2018-2029)
    • 9.3.6 India Market Size and Forecast (2018-2029)
    • 9.3.7 Southeast Asia Market Size and Forecast (2018-2029)
    • 9.3.8 Australia Market Size and Forecast (2018-2029)

10 South America

  • 10.1 South America IC Advanced Packaging Equipment Sales Quantity by Type (2018-2029)
  • 10.2 South America IC Advanced Packaging Equipment Sales Quantity by Application (2018-2029)
  • 10.3 South America IC Advanced Packaging Equipment Market Size by Country
    • 10.3.1 South America IC Advanced Packaging Equipment Sales Quantity by Country (2018-2029)
    • 10.3.2 South America IC Advanced Packaging Equipment Consumption Value by Country (2018-2029)
    • 10.3.3 Brazil Market Size and Forecast (2018-2029)
    • 10.3.4 Argentina Market Size and Forecast (2018-2029)

11 Middle East & Africa

  • 11.1 Middle East & Africa IC Advanced Packaging Equipment Sales Quantity by Type (2018-2029)
  • 11.2 Middle East & Africa IC Advanced Packaging Equipment Sales Quantity by Application (2018-2029)
  • 11.3 Middle East & Africa IC Advanced Packaging Equipment Market Size by Country
    • 11.3.1 Middle East & Africa IC Advanced Packaging Equipment Sales Quantity by Country (2018-2029)
    • 11.3.2 Middle East & Africa IC Advanced Packaging Equipment Consumption Value by Country (2018-2029)
    • 11.3.3 Turkey Market Size and Forecast (2018-2029)
    • 11.3.4 Egypt Market Size and Forecast (2018-2029)
    • 11.3.5 Saudi Arabia Market Size and Forecast (2018-2029)
    • 11.3.6 South Africa Market Size and Forecast (2018-2029)

12 Market Dynamics

  • 12.1 IC Advanced Packaging Equipment Market Drivers
  • 12.2 IC Advanced Packaging Equipment Market Restraints
  • 12.3 IC Advanced Packaging Equipment Trends Analysis
  • 12.4 Porters Five Forces Analysis
    • 12.4.1 Threat of New Entrants
    • 12.4.2 Bargaining Power of Suppliers
    • 12.4.3 Bargaining Power of Buyers
    • 12.4.4 Threat of Substitutes
    • 12.4.5 Competitive Rivalry
  • 12.5 Influence of COVID-19 and Russia-Ukraine War
    • 12.5.1 Influence of COVID-19
    • 12.5.2 Influence of Russia-Ukraine War

13 Raw Material and Industry Chain

  • 13.1 Raw Material of IC Advanced Packaging Equipment and Key Manufacturers
  • 13.2 Manufacturing Costs Percentage of IC Advanced Packaging Equipment
  • 13.3 IC Advanced Packaging Equipment Production Process
  • 13.4 IC Advanced Packaging Equipment Industrial Chain

14 Shipments by Distribution Channel

  • 14.1 Sales Channel
    • 14.1.1 Direct to End-User
    • 14.1.2 Distributors
  • 14.2 IC Advanced Packaging Equipment Typical Distributors
  • 14.3 IC Advanced Packaging Equipment Typical Customers

15 Research Findings and Conclusion

    16 Appendix

    • 16.1 Methodology
    • 16.2 Research Process and Data Source

    Summary:
    Get latest Market Research Reports on IC Advanced Packaging Equipment. Industry analysis & Market Report on IC Advanced Packaging Equipment is a syndicated market report, published as Global IC Advanced Packaging Equipment Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029. It is complete Research Study and Industry Analysis of IC Advanced Packaging Equipment market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.

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