According to our (Global Info Research) latest study, the global HBM-Grade Granular Epoxy Molding Compound (G-EMC/GMC) market size was valued at US$ 185 million in 2025 and is forecast to a readjusted size of US$ 455 million by 2032 with a CAGR of 13.7% during review period.
HBM-grade granular epoxy molding compound is a granulated thermosetting encapsulation material designed for compression molding of high-bandwidth memory and other large-area advanced packages. It typically combines high-purity epoxy resin, curing chemistry, highly loaded spherical silica and functional additives to deliver low warpage, low stress, low ionic contamination, strong gap filling and rapid cure, while providing protection, underfill and structural support in stacked-die packages. In 2025, global HBM-Grade Granular Epoxy Molding Compound (G-EMC/GMC) production reached approximately 8,200 tons.
Higher HBM stack counts and larger package areas make conventional localized underfill more challenging in cycle time, warpage and void control, accelerating adoption of granular molded-underfill materials.
AI-oriented high-compute devices are driving thinner and denser packages with more complex thermo-mechanical interactions, requiring tighter balance among high filler loading, flow, low shrinkage and interface reliability.
Expansion of advanced-packaging capacity is promoting co-development between compression-molding equipment and dedicated GMC formulations, creating strong qualification barriers and customer stickiness for proven material platforms.
Report Scope
This report is a detailed and comprehensive analysis for global HBM-Grade Granular Epoxy Molding Compound (G-EMC/GMC) market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global HBM-Grade Granular Epoxy Molding Compound (G-EMC/GMC) market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Kg), 2021-2032
Global HBM-Grade Granular Epoxy Molding Compound (G-EMC/GMC) market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Kg), 2021-2032
Global HBM-Grade Granular Epoxy Molding Compound (G-EMC/GMC) market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Kg), 2021-2032
Global HBM-Grade Granular Epoxy Molding Compound (G-EMC/GMC) market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/Kg), 2021-2026
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for HBM-Grade Granular Epoxy Molding Compound (G-EMC/GMC)
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global HBM-Grade Granular Epoxy Molding Compound (G-EMC/GMC) market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Resonac, Sumitomo Bakelite, Kyocera, Panasonic Industry, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
HBM-Grade Granular Epoxy Molding Compound (G-EMC/GMC) market is split by Type and by Application. For the period 2021-2032, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market Segmentation
Market segment by Type
Below 85 wt%
85–90 wt%
Above 90 wt%
Market segment by Molding Temperature
Low-Temperature Grade
Standard-Temperature Grade
High-Temperature Grade
Market segment by Granule Size
Fine Granules
Medium Granules
Coarse Granules
Market segment by Application
HBM Molded Underfill
Fan-Out Wafer-Level Packaging
Panel-Level Packaging
Advanced System-In-Package
Other High-Density Packages
Major players covered
Resonac
Sumitomo Bakelite
Kyocera
Panasonic Industry
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
Chapter Outline
Chapter 1, to describe HBM-Grade Granular Epoxy Molding Compound (G-EMC/GMC) product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of HBM-Grade Granular Epoxy Molding Compound (G-EMC/GMC), with price, sales quantity, revenue, and global market share of HBM-Grade Granular Epoxy Molding Compound (G-EMC/GMC) from 2021 to 2026.
Chapter 3, the HBM-Grade Granular Epoxy Molding Compound (G-EMC/GMC) competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the HBM-Grade Granular Epoxy Molding Compound (G-EMC/GMC) breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2021 to 2032.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2021 to 2032.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2021 to 2026.and HBM-Grade Granular Epoxy Molding Compound (G-EMC/GMC) market forecast, by regions, by Type, and by Application, with sales and revenue, from 2027 to 2032.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of HBM-Grade Granular Epoxy Molding Compound (G-EMC/GMC).
Chapter 14 and 15, to describe HBM-Grade Granular Epoxy Molding Compound (G-EMC/GMC) sales channel, distributors, customers, research findings and conclusion.
Summary:
Get latest Market Research Reports on HBM-Grade Granular Epoxy Molding Compound (G-EMC/GMC). Industry analysis & Market Report on HBM-Grade Granular Epoxy Molding Compound (G-EMC/GMC) is a syndicated market report, published as Global HBM-Grade Granular Epoxy Molding Compound (G-EMC/GMC) Market 2026 by Manufacturers, Regions, Type and Application, Forecast to 2032. It is complete Research Study and Industry Analysis of HBM-Grade Granular Epoxy Molding Compound (G-EMC/GMC) market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.