Global GMR-Sensor Market Data Survey Report 2013-2025

Table of Contents
1 Global Market Overview
1.1 Scope of Statistics
1.1.1 Scope of Products
1.1.2 Scope of Manufacturers
1.1.3 Scope of Application
1.1.4 Scope of Type
1.1.5 Scope of Regions/Countries
1.2 Global Market Size
2 Regional Market
2.1 Regional Production
2.2 Regional Demand
2.3 Regional Trade
3 Key Manufacturers
3.1 NVE Corporation (The U.S.)
3.1.1 Company Information
3.1.2 Product & Services
3.1.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.1.4 Recent Development
3.2 Bartington Instruments Ltd (The U.K.)
3.2.1 Company Information
3.2.2 Product & Services
3.2.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.2.4 Recent Development
3.3 MEMSIC, Inc. (The U.S.)
3.3.1 Company Information
3.3.2 Product & Services
3.3.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.3.4 Recent Development
3.4 TE Connectivity Ltd (Switzerland)
3.4.1 Company Information
3.4.2 Product & Services
3.4.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.4.4 Recent Development
3.5 Analog Devices, Inc. (The U.S.)
3.5.1 Company Information
3.5.2 Product & Services
3.5.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.5.4 Recent Development
3.6 Honeywell International Inc. (The U.S.)
3.6.1 Company Information
3.6.2 Product & Services
3.6.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.6.4 Recent Development
3.7 Robert Bosch GmbH (Germany)
3.7.1 Company Information
3.7.2 Product & Services
3.7.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.7.4 Recent Development
3.8 Ams AG (Austria)
3.8.1 Company Information
3.8.2 Product & Services
3.8.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.8.4 Recent Development
3.9 NXP Semiconductors N.V. (The Netherlands)
3.9.1 Company Information
3.9.2 Product & Services
3.9.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.9.4 Recent Development
3.10 The Micronas Group (Switzerland)
3.10.1 Company Information
3.10.2 Product & Services
3.10.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.10.4 Recent Development
3.11 Melexis NV (Belgium)
3.11.1 Company Information
3.11.2 Product & Services
3.11.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.11.4 Recent Development
3.12 Infineon Technologies AG (Germany)
3.12.1 Company Information
3.12.2 Product & Services
3.12.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.12.4 Recent Development
3.13 Sanken Electric Co., Ltd. (Japan)
3.13.1 Company Information
3.13.2 Product & Services
3.13.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
3.14 Asahi Kasei Corporation (Japan)
3.14.1 Company Information
3.14.2 Product & Services
3.14.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
4 Major Application
4.1 Consumer Electronics
4.1.1 Overview
4.1.2 Consumer Electronics Market Size and Forecast
4.2 Automotive
4.2.1 Overview
4.2.2 Automotive Market Size and Forecast
4.3 Healthcare
4.3.1 Overview
4.3.2 Healthcare Market Size and Forecast
4.4 Aerospace & Defense
4.4.1 Overview
4.4.2 Aerospace & Defense Market Size and Forecast
4.5 Others
4.5.1 Overview
4.5.2 Others Market Size and Forecast
5 Market by Type
5.By Standard Multilayer (ML)
5.1 Standard Multilayer (ML)
5.1.1 Overview
5.1.2 Standard Multilayer (ML) Market Size and Forecast
5.2 High Temperature Multilayer (HTM)
5.2.1 Overview
5.2.2 High Temperature Multilayer (HTM) Market Size and Forecast
5.3 Low Hysteresis High Temperature Multilayer (LHHTM)
5.3.1 Overview
5.3.2 Low Hysteresis High Temperature Multilayer (LHHTM) Market Size and Forecast
5.4 Spin Valve (SV)
5.4.1 Overview
5.4.2 Spin Valve (SV) Market Size and Forecast
5.5 Others
5.5.1 Overview
5.5.2 Others Market Size and Forecast
6 Price Overview
6.1 Price by Manufacturers
6.2 Price by Application
6.3 Price by Type
7 Conclusion