Report Detail
Global (United States, European Union and China) Flip Chip Technology Market Research Report 2019-2025
- RnM3579018 |
- 08 July, 2019 |
- Global |
- 110 Pages |
- QYResearch |
- Electronics & Semiconductor
In the development of packaging of electronics, the main aim is to lower cost, increase the packaging density, and improve the performance by maintaining or improving the reliability of the circuits. The concept of the flip-chip process where the semiconductor chip is assembled face down onto the circuit board is ideal for size considerations because there is no extra area needed for contacting on the sides of the component. The performance in high-frequency applications is superior to other interconnection methods because the length of the connection path is minimized. Flip chip bumping is a vital step in the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a spacer to prevent electrical shorts and provides mechanical support.
The APAC held a large share of the overall flip chip technology market in 2017.
In 2019, the market size of Flip Chip Technology is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.
In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Flip Chip Technology.
This report studies the global market size of Flip Chip Technology, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).
This study presents the Flip Chip Technology production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.
For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.
In global market, the following companies are covered:
Samsung
Intel
Global Foundries
UMC
ASE
Amkor
STATS ChipPAC
Powertech
STMicroelectronics
Texas Instruments
Market Segment by Product Type
FC BGA
FC PGA
FC LGA
FC QFN
FC SiP
FC CSP
Market Segment by Application
Consumer electronics
Telecommunication
Automotive
Industrial sector
Medical devices
Smart technologies
Military & aerospace
Key Regions split in this report: breakdown data for each region.
United States
China
European Union
Rest of World (Japan, Korea, India and Southeast Asia)
The study objectives are:
To analyze and research the Flip Chip Technology status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
To present the key Flip Chip Technology manufacturers, presenting the sales, revenue, market share, and recent development for key players.
To split the breakdown data by regions, type, companies and applications
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market
In this study, the years considered to estimate the market size of Flip Chip Technology are as follows:
History Year: 2014-2018
Base Year: 2018
Estimated Year: 2019
Forecast Year 2019 to 2025
Table of Contents
1 Report Overview
- 1.1 Research Scope
- 1.2 Major Manufacturers Covered in This Report
- 1.3 Market Segment by Type
- 1.3.1 Global Flip Chip Technology Market Size Growth Rate by Type (2019-2025)
- 1.3.2 FC BGA
- 1.3.3 FC PGA
- 1.3.4 FC LGA
- 1.3.5 FC QFN
- 1.3.6 FC SiP
- 1.3.7 FC CSP
- 1.4 Market Segment by Application
- 1.4.1 Global Flip Chip Technology Market Share by Application (2019-2025)
- 1.4.2 Consumer electronics
- 1.4.3 Telecommunication
- 1.4.4 Automotive
- 1.4.5 Industrial sector
- 1.4.6 Medical devices
- 1.4.7 Smart technologies
- 1.4.8 Military & aerospace
- 1.5 Study Objectives
- 1.6 Years Considered
2 Global Growth Trends
- 2.1 Production and Capacity Analysis
- 2.1.1 Global Flip Chip Technology Production Value 2014-2025
- 2.1.2 Global Flip Chip Technology Production 2014-2025
- 2.1.3 Global Flip Chip Technology Capacity 2014-2025
- 2.1.4 Global Flip Chip Technology Marketing Pricing and Trends
- 2.2 Key Producers Growth Rate (CAGR) 2019-2025
- 2.2.1 Global Flip Chip Technology Market Size CAGR of Key Regions
- 2.2.2 Global Flip Chip Technology Market Share of Key Regions
- 2.3 Industry Trends
- 2.3.1 Market Top Trends
- 2.3.2 Market Drivers
3 Market Share by Manufacturers
- 3.1 Capacity and Production by Manufacturers
- 3.1.1 Global Flip Chip Technology Capacity by Manufacturers
- 3.1.2 Global Flip Chip Technology Production by Manufacturers
- 3.2 Revenue by Manufacturers
- 3.2.1 Flip Chip Technology Revenue by Manufacturers (2014-2019)
- 3.2.2 Flip Chip Technology Revenue Share by Manufacturers (2014-2019)
- 3.2.3 Global Flip Chip Technology Market Concentration Ratio (CR5 and HHI)
- 3.3 Flip Chip Technology Price by Manufacturers
- 3.4 Key Manufacturers Flip Chip Technology Plants/Factories Distribution and Area Served
- 3.5 Date of Key Manufacturers Enter into Flip Chip Technology Market
- 3.6 Key Manufacturers Flip Chip Technology Product Offered
- 3.7 Mergers & Acquisitions, Expansion Plans
4 Market Size by Type
- 4.1 Production and Production Value for Each Type
- 4.1.1 FC BGA Production and Production Value (2014-2019)
- 4.1.2 FC PGA Production and Production Value (2014-2019)
- 4.1.3 FC LGA Production and Production Value (2014-2019)
- 4.1.4 FC QFN Production and Production Value (2014-2019)
- 4.1.5 FC SiP Production and Production Value (2014-2019)
- 4.1.6 FC CSP Production and Production Value (2014-2019)
- 4.2 Global Flip Chip Technology Production Market Share by Type
- 4.3 Global Flip Chip Technology Production Value Market Share by Type
- 4.4 Flip Chip Technology Ex-factory Price by Type
5 Market Size by Application
- 5.1 Overview
- 5.2 Global Flip Chip Technology Consumption by Application
6 Production by Regions
- 6.1 Global Flip Chip Technology Production (History Data) by Regions 2014-2019
- 6.2 Global Flip Chip Technology Production Value (History Data) by Regions
- 6.3 United States
- 6.3.1 United States Flip Chip Technology Production Growth Rate 2014-2019
- 6.3.2 United States Flip Chip Technology Production Value Growth Rate 2014-2019
- 6.3.3 Key Players in United States
- 6.3.4 United States Flip Chip Technology Import & Export
- 6.4 European Union
- 6.4.1 European Union Flip Chip Technology Production Growth Rate 2014-2019
- 6.4.2 European Union Flip Chip Technology Production Value Growth Rate 2014-2019
- 6.4.3 Key Players in European Union
- 6.4.4 European Union Flip Chip Technology Import & Export
- 6.5 China
- 6.5.1 China Flip Chip Technology Production Growth Rate 2014-2019
- 6.5.2 China Flip Chip Technology Production Value Growth Rate 2014-2019
- 6.5.3 Key Players in China
- 6.5.4 China Flip Chip Technology Import & Export
- 6.6 Rest of World
- 6.6.1 Japan
- 6.6.2 Korea
- 6.6.3 India
- 6.6.4 Southeast Asia
7 Flip Chip Technology Consumption by Regions
- 7.1 Global Flip Chip Technology Consumption (History Data) by Regions
- 7.2 United States
- 7.2.1 United States Flip Chip Technology Consumption by Type
- 7.2.2 United States Flip Chip Technology Consumption by Application
- 7.3 European Union
- 7.3.1 European Union Flip Chip Technology Consumption by Type
- 7.3.2 European Union Flip Chip Technology Consumption by Application
- 7.4 China
- 7.4.1 China Flip Chip Technology Consumption by Type
- 7.4.2 China Flip Chip Technology Consumption by Application
- 7.5 Rest of World
- 7.5.1 Rest of World Flip Chip Technology Consumption by Type
- 7.5.2 Rest of World Flip Chip Technology Consumption by Application
- 7.5.1 Japan
- 7.5.2 Korea
- 7.5.3 India
- 7.5.4 Southeast Asia
8 Company Profiles
- 8.1 Samsung
- 8.1.1 Samsung Company Details
- 8.1.2 Company Description and Business Overview
- 8.1.3 Production and Revenue of Flip Chip Technology
- 8.1.4 Flip Chip Technology Product Introduction
- 8.1.5 Samsung Recent Development
- 8.2 Intel
- 8.2.1 Intel Company Details
- 8.2.2 Company Description and Business Overview
- 8.2.3 Production and Revenue of Flip Chip Technology
- 8.2.4 Flip Chip Technology Product Introduction
- 8.2.5 Intel Recent Development
- 8.3 Global Foundries
- 8.3.1 Global Foundries Company Details
- 8.3.2 Company Description and Business Overview
- 8.3.3 Production and Revenue of Flip Chip Technology
- 8.3.4 Flip Chip Technology Product Introduction
- 8.3.5 Global Foundries Recent Development
- 8.4 UMC
- 8.4.1 UMC Company Details
- 8.4.2 Company Description and Business Overview
- 8.4.3 Production and Revenue of Flip Chip Technology
- 8.4.4 Flip Chip Technology Product Introduction
- 8.4.5 UMC Recent Development
- 8.5 ASE
- 8.5.1 ASE Company Details
- 8.5.2 Company Description and Business Overview
- 8.5.3 Production and Revenue of Flip Chip Technology
- 8.5.4 Flip Chip Technology Product Introduction
- 8.5.5 ASE Recent Development
- 8.6 Amkor
- 8.6.1 Amkor Company Details
- 8.6.2 Company Description and Business Overview
- 8.6.3 Production and Revenue of Flip Chip Technology
- 8.6.4 Flip Chip Technology Product Introduction
- 8.6.5 Amkor Recent Development
- 8.7 STATS ChipPAC
- 8.7.1 STATS ChipPAC Company Details
- 8.7.2 Company Description and Business Overview
- 8.7.3 Production and Revenue of Flip Chip Technology
- 8.7.4 Flip Chip Technology Product Introduction
- 8.7.5 STATS ChipPAC Recent Development
- 8.8 Powertech
- 8.8.1 Powertech Company Details
- 8.8.2 Company Description and Business Overview
- 8.8.3 Production and Revenue of Flip Chip Technology
- 8.8.4 Flip Chip Technology Product Introduction
- 8.8.5 Powertech Recent Development
- 8.9 STMicroelectronics
- 8.9.1 STMicroelectronics Company Details
- 8.9.2 Company Description and Business Overview
- 8.9.3 Production and Revenue of Flip Chip Technology
- 8.9.4 Flip Chip Technology Product Introduction
- 8.9.5 STMicroelectronics Recent Development
- 8.10 Texas Instruments
- 8.10.1 Texas Instruments Company Details
- 8.10.2 Company Description and Business Overview
- 8.10.3 Production and Revenue of Flip Chip Technology
- 8.10.4 Flip Chip Technology Product Introduction
- 8.10.5 Texas Instruments Recent Development
9 Market Forecast
- 9.1 Global Market Size Forecast
- 9.1.1 Global Flip Chip Technology Capacity, Production Forecast 2019-2025
- 9.1.2 Global Flip Chip Technology Production Value Forecast 2019-2025
- 9.2 Market Forecast by Regions
- 9.2.1 Global Flip Chip Technology Production and Value Forecast by Regions 2019-2025
- 9.2.2 Global Flip Chip Technology Consumption Forecast by Regions 2019-2025
- 9.3 United States
- 9.3.1 Production and Value Forecast in United States
- 9.3.2 Consumption Forecast in United States
- 9.4 European Union
- 9.4.1 Production and Value Forecast in European Union
- 9.4.2 Consumption Forecast in European Union
- 9.5 China
- 9.5.1 Production and Value Forecast in China
- 9.5.2 Consumption Forecast in China
- 9.6 Rest of World
- 9.6.1 Japan
- 9.6.2 Korea
- 9.6.3 India
- 9.6.4 Southeast Asia
- 9.7 Forecast by Type
- 9.7.1 Global Flip Chip Technology Production Forecast by Type
- 9.7.2 Global Flip Chip Technology Production Value Forecast by Type
- 9.8 Consumption Forecast by Application
10 Value Chain and Sales Channels Analysis
- 10.1 Value Chain Analysis
- 10.2 Sales Channels Analysis
- 10.2.1 Flip Chip Technology Sales Channels
- 10.2.2 Flip Chip Technology Distributors
- 10.3 Flip Chip Technology Customers
11 Opportunities & Challenges, Threat and Affecting Factors
- 11.1 Market Opportunities
- 11.2 Market Challenges
- 11.3 Porter's Five Forces Analysis
12 Key Findings
13 Appendix
- 13.1 Research Methodology
- 13.1.1 Methodology/Research Approach
- 13.1.1.1 Research Programs/Design
- 13.1.1.2 Market Size Estimation
- 13.1.1.3 Market Breakdown and Data Triangulation
- 13.1.2 Data Source
- 13.1.2.1 Secondary Sources
- 13.1.2.2 Primary Sources
- 13.1.1 Methodology/Research Approach
- 13.2 Author Details
Summary:
Get latest Market Research Reports on Flip Chip Technology. Industry analysis & Market Report on Flip Chip Technology is a syndicated market report, published as Global (United States, European Union and China) Flip Chip Technology Market Research Report 2019-2025. It is complete Research Study and Industry Analysis of Flip Chip Technology market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.
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