Report Detail

Electronics & Semiconductor Global Flip-Chip Package Substrate Market Research Report 2022

  • RnM4454918
  • |
  • 20 June, 2022
  • |
  • Global
  • |
  • 93 Pages
  • |
  • QYResearch
  • |
  • Electronics & Semiconductor

Industry Insights
Due to the COVID-19 pandemic, the global Flip-Chip Package Substrate market size is estimated to be worth US$ million in 2022 and is forecast to a readjusted size of US$ million by 2028 with a CAGR of % during the forecast period 2022-2028. Fully considering the economic change by this health crisis, FCBGA accounting for % of the Flip-Chip Package Substrate global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR from 2022 to 2028. While High-end servers segment is altered to an % CAGR throughout this forecast period.

North America Flip-Chip Package Substrate market is estimated at US$ million in 2021, while Europe is forecast to reach US$ million by 2028. The proportion of the North America is % in 2021, while Europe percentage is %, and it is predicted that Europe share will reach % in 2028, trailing a CAGR of % through the analysis period 2022-2028. As for the Asia, the notable markets are Japan and South Korea, CAGR is % and % respectively for the next 6-year period.

The global major manufacturers of Flip-Chip Package Substrate include Unimicron, Ibiden, Nan Ya PCB, Shiko Electric Industries, AT&S, Kinsus Interconnect Technology, Semco, Kyocera and TOPPAN, etc. In terms of revenue, the global 3 largest players have a % market share of Flip-Chip Package Substrate in 2021.

Key Drivers & Barriers

The research report has incorporated the analysis of different factors that augment the market’s growth. It constitutes trends, restraints, and drivers that transform the market in either a positive or negative manner. This section also provides the scope of different segments and applications that can potentially influence the market in the future. The detailed information is based on current trends and historic milestones. This section also provides an analysis of the volume of production about the global market and about each type from 2017 to 2028. This section mentions the volume of production by region from 2017 to 2028. Pricing analysis is included in the report according to each type from the year 2017 to 2028, manufacturer from 2017 to 2022, region from 2017 to 2022, and global price from 2017 to 2028.

A thorough evaluation of the restrains included in the report portrays the contrast to drivers and gives room for strategic planning. Factors that overshadow the market growth are pivotal as they can be understood to devise different bends for getting hold of the lucrative opportunities that are present in the ever-growing market. Additionally, insights into market expert’s opinions have been taken to understand the market better.

Post-covid-19 Outlook

The readers in the section will understand how the Flip-Chip Package Substrate market scenario changed across the globe during the pandemic and post-pandemic. The study is done keeping in view the changes in aspects such as production, demand, consumption, supply chain. The industry experts have also highlighted the key factors that will help create opportunities for players and stabilize the overall industry in the years to come.

Segmental Outlook

Key segments including type and application have been elaborated in this report. The consultants at QY Research have studied every segment and provided the market size using historical data. They have also talked about the growth opportunities that the segment may pose in the future. This study bestows production and revenue data by type and application during the historical period (2017-2022) and forecast period (2023-2028).

Segment by Type

FCBGA

FCCSP

Segment by Application

High-end servers

GPU

CPU and MPU

ASIC

FPGA

Regional Outlook

This section of the report provides key insights regarding various regions and the key players operating in each region. Economic, social, environmental, technological, and political factors have been taken into consideration while assessing the growth of the particular region/country. The readers will also get their hands on the revenue and production data of each region and country for the period 2017-2028. This information derived through comprehensive research will help the reader to get familiar with the potential value of the investment in a particular region.

Production by Region

North America

Europe

China

Japan

South Korea

Consumption by Region

North America

United States

Canada

Europe

Germany

France

U.K.

Italy

Russia

Asia-Pacific

China

Japan

South Korea

India

Australia

China Taiwan

Indonesia

Thailand

Malaysia

Latin America

Mexico

Brazil

Argentina

Colombia

Competitive Scenario

In this section, the readers will gain an understanding of the key players competing. The experts at QY Research have studied the key growth strategies, such as innovative trends and developments, intensification of product portfolio, mergers and acquisitions, collaborations, new product innovation, and geographical expansion, undertaken by these participants to maintain their presence. Apart from business strategies, the study includes current developments and key financials. The readers will also get access to the data related to global revenue, price, and production by manufacturers for the period 2017-2022. This all-inclusive report will certainly serve the clients to stay updated and make effective decisions in their businesses. Some of the prominent players reviewed in the research report include:

Unimicron

Ibiden

Nan Ya PCB

Shiko Electric Industries

AT&S

Kinsus Interconnect Technology

Semco

Kyocera

TOPPAN

Zhen Ding Technology

Daeduck Electronics

ASE Material

ACCESS

Frequently Asked Questions

Which product segment grabbed the largest share in the Flip-Chip Package Substrate market?

How is the competitive scenario of the Flip-Chip Package Substrate market?

Which are the key factors aiding the Flip-Chip Package Substrate market growth?

Which are the prominent players in the Flip-Chip Package Substrate market?

Which region holds the maximum share in the Flip-Chip Package Substrate market?

What will be the CAGR of the Flip-Chip Package Substrate market during the forecast period?

Which application segment emerged as the leading segment in the Flip-Chip Package Substrate market?

What key trends are likely to emerge in the Flip-Chip Package Substrate market in the coming years?

What will be the Flip-Chip Package Substrate market size by 2028?

Which company held the largest share in the Flip-Chip Package Substrate market?


1 Flip-Chip Package Substrate Market Overview

  • 1.1 Product Overview and Scope of Flip-Chip Package Substrate
  • 1.2 Flip-Chip Package Substrate Segment by Type
  • 1.2.1 Global Flip-Chip Package Substrate Market Size Growth Rate Analysis by Type 2022 VS 2028
  • 1.2.2 FCBGA
  • 1.2.3 FCCSP
  • 1.3 Flip-Chip Package Substrate Segment by Application
  • 1.3.1 Global Flip-Chip Package Substrate Consumption Comparison by Application: 2022 VS 2028
  • 1.3.2 High-end servers
  • 1.3.3 GPU
  • 1.3.4 CPU and MPU
  • 1.3.5 ASIC
  • 1.3.6 FPGA
  • 1.4 Global Market Growth Prospects
  • 1.4.1 Global Flip-Chip Package Substrate Revenue Estimates and Forecasts (2017-2028)
  • 1.4.2 Global Flip-Chip Package Substrate Production Estimates and Forecasts (2017-2028)
  • 1.5 Global Market Size by Region
  • 1.5.1 Global Flip-Chip Package Substrate Market Size Estimates and Forecasts by Region: 2017 VS 2021 VS 2028
  • 1.5.2 North America Flip-Chip Package Substrate Estimates and Forecasts (2017-2028)
  • 1.5.3 Europe Flip-Chip Package Substrate Estimates and Forecasts (2017-2028)
  • 1.5.4 China Flip-Chip Package Substrate Estimates and Forecasts (2017-2028)
  • 1.5.5 Japan Flip-Chip Package Substrate Estimates and Forecasts (2017-2028)
  • 1.5.6 South Korea Flip-Chip Package Substrate Estimates and Forecasts (2017-2028)
  • 2 Market Competition by Manufacturers

    • 2.1 Global Flip-Chip Package Substrate Production Market Share by Manufacturers (2017-2022)
    • 2.2 Global Flip-Chip Package Substrate Revenue Market Share by Manufacturers (2017-2022)
    • 2.3 Flip-Chip Package Substrate Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
    • 2.4 Global Flip-Chip Package Substrate Average Price by Manufacturers (2017-2022)
    • 2.5 Manufacturers Flip-Chip Package Substrate Production Sites, Area Served, Product Types
    • 2.6 Flip-Chip Package Substrate Market Competitive Situation and Trends
    • 2.6.1 Flip-Chip Package Substrate Market Concentration Rate
  • 2.6.2 Global 5 and 10 Largest Flip-Chip Package Substrate Players Market Share by Revenue
  • 2.6.3 Mergers & Acquisitions, Expansion
  • 3 Production by Region

    • 3.1 Global Production of Flip-Chip Package Substrate Market Share by Region (2017-2022)
    • 3.2 Global Flip-Chip Package Substrate Revenue Market Share by Region (2017-2022)
    • 3.3 Global Flip-Chip Package Substrate Production, Revenue, Price and Gross Margin (2017-2022)
    • 3.4 North America Flip-Chip Package Substrate Production
    • 3.4.1 North America Flip-Chip Package Substrate Production Growth Rate (2017-2022)
  • 3.4.2 North America Flip-Chip Package Substrate Production, Revenue, Price and Gross Margin (2017-2022)
  • 3.5 Europe Flip-Chip Package Substrate Production
  • 3.5.1 Europe Flip-Chip Package Substrate Production Growth Rate (2017-2022)
  • 3.5.2 Europe Flip-Chip Package Substrate Production, Revenue, Price and Gross Margin (2017-2022)
  • 3.6 China Flip-Chip Package Substrate Production
  • 3.6.1 China Flip-Chip Package Substrate Production Growth Rate (2017-2022)
  • 3.6.2 China Flip-Chip Package Substrate Production, Revenue, Price and Gross Margin (2017-2022)
  • 3.7 Japan Flip-Chip Package Substrate Production
  • 3.7.1 Japan Flip-Chip Package Substrate Production Growth Rate (2017-2022)
  • 3.7.2 Japan Flip-Chip Package Substrate Production, Revenue, Price and Gross Margin (2017-2022)
  • 3.8 South Korea Flip-Chip Package Substrate Production
  • 3.8.1 South Korea Flip-Chip Package Substrate Production Growth Rate (2017-2022)
  • 3.8.2 South Korea Flip-Chip Package Substrate Production, Revenue, Price and Gross Margin (2017-2022)
  • 4 Global Flip-Chip Package Substrate Consumption by Region

    • 4.1 Global Flip-Chip Package Substrate Consumption by Region
    • 4.1.1 Global Flip-Chip Package Substrate Consumption by Region
  • 4.1.2 Global Flip-Chip Package Substrate Consumption Market Share by Region
  • 4.2 North America
  • 4.2.1 North America Flip-Chip Package Substrate Consumption by Country
  • 4.2.2 United States
  • 4.2.3 Canada
  • 4.3 Europe
  • 4.3.1 Europe Flip-Chip Package Substrate Consumption by Country
  • 4.3.2 Germany
  • 4.3.3 France
  • 4.3.4 U.K.
  • 4.3.5 Italy
  • 4.3.6 Russia
  • 4.4 Asia Pacific
  • 4.4.1 Asia Pacific Flip-Chip Package Substrate Consumption by Region
  • 4.4.2 China
  • 4.4.3 Japan
  • 4.4.4 South Korea
  • 4.4.5 China Taiwan
  • 4.4.6 Southeast Asia
  • 4.4.7 India
  • 4.4.8 Australia
  • 4.5 Latin America
  • 4.5.1 Latin America Flip-Chip Package Substrate Consumption by Country
  • 4.5.2 Mexico
  • 4.5.3 Brazil
  • 5 Segment by Type

    • 5.1 Global Flip-Chip Package Substrate Production Market Share by Type (2017-2022)
    • 5.2 Global Flip-Chip Package Substrate Revenue Market Share by Type (2017-2022)
    • 5.3 Global Flip-Chip Package Substrate Price by Type (2017-2022)

    6 Segment by Application

    • 6.1 Global Flip-Chip Package Substrate Production Market Share by Application (2017-2022)
    • 6.2 Global Flip-Chip Package Substrate Revenue Market Share by Application (2017-2022)
    • 6.3 Global Flip-Chip Package Substrate Price by Application (2017-2022)

    7 Key Companies Profiled

    • 7.1 Unimicron
    • 7.1.1 Unimicron Flip-Chip Package Substrate Corporation Information
  • 7.1.2 Unimicron Flip-Chip Package Substrate Product Portfolio
  • 7.1.3 Unimicron Flip-Chip Package Substrate Production, Revenue, Price and Gross Margin (2017-2022)
  • 7.1.4 Unimicron Main Business and Markets Served
  • 7.1.5 Unimicron Recent Developments/Updates
  • 7.2 Ibiden
  • 7.2.1 Ibiden Flip-Chip Package Substrate Corporation Information
  • 7.2.2 Ibiden Flip-Chip Package Substrate Product Portfolio
  • 7.2.3 Ibiden Flip-Chip Package Substrate Production, Revenue, Price and Gross Margin (2017-2022)
  • 7.2.4 Ibiden Main Business and Markets Served
  • 7.2.5 Ibiden Recent Developments/Updates
  • 7.3 Nan Ya PCB
  • 7.3.1 Nan Ya PCB Flip-Chip Package Substrate Corporation Information
  • 7.3.2 Nan Ya PCB Flip-Chip Package Substrate Product Portfolio
  • 7.3.3 Nan Ya PCB Flip-Chip Package Substrate Production, Revenue, Price and Gross Margin (2017-2022)
  • 7.3.4 Nan Ya PCB Main Business and Markets Served
  • 7.3.5 Nan Ya PCB Recent Developments/Updates
  • 7.4 Shiko Electric Industries
  • 7.4.1 Shiko Electric Industries Flip-Chip Package Substrate Corporation Information
  • 7.4.2 Shiko Electric Industries Flip-Chip Package Substrate Product Portfolio
  • 7.4.3 Shiko Electric Industries Flip-Chip Package Substrate Production, Revenue, Price and Gross Margin (2017-2022)
  • 7.4.4 Shiko Electric Industries Main Business and Markets Served
  • 7.4.5 Shiko Electric Industries Recent Developments/Updates
  • 7.5 AT&S
  • 7.5.1 AT&S Flip-Chip Package Substrate Corporation Information
  • 7.5.2 AT&S Flip-Chip Package Substrate Product Portfolio
  • 7.5.3 AT&S Flip-Chip Package Substrate Production, Revenue, Price and Gross Margin (2017-2022)
  • 7.5.4 AT&S Main Business and Markets Served
  • 7.5.5 AT&S Recent Developments/Updates
  • 7.6 Kinsus Interconnect Technology
  • 7.6.1 Kinsus Interconnect Technology Flip-Chip Package Substrate Corporation Information
  • 7.6.2 Kinsus Interconnect Technology Flip-Chip Package Substrate Product Portfolio
  • 7.6.3 Kinsus Interconnect Technology Flip-Chip Package Substrate Production, Revenue, Price and Gross Margin (2017-2022)
  • 7.6.4 Kinsus Interconnect Technology Main Business and Markets Served
  • 7.6.5 Kinsus Interconnect Technology Recent Developments/Updates
  • 7.7 Semco
  • 7.7.1 Semco Flip-Chip Package Substrate Corporation Information
  • 7.7.2 Semco Flip-Chip Package Substrate Product Portfolio
  • 7.7.3 Semco Flip-Chip Package Substrate Production, Revenue, Price and Gross Margin (2017-2022)
  • 7.7.4 Semco Main Business and Markets Served
  • 7.7.5 Semco Recent Developments/Updates
  • 7.8 Kyocera
  • 7.8.1 Kyocera Flip-Chip Package Substrate Corporation Information
  • 7.8.2 Kyocera Flip-Chip Package Substrate Product Portfolio
  • 7.8.3 Kyocera Flip-Chip Package Substrate Production, Revenue, Price and Gross Margin (2017-2022)
  • 7.8.4 Kyocera Main Business and Markets Served
  • 7.7.5 Kyocera Recent Developments/Updates
  • 7.9 TOPPAN
  • 7.9.1 TOPPAN Flip-Chip Package Substrate Corporation Information
  • 7.9.2 TOPPAN Flip-Chip Package Substrate Product Portfolio
  • 7.9.3 TOPPAN Flip-Chip Package Substrate Production, Revenue, Price and Gross Margin (2017-2022)
  • 7.9.4 TOPPAN Main Business and Markets Served
  • 7.9.5 TOPPAN Recent Developments/Updates
  • 7.10 Zhen Ding Technology
  • 7.10.1 Zhen Ding Technology Flip-Chip Package Substrate Corporation Information
  • 7.10.2 Zhen Ding Technology Flip-Chip Package Substrate Product Portfolio
  • 7.10.3 Zhen Ding Technology Flip-Chip Package Substrate Production, Revenue, Price and Gross Margin (2017-2022)
  • 7.10.4 Zhen Ding Technology Main Business and Markets Served
  • 7.10.5 Zhen Ding Technology Recent Developments/Updates
  • 7.11 Daeduck Electronics
  • 7.11.1 Daeduck Electronics Flip-Chip Package Substrate Corporation Information
  • 7.11.2 Daeduck Electronics Flip-Chip Package Substrate Product Portfolio
  • 7.11.3 Daeduck Electronics Flip-Chip Package Substrate Production, Revenue, Price and Gross Margin (2017-2022)
  • 7.11.4 Daeduck Electronics Main Business and Markets Served
  • 7.11.5 Daeduck Electronics Recent Developments/Updates
  • 7.12 ASE Material
  • 7.12.1 ASE Material Flip-Chip Package Substrate Corporation Information
  • 7.12.2 ASE Material Flip-Chip Package Substrate Product Portfolio
  • 7.12.3 ASE Material Flip-Chip Package Substrate Production, Revenue, Price and Gross Margin (2017-2022)
  • 7.12.4 ASE Material Main Business and Markets Served
  • 7.12.5 ASE Material Recent Developments/Updates
  • 7.13 ACCESS
  • 7.13.1 ACCESS Flip-Chip Package Substrate Corporation Information
  • 7.13.2 ACCESS Flip-Chip Package Substrate Product Portfolio
  • 7.13.3 ACCESS Flip-Chip Package Substrate Production, Revenue, Price and Gross Margin (2017-2022)
  • 7.13.4 ACCESS Main Business and Markets Served
  • 7.13.5 ACCESS Recent Developments/Updates
  • 8 Flip-Chip Package Substrate Manufacturing Cost Analysis

    • 8.1 Flip-Chip Package Substrate Key Raw Materials Analysis
    • 8.1.1 Key Raw Materials
  • 8.1.2 Key Suppliers of Raw Materials
  • 8.2 Proportion of Manufacturing Cost Structure
  • 8.3 Manufacturing Process Analysis of Flip-Chip Package Substrate
  • 8.4 Flip-Chip Package Substrate Industrial Chain Analysis
  • 9 Marketing Channel, Distributors and Customers

    • 9.1 Marketing Channel
    • 9.2 Flip-Chip Package Substrate Distributors List
    • 9.3 Flip-Chip Package Substrate Customers

    10 Market Dynamics

    • 10.1 Flip-Chip Package Substrate Industry Trends
    • 10.2 Flip-Chip Package Substrate Market Drivers
    • 10.3 Flip-Chip Package Substrate Market Challenges
    • 10.4 Flip-Chip Package Substrate Market Restraints

    11 Production and Supply Forecast

    • 11.1 Global Forecasted Production of Flip-Chip Package Substrate by Region (2023-2028)
    • 11.2 North America Flip-Chip Package Substrate Production, Revenue Forecast (2023-2028)
    • 11.3 Europe Flip-Chip Package Substrate Production, Revenue Forecast (2023-2028)
    • 11.4 China Flip-Chip Package Substrate Production, Revenue Forecast (2023-2028)
    • 11.5 Japan Flip-Chip Package Substrate Production, Revenue Forecast (2023-2028)
    • 11.6 South Korea Flip-Chip Package Substrate Production, Revenue Forecast (2023-2028)

    12 Consumption and Demand Forecast

    • 12.1 Global Forecasted Demand Analysis of Flip-Chip Package Substrate
    • 12.2 North America Forecasted Consumption of Flip-Chip Package Substrate by Country
    • 12.3 Europe Market Forecasted Consumption of Flip-Chip Package Substrate by Country
    • 12.4 Asia Pacific Market Forecasted Consumption of Flip-Chip Package Substrate by Region
    • 12.5 Latin America Forecasted Consumption of Flip-Chip Package Substrate by Country

    13 Forecast by Type and by Application (2023-2028)

    • 13.1 Global Production, Revenue and Price Forecast by Type (2023-2028)
    • 13.1.1 Global Forecasted Production of Flip-Chip Package Substrate by Type (2023-2028)
  • 13.1.2 Global Forecasted Revenue of Flip-Chip Package Substrate by Type (2023-2028)
  • 13.1.3 Global Forecasted Price of Flip-Chip Package Substrate by Type (2023-2028)
  • 13.2 Global Forecasted Consumption of Flip-Chip Package Substrate by Application (2023-2028)
  • 13.2.1 Global Forecasted Production of Flip-Chip Package Substrate by Application (2023-2028)
  • 13.2.2 Global Forecasted Revenue of Flip-Chip Package Substrate by Application (2023-2028)
  • 13.2.3 Global Forecasted Price of Flip-Chip Package Substrate by Application (2023-2028)
  • 14 Research Finding and Conclusion

      15 Methodology and Data Source

      • 15.1 Methodology/Research Approach
      • 15.1.1 Research Programs/Design
    • 15.1.2 Market Size Estimation
    • 15.1.3 Market Breakdown and Data Triangulation
    • 15.2 Data Source
    • 15.2.1 Secondary Sources
    • 15.2.2 Primary Sources
    • 15.3 Author List
    • Summary:
      Get latest Market Research Reports on Flip-Chip Package Substrate. Industry analysis & Market Report on Flip-Chip Package Substrate is a syndicated market report, published as Global Flip-Chip Package Substrate Market Research Report 2022. It is complete Research Study and Industry Analysis of Flip-Chip Package Substrate market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.

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