Global Flip Chip CSP (FCCSP) Package Market Research Report 2022

FCCSP (Flip Chip Chip Scale Package) offers chip scale capacity for I/Os around 200 or less. FCCSP provides better protection for chip and better solder joint reliability compared with direct chip attach (DCA) or chip on board (COB). FCCSP is more superior to known good die (KGD) in low-cost test and burn-in, and performs comparable electrical function with KGD. FCCSP features thin and small profile, and lightweight packages.
Industry Insights

Due to the COVID-19 pandemic, the global Flip Chip CSP (FCCSP) Package market size is estimated to be worth US$ million in 2022 and is forecast to a readjusted size of US$ million by 2028 with a CAGR of % during the forecast period 2022-2028. Fully considering the economic change by this health crisis, Bare Die Type accounting for % of the Flip Chip CSP (FCCSP) Package global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR from 2022 to 2028. While Auto and Transportation segment is altered to an % CAGR throughout this forecast period.

North America Flip Chip CSP (FCCSP) Package market is estimated at US$ million in 2021, while Europe is forecast to reach US$ million by 2028. The proportion of the North America is % in 2021, while Europe percentage is %, and it is predicted that Europe share will reach % in 2028, trailing a CAGR of % through the analysis period 2022-2028. As for the Asia, the notable markets are Japan and South Korea, CAGR is % and % respectively for the next 6-year period.

The global major manufacturers of Flip Chip CSP (FCCSP) Package include Amkor, Taiwan Semiconductor Manufacturing, ASE Group, Intel Corporation, JCET Group Co.,Ltd, Samsung Group, SPIL, Powertech Technology and Tongfu Microelectronics Co., Ltd, etc. In terms of revenue, the global 3 largest players have a % market share of Flip Chip CSP (FCCSP) Package in 2021.

Key Drivers & Barriers

The research report has incorporated the analysis of different factors that augment the market’s growth. It constitutes trends, restraints, and drivers that transform the market in either a positive or negative manner. This section also provides the scope of different segments and applications that can potentially influence the market in the future. The detailed information is based on current trends and historic milestones. This section also provides an analysis of the volume of production about the global market and about each type from 2017 to 2028. This section mentions the volume of production by region from 2017 to 2028. Pricing analysis is included in the report according to each type from the year 2017 to 2028, manufacturer from 2017 to 2022, region from 2017 to 2022, and global price from 2017 to 2028.

A thorough evaluation of the restrains included in the report portrays the contrast to drivers and gives room for strategic planning. Factors that overshadow the market growth are pivotal as they can be understood to devise different bends for getting hold of the lucrative opportunities that are present in the ever-growing market. Additionally, insights into market expert’s opinions have been taken to understand the market better.

Post-covid-19 Outlook

The readers in the section will understand how the Flip Chip CSP (FCCSP) Package market scenario changed across the globe during the pandemic and post-pandemic. The study is done keeping in view the changes in aspects such as production, demand, consumption, supply chain. The industry experts have also highlighted the key factors that will help create opportunities for players and stabilize the overall industry in the years to come.

Segmental Outlook

Key segments including type and application have been elaborated in this report. The consultants at QY Research have studied every segment and provided the market size using historical data. They have also talked about the growth opportunities that the segment may pose in the future. This study bestows production and revenue data by type and application during the historical period (2017-2022) and forecast period (2023-2028).

Segment by Type

Bare Die Type

Molded (CUF, MUF) Type

SiP Type

Hybrid (fcSCSP) Type

Others

Segment by Application

Auto and Transportation

Consumer Electronics

Communication

Others

Regional Outlook

This section of the report provides key insights regarding various regions and the key players operating in each region. Economic, social, environmental, technological, and political factors have been taken into consideration while assessing the growth of the particular region/country. The readers will also get their hands on the revenue and production data of each region and country for the period 2017-2028. This information derived through comprehensive research will help the reader to get familiar with the potential value of the investment in a particular region.

Production by Region

North America

Europe

China

Japan

South Korea

Consumption by Region

North America

United States

Canada

Europe

Germany

France

U.K.

Italy

Russia

Asia-Pacific

China

Japan

South Korea

India

Australia

China Taiwan

Indonesia

Thailand

Malaysia

Latin America

Mexico

Brazil

Argentina

Colombia

Competitive Scenario

In this section, the readers will gain an understanding of the key players competing. The experts at QY Research have studied the key growth strategies, such as innovative trends and developments, intensification of product portfolio, mergers and acquisitions, collaborations, new product innovation, and geographical expansion, undertaken by these participants to maintain their presence. Apart from business strategies, the study includes current developments and key financials. The readers will also get access to the data related to global revenue, price, and production by manufacturers for the period 2017-2022. This all-inclusive report will certainly serve the clients to stay updated and make effective decisions in their businesses. Some of the prominent players reviewed in the research report include:

Amkor

Taiwan Semiconductor Manufacturing

ASE Group

Intel Corporation

JCET Group Co.,Ltd

Samsung Group

SPIL

Powertech Technology

Tongfu Microelectronics Co., Ltd

Tianshui Huatian Technology Co., Ltd

United Microelectronics

SFA Semicon

Frequently Asked Questions

Which product segment grabbed the largest share in the Flip Chip CSP (FCCSP) Package market?

How is the competitive scenario of the Flip Chip CSP (FCCSP) Package market?

Which are the key factors aiding the Flip Chip CSP (FCCSP) Package market growth?

Which are the prominent players in the Flip Chip CSP (FCCSP) Package market?

Which region holds the maximum share in the Flip Chip CSP (FCCSP) Package market?

What will be the CAGR of the Flip Chip CSP (FCCSP) Package market during the forecast period?

Which application segment emerged as the leading segment in the Flip Chip CSP (FCCSP) Package market?

What key trends are likely to emerge in the Flip Chip CSP (FCCSP) Package market in the coming years?

What will be the Flip Chip CSP (FCCSP) Package market size by 2028?

Which company held the largest share in the Flip Chip CSP (FCCSP) Package market?