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Machinery & Equipment Global Flip Chip Bonder Market 2019 by Manufacturers, Regions, Type and Application, Forecast to 2024

  • RnM2982361
    • |
  • 19 February, 2019
    • |
  • Global
    • |
  • 117 Pages
    • |
  • GIR (Global Info Research)
    • |
  • Machinery & Equipment

Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made through conductive bumps placed on the surface of the die. The placing process amounts to the following:
1. Die is picked up and place on a "flipping device"
2. Die is "flipped" and moved to hover over the substrate (or board or carrier) where bumps reside-precisely positioned in their previously defined positions
3. The tool then places the die on the bump with a programmed amount of force
Flip chip bumping is a vital step to the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a "spacer" to prevent electrical shorts and provides mechanical support.
Flip chips avoid wire bonding and therefore are able to be much smaller than their counterparts. Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and cost benefits enabled by the flip chip assembly method.

Scope of the Report:
Flip Chip Bonder industry is relatively concentrated, manufacturers are mostly in the Europe, US and Asia. As for the downstream market, China sales accounted for more than 22.71% of the total sales of global Flip Chip Bonder in 2016. Besi is the world leading manufacturer in global Flip Chip Bonder market with the market share of 28.64%, in terms of revenue. China market is expected to be the biggest market with sales market share of 25.67% in 2022.
Despite the presence of competition problems, investors are still optimistic about this area, in future still more new investment will enter into the field. Technology and cost are two major problems.
Although sales of Flip Chip Bonder brought a lot of opportunities, for the new entrants with only advantage in capital without sufficient support in technology and downstream channels, the research group did not recommend taking risk enter this market.
The worldwide market for Flip Chip Bonder is expected to grow at a CAGR of roughly 13.1% over the next five years, will reach 510 million US$ in 2024, from 250 million US$ in 2019, according to a new GIR (Global Info Research) study.
This report focuses on the Flip Chip Bonder in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.

Market Segment by Manufacturers, this report covers
Besi
ASM Pacific Technology
Shibaura
Muehlbauer
Kulicke & Soffa
Hamni
AMICRA Microtechnologies
SET

Market Segment by Regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

Market Segment by Type, covers
Automatic Flip Chip Bonder
Semi-Automatic Flip Chip Bonder

Market Segment by Applications, can be divided into
IDMs
OSAT

The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Flip Chip Bonder product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Flip Chip Bonder, with price, sales, revenue and global market share of Flip Chip Bonder in 2017 and 2018.
Chapter 3, the Flip Chip Bonder competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Flip Chip Bonder breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2014 to 2019.
Chapter 5, 6, 7, 8 and 9, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2014 to 2019.
Chapter 10 and 11, to segment the sales by type and application, with sales market share and growth rate by type, application, from 2014 to 2019.
Chapter 12, Flip Chip Bonder market forecast, by regions, type and application, with sales and revenue, from 2019 to 2024.
Chapter 13, 14 and 15, to describe Flip Chip Bonder sales channel, distributors, customers, research findings and conclusion, appendix and data source.


Table of Contents

    1 Market Overview

    • 1.1 Flip Chip Bonder Introduction
    • 1.2 Market Analysis by Type
      • 1.2.1 Automatic Flip Chip Bonder
      • 1.2.2 Semi-Automatic Flip Chip Bonder
    • 1.3 Market Analysis by Applications
      • 1.3.1 IDMs
      • 1.3.2 OSAT
    • 1.4 Market Analysis by Regions
      • 1.4.1 North America (United States, Canada and Mexico)
        • 1.4.1.1 United States Market States and Outlook (2014-2024)
        • 1.4.1.2 Canada Market States and Outlook (2014-2024)
        • 1.4.1.3 Mexico Market States and Outlook (2014-2024)
      • 1.4.2 Europe (Germany, France, UK, Russia and Italy)
        • 1.4.2.1 Germany Market States and Outlook (2014-2024)
        • 1.4.2.2 France Market States and Outlook (2014-2024)
        • 1.4.2.3 UK Market States and Outlook (2014-2024)
        • 1.4.2.4 Russia Market States and Outlook (2014-2024)
        • 1.4.2.5 Italy Market States and Outlook (2014-2024)
      • 1.4.3 Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
        • 1.4.3.1 China Market States and Outlook (2014-2024)
        • 1.4.3.2 Japan Market States and Outlook (2014-2024)
        • 1.4.3.3 Korea Market States and Outlook (2014-2024)
        • 1.4.3.4 India Market States and Outlook (2014-2024)
        • 1.4.3.5 Southeast Asia Market States and Outlook (2014-2024)
      • 1.4.4 South America, Middle East and Africa
        • 1.4.4.1 Brazil Market States and Outlook (2014-2024)
        • 1.4.4.2 Egypt Market States and Outlook (2014-2024)
        • 1.4.4.3 Saudi Arabia Market States and Outlook (2014-2024)
        • 1.4.4.4 South Africa Market States and Outlook (2014-2024)
        • 1.4.4.5 Turkey Market States and Outlook (2014-2024)
    • 1.5 Market Dynamics
      • 1.5.1 Market Opportunities
      • 1.5.2 Market Risk
      • 1.5.3 Market Driving Force

    2 Manufacturers Profiles

    • 2.1 Besi
      • 2.1.1 Business Overview
      • 2.1.2 Flip Chip Bonder Type and Applications
        • 2.1.2.1 Product A
        • 2.1.2.2 Product B
      • 2.1.3 Besi Flip Chip Bonder Sales, Price, Revenue, Gross Margin and Market Share (2017-2018)
    • 2.2 ASM Pacific Technology
      • 2.2.1 Business Overview
      • 2.2.2 Flip Chip Bonder Type and Applications
        • 2.2.2.1 Product A
        • 2.2.2.2 Product B
      • 2.2.3 ASM Pacific Technology Flip Chip Bonder Sales, Price, Revenue, Gross Margin and Market Share (2017-2018)
    • 2.3 Shibaura
      • 2.3.1 Business Overview
      • 2.3.2 Flip Chip Bonder Type and Applications
        • 2.3.2.1 Product A
        • 2.3.2.2 Product B
      • 2.3.3 Shibaura Flip Chip Bonder Sales, Price, Revenue, Gross Margin and Market Share (2017-2018)
    • 2.4 Muehlbauer
      • 2.4.1 Business Overview
      • 2.4.2 Flip Chip Bonder Type and Applications
        • 2.4.2.1 Product A
        • 2.4.2.2 Product B
      • 2.4.3 Muehlbauer Flip Chip Bonder Sales, Price, Revenue, Gross Margin and Market Share (2017-2018)
    • 2.5 Kulicke & Soffa
      • 2.5.1 Business Overview
      • 2.5.2 Flip Chip Bonder Type and Applications
        • 2.5.2.1 Product A
        • 2.5.2.2 Product B
      • 2.5.3 Kulicke & Soffa Flip Chip Bonder Sales, Price, Revenue, Gross Margin and Market Share (2017-2018)
    • 2.6 Hamni
      • 2.6.1 Business Overview
      • 2.6.2 Flip Chip Bonder Type and Applications
        • 2.6.2.1 Product A
        • 2.6.2.2 Product B
      • 2.6.3 Hamni Flip Chip Bonder Sales, Price, Revenue, Gross Margin and Market Share (2017-2018)
    • 2.7 AMICRA Microtechnologies
      • 2.7.1 Business Overview
      • 2.7.2 Flip Chip Bonder Type and Applications
        • 2.7.2.1 Product A
        • 2.7.2.2 Product B
      • 2.7.3 AMICRA Microtechnologies Flip Chip Bonder Sales, Price, Revenue, Gross Margin and Market Share (2017-2018)
    • 2.8 SET
      • 2.8.1 Business Overview
      • 2.8.2 Flip Chip Bonder Type and Applications
        • 2.8.2.1 Product A
        • 2.8.2.2 Product B
      • 2.8.3 SET Flip Chip Bonder Sales, Price, Revenue, Gross Margin and Market Share (2017-2018)

    3 Global Flip Chip Bonder Sales, Revenue, Market Share and Competition by Manufacturer (2017-2018)

    • 3.1 Global Flip Chip Bonder Sales and Market Share by Manufacturer (2017-2018)
    • 3.2 Global Flip Chip Bonder Revenue and Market Share by Manufacturer (2017-2018)
    • 3.3 Market Concentration Rate
      • 3.3.1 Top 3 Flip Chip Bonder Manufacturer Market Share in 2018
      • 3.3.2 Top 6 Flip Chip Bonder Manufacturer Market Share in 2018
    • 3.4 Market Competition Trend

    4 Global Flip Chip Bonder Market Analysis by Regions

    • 4.1 Global Flip Chip Bonder Sales, Revenue and Market Share by Regions
      • 4.1.1 Global Flip Chip Bonder Sales and Market Share by Regions (2014-2019)
      • 4.1.2 Global Flip Chip Bonder Revenue and Market Share by Regions (2014-2019)
    • 4.2 North America Flip Chip Bonder Sales and Growth Rate (2014-2019)
    • 4.3 Europe Flip Chip Bonder Sales and Growth Rate (2014-2019)
    • 4.4 Asia-Pacific Flip Chip Bonder Sales and Growth Rate (2014-2019)
    • 4.5 South America Flip Chip Bonder Sales and Growth Rate (2014-2019)
    • 4.6 Middle East and Africa Flip Chip Bonder Sales and Growth Rate (2014-2019)

    5 North America Flip Chip Bonder by Country

    • 5.1 North America Flip Chip Bonder Sales, Revenue and Market Share by Country
      • 5.1.1 North America Flip Chip Bonder Sales and Market Share by Country (2014-2019)
      • 5.1.2 North America Flip Chip Bonder Revenue and Market Share by Country (2014-2019)
    • 5.2 United States Flip Chip Bonder Sales and Growth Rate (2014-2019)
    • 5.3 Canada Flip Chip Bonder Sales and Growth Rate (2014-2019)
    • 5.4 Mexico Flip Chip Bonder Sales and Growth Rate (2014-2019)

    6 Europe Flip Chip Bonder by Country

    • 6.1 Europe Flip Chip Bonder Sales, Revenue and Market Share by Country
      • 6.1.1 Europe Flip Chip Bonder Sales and Market Share by Country (2014-2019)
      • 6.1.2 Europe Flip Chip Bonder Revenue and Market Share by Country (2014-2019)
    • 6.2 Germany Flip Chip Bonder Sales and Growth Rate (2014-2019)
    • 6.3 UK Flip Chip Bonder Sales and Growth Rate (2014-2019)
    • 6.4 France Flip Chip Bonder Sales and Growth Rate (2014-2019)
    • 6.5 Russia Flip Chip Bonder Sales and Growth Rate (2014-2019)
    • 6.6 Italy Flip Chip Bonder Sales and Growth Rate (2014-2019)

    7 Asia-Pacific Flip Chip Bonder by Country

    • 7.1 Asia-Pacific Flip Chip Bonder Sales, Revenue and Market Share by Country
      • 7.1.1 Asia-Pacific Flip Chip Bonder Sales and Market Share by Country (2014-2019)
      • 7.1.2 Asia-Pacific Flip Chip Bonder Revenue and Market Share by Country (2014-2019)
    • 7.2 China Flip Chip Bonder Sales and Growth Rate (2014-2019)
    • 7.3 Japan Flip Chip Bonder Sales and Growth Rate (2014-2019)
    • 7.4 Korea Flip Chip Bonder Sales and Growth Rate (2014-2019)
    • 7.5 India Flip Chip Bonder Sales and Growth Rate (2014-2019)
    • 7.6 Southeast Asia Flip Chip Bonder Sales and Growth Rate (2014-2019)

    8 South America Flip Chip Bonder by Country

    • 8.1 South America Flip Chip Bonder Sales, Revenue and Market Share by Country
      • 8.1.1 South America Flip Chip Bonder Sales and Market Share by Country (2014-2019)
      • 8.1.2 South America Flip Chip Bonder Revenue and Market Share by Country (2014-2019)
    • 8.2 Brazil Flip Chip Bonder Sales and Growth Rate (2014-2019)
    • 8.3 Argentina Flip Chip Bonder Sales and Growth Rate (2014-2019)
    • 8.4 Colombia Flip Chip Bonder Sales and Growth Rate (2014-2019)

    9 Middle East and Africa Flip Chip Bonder by Countries

    • 9.1 Middle East and Africa Flip Chip Bonder Sales, Revenue and Market Share by Country
      • 9.1.1 Middle East and Africa Flip Chip Bonder Sales and Market Share by Country (2014-2019)
      • 9.1.2 Middle East and Africa Flip Chip Bonder Revenue and Market Share by Country (2014-2019)
    • 9.2 Saudi Arabia Flip Chip Bonder Sales and Growth Rate (2014-2019)
    • 9.3 Turkey Flip Chip Bonder Sales and Growth Rate (2014-2019)
    • 9.4 Egypt Flip Chip Bonder Sales and Growth Rate (2014-2019)
    • 9.5 Nigeria Flip Chip Bonder Sales and Growth Rate (2014-2019)
    • 9.6 South Africa Flip Chip Bonder Sales and Growth Rate (2014-2019)

    10 Global Flip Chip Bonder Market Segment by Type

    • 10.1 Global Flip Chip Bonder Sales, Revenue and Market Share by Type (2014-2019)
      • 10.1.1 Global Flip Chip Bonder Sales and Market Share by Type (2014-2019)
      • 10.1.2 Global Flip Chip Bonder Revenue and Market Share by Type (2014-2019)
    • 10.2 Automatic Flip Chip Bonder Sales Growth and Price
      • 10.2.1 Global Automatic Flip Chip Bonder Sales Growth (2014-2019)
      • 10.2.2 Global Automatic Flip Chip Bonder Price (2014-2019)
    • 10.3 Semi-Automatic Flip Chip Bonder Sales Growth and Price
      • 10.3.1 Global Semi-Automatic Flip Chip Bonder Sales Growth (2014-2019)
      • 10.3.2 Global Semi-Automatic Flip Chip Bonder Price (2014-2019)

    11 Global Flip Chip Bonder Market Segment by Application

    • 11.1 Global Flip Chip Bonder Sales Market Share by Application (2014-2019)
    • 11.2 IDMs Sales Growth (2014-2019)
    • 11.3 OSAT Sales Growth (2014-2019)

    12 Flip Chip Bonder Market Forecast (2019-2024)

    • 12.1 Global Flip Chip Bonder Sales, Revenue and Growth Rate (2019-2024)
    • 12.2 Flip Chip Bonder Market Forecast by Regions (2019-2024)
      • 12.2.1 North America Flip Chip Bonder Market Forecast (2019-2024)
      • 12.2.2 Europe Flip Chip Bonder Market Forecast (2019-2024)
      • 12.2.3 Asia-Pacific Flip Chip Bonder Market Forecast (2019-2024)
      • 12.2.4 South America Flip Chip Bonder Market Forecast (2019-2024)
      • 12.2.5 Middle East and Africa Flip Chip Bonder Market Forecast (2019-2024)
    • 12.3 Flip Chip Bonder Market Forecast by Type (2019-2024)
      • 12.3.1 Global Flip Chip Bonder Sales Forecast by Type (2019-2024)
      • 12.3.2 Global Flip Chip Bonder Market Share Forecast by Type (2019-2024)
    • 12.4 Flip Chip Bonder Market Forecast by Application (2019-2024)
      • 12.4.1 Global Flip Chip Bonder Sales Forecast by Application (2019-2024)
      • 12.4.2 Global Flip Chip Bonder Market Share Forecast by Application (2019-2024)

    13 Sales Channel, Distributors, Traders and Dealers

    • 13.1 Sales Channel
      • 13.1.1 Direct Marketing
      • 13.1.2 Indirect Marketing
      • 13.1.3 Marketing Channel Future Trend
    • 13.2 Distributors, Traders and Dealers

    14 Research Findings and Conclusion

      15 Appendix

      • 15.1 Methodology

      Summary:
      Get latest Market Research Reports on Flip Chip Bonder . Industry analysis & Market Report on Flip Chip Bonder is a syndicated market report, published as Global Flip Chip Bonder Market 2019 by Manufacturers, Regions, Type and Application, Forecast to 2024. It is complete Research Study and Industry Analysis of Flip Chip Bonder market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.

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