According to our (Global Info Research) latest study, the global Embedded SIMs (eSIM) market size was valued at US$ 1079 million in 2025 and is forecast to a readjusted size of US$ 1899 million by 2032 with a CAGR of 8.5% during review period.
eSIM (Embedded SIM) is a user identification technology that embeds the traditional SIM card directly into the device rather than as an independent removable component. The eSIM ICs is a hardware module that supports eSIM technology, allowing users to use mobile services by downloading and activating operator profiles without a physical SIM card.
Built to GSMA specifications, eSIM ICs incorporate secure elements for authentication, encryption, and remote provisioning, allowing users to switch carriers or service plans over the air. Found in smartphones, tablets, wearables, IoT devices, and connected vehicles, ESIM supports multiple profiles, enhances device design flexibility, and simplifies global connectivity management. In 2024, the shipment volume of eSIM ICs will be about 500 million pieces, with an average price of US$2 per piece.
The upstream of eSIM IC involves the design and fabrication of secure integrated circuits by semiconductor manufacturers, including the development of embedded SIM hardware, secure elements, operating systems, and cryptographic modules. This stage requires advanced foundry processes, secure IC packaging, and compliance with GSMA standards for remote SIM provisioning. The downstream encompasses device makers—such as smartphone, tablet, wearable, automotive, and IoT manufacturers—who integrate eSIM Module into their products, as well as mobile network operators and connectivity platforms that activate, manage, and remotely provision subscriber profiles. Further downstream, eSIM-enabled devices flow into consumer and industrial sectors where users benefit from flexible carrier switching, enhanced device miniaturization, and improved security. Together, the value chain links semiconductor innovation upstream with global connectivity services and mass-market device deployment downstream.
The eSIM market is evolving from a niche convenience feature into a foundational connectivity layer for consumer devices, automotive telematics and massive IoT — driven by demand for remote provisioning, smaller form factors, stronger security, and simplified logistics for device makers and operators. Key growth drivers are automotive OEMs standardizing on embedded UICCs for lifetime connectivity, the explosion of wearables and connected industrial sensors that benefit from zero-touch provisioning, and operators shifting business models toward subscription-based, multi-profile services; likewise, enterprises value the ability to manage fleets centrally (SM-DP+/SM-SR platforms). Obstacles remain: certification and GSMA-compliance overhead, operator commercial resistance in some markets, fragmentation of provisioning ecosystems, and the technical/organizational complexity of integrating eUICC, OTA platforms and lifecycle management. Two important technical trends shape the near future — iSIM (SIM functionality integrated into main SoCs) which pushes further miniaturization and cost down, and tighter convergence of eSIM with secure connectivity stacks and modem vendors (reducing BOM and integration pain). Regionally, adoption is fastest where regulators and operators support remote provisioning and where device segments (automotive, wearables) are concentrated; emerging markets lag where operator models and certification create barriers. For incumbents and new entrants alike the winning strategy is clear: invest in GSMA-compliant security, build strong operator and SM-DP partnerships, offer robust lifecycle management tools, and roadmap iSIM-capable solutions — because once provisioning and business models align, eSIM becomes a default connectivity choice rather than an optional feature.
This report is a detailed and comprehensive analysis for global Embedded SIMs (eSIM) market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Embedded SIMs (eSIM) market size and forecasts, in consumption value ($ Million), sales quantity (K Pcs), and average selling prices (US$/Pcs), 2021-2032
Global Embedded SIMs (eSIM) market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Pcs), and average selling prices (US$/Pcs), 2021-2032
Global Embedded SIMs (eSIM) market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Pcs), and average selling prices (US$/Pcs), 2021-2032
Global Embedded SIMs (eSIM) market shares of main players, shipments in revenue ($ Million), sales quantity (K Pcs), and ASP (US$/Pcs), 2021-2026
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Embedded SIMs (eSIM)
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Embedded SIMs (eSIM) market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include STMicroelectronics, NXP, Infineon, Thales Group, GCT Semiconductor, IDEMIA, Giesecke+Devrient, VALID, GCT Semiconductor, Workz (Trasna), etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Embedded SIMs (eSIM) market is split by Type and by Application. For the period 2021-2032, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
MFF2 Form-factor
WLCSP Form-factor
Others
Market segment by Speed
5G
4G/5G Compatible
Market segment by Market-oriented
M2M Market
Public Consumer Market
Market segment by Application
Consumer Electronics
Internet of Things
Automobile
Others
Major players covered
STMicroelectronics
NXP
Infineon
Thales Group
GCT Semiconductor
IDEMIA
Giesecke+Devrient
VALID
GCT Semiconductor
Workz (Trasna)
Unigroup Guoxin Microelectronics
HuaDa Semiconductor
Henghui Technology
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Embedded SIMs (eSIM) product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Embedded SIMs (eSIM), with price, sales quantity, revenue, and global market share of Embedded SIMs (eSIM) from 2021 to 2026.
Chapter 3, the Embedded SIMs (eSIM) competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Embedded SIMs (eSIM) breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2021 to 2032.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2021 to 2032.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2021 to 2026.and Embedded SIMs (eSIM) market forecast, by regions, by Type, and by Application, with sales and revenue, from 2027 to 2032.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Embedded SIMs (eSIM).
Chapter 14 and 15, to describe Embedded SIMs (eSIM) sales channel, distributors, customers, research findings and conclusion.
Summary:
Get latest Market Research Reports on Embedded SIMs (eSIM). Industry analysis & Market Report on Embedded SIMs (eSIM) is a syndicated market report, published as Global Embedded SIMs (eSIM) Market 2026 by Manufacturers, Regions, Type and Application, Forecast to 2032. It is complete Research Study and Industry Analysis of Embedded SIMs (eSIM) market, to understand, Market Demand, Growth, trends analysis and Factor Influencing market.